Ko; King Wai Kelwin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ko; King Wai Kelwin.The latest application filed is for "method and system for providing contact to a first polysilicon layer in a flash memory device".

Company Profile

0.8.5

Ko; King Wai Kelwin - San Jose CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method and system for providing contact to a first polysilicon layer in a flash memory device Grant 8,507,969 - Chang , et al. August 13, 2	2013-08-13
Method and system for providing contact to a first polysilicon layer in a flash memory device Grant 8,329,530 - Chang , et al. December 11, 2	2012-12-11
Method and System for Providing Contact to a First Polysilicon Layer in a Flash Memory Device App 20120302017 - CHANG; Mark S. ; et al.	2012-11-29
Method and system for providing contact to a first polysilicon layer in a flash memory device Grant 8,183,619 - Chang , et al. May 22, 2	2012-05-22
Method and system for improving the topography of a memory array Grant 7,226,839 - Ko , et al. June 5, 2	2007-06-05
Void-free interlayer dielectric (ILD0) for 0.18-micron flash memory semiconductor device Grant 6,627,973 - Ngo , et al. September 30, 2	2003-09-30
Method and system for providing a robust alignment mark at thin oxide layers Grant 6,603,211 - Templeton , et al. August 5, 2	2003-08-05
Method and system for etching tunnel oxide to reduce undercutting during memory array fabrication Grant 6,472,327 - Ko , et al. October 29, 2	2002-10-29
Method and system for etching tunnel oxide to reduce undercutting during memory array fabrication App 20020028583 - Ko, King Wai Kelwin ; et al.	2002-03-07
Method and system for providing a robust alignment mark at thin oxide layers App 20020011678 - Templeton, Michael K. ; et al.	2002-01-31
Silicon Oxynitride Arc For Metal Patterning App 20010045646 - SHIELDS, JEFFREY A. ; et al.	2001-11-29
Method of reducing stress corrosion induced voiding of patterned metal layers App 20010007791 - Ngo, Minh Van ; et al.	2001-07-12

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