| Patent | Date |
|---|
Display Module Inspection Device And Display Module Inspection Method
App 20220206049 - KANG; BONGIL ; et al. | 2022-06-30 |
Display Device
App 20220206631 - KANG; BONGIL ; et al. | 2022-06-30 |
Flexible display device including touch sensor
Grant 11,372,450 - Ko , et al. June 28, 2 | 2022-06-28 |
Pressure sensor and display device including the same
Grant 10,949,046 - Lee , et al. March 16, 2 | 2021-03-16 |
Sensor, touch sensor, and display device
Grant 10,747,345 - Ko , et al. A | 2020-08-18 |
Flexible Display Device Including Touch Sensor
App 20200209927 - KO; Jun-Young ; et al. | 2020-07-02 |
Flexible display device including touch sensor
Grant 10,671,122 - Ko , et al. | 2020-06-02 |
Flexible display device including touch sensor
Grant 10627865 - | 2020-04-21 |
Touch sensing display device
Grant 10,572,039 - Kim , et al. Feb | 2020-02-25 |
Touch sensor
Grant 10,534,467 - Ko , et al. January 14, 2 | 2020-01-14 |
Flat panel lighting apparatus
Grant 10,048,433 - Kim , et al. August 14, 2 | 2018-08-14 |
Non-volatile memory device and programming method thereof
Grant 10,008,270 - Lee , et al. June 26, 2 | 2018-06-26 |
Memory device, memory system, and read/verify operation method of the memory device
Grant 9,978,458 - Lee , et al. May 22, 2 | 2018-05-22 |
Pressure Sensor And Display Device Including The Same
App 20180018039 - LEE; KYUNG SU ; et al. | 2018-01-18 |
Touch Sensor
App 20180011582 - KO; Jun Young ; et al. | 2018-01-11 |
Flexible Display Device Including Touch Sensor
App 20170315590 - KO; Jun-Young ; et al. | 2017-11-02 |
Flat Panel Lighting Apparatus
App 20170299801 - KIM; Min Chul ; et al. | 2017-10-19 |
Non-volatile Memory Device And Programming Method Thereof
App 20170287561 - LEE; YO-HAN ; et al. | 2017-10-05 |
Memory Device, Memory System, And Read/verify Operation Method Of The Memory Device
App 20170278579 - LEE; YO-HAN ; et al. | 2017-09-28 |
Printed circuit board and semiconductor package using the same
Grant 9,748,193 - Kim , et al. August 29, 2 | 2017-08-29 |
Touch display device and driving method thereof
Grant 9,727,192 - Kim , et al. August 8, 2 | 2017-08-08 |
Sensor, Touch Sensor, And Display Device
App 20170220162 - KO; Jun Young ; et al. | 2017-08-03 |
Flexible display device including touch sensor
Grant 9,720,449 - Ko , et al. August 1, 2 | 2017-08-01 |
Touch Sensing Display Device
App 20170205924 - KIM; Tae-Joon ; et al. | 2017-07-20 |
LED bulb using heat dissipating LED driver
Grant 9,581,319 - Kim , et al. February 28, 2 | 2017-02-28 |
Flat panel display with integrated touch screen panel
Grant 9,430,101 - Ko , et al. August 30, 2 | 2016-08-30 |
Touch Display Device And Driving Method Thereof
App 20160216798 - KIM; Hyun-Sik ; et al. | 2016-07-28 |
Method of fabricating semiconductor package
Grant 9,305,899 - Park , et al. April 5, 2 | 2016-04-05 |
Magazine And Process Equipment Including The Same
App 20160086828 - Hwang; Yi-sung ; et al. | 2016-03-24 |
Test apparatus for semiconductor package
Grant 9,255,959 - Kwon , et al. February 9, 2 | 2016-02-09 |
System For Manufacturing A Semiconductor Package And Method Of Manufacturing The Same
App 20160005654 - SONG; Yoon-Seok ; et al. | 2016-01-07 |
Printed Circuit Board And Semiconductor Package Using The Same
App 20160007459 - KIM; Young-ja ; et al. | 2016-01-07 |
Led Bulb Using Heat Dissipating Led Driver
App 20150377471 - KIM; Won ; et al. | 2015-12-31 |
Apparatus for inspecting touch panel and method thereof
Grant 9,207,273 - Ko December 8, 2 | 2015-12-08 |
Method of molding semiconductor package
Grant 9,184,065 - Ko , et al. November 10, 2 | 2015-11-10 |
Method Of Fabricating Semiconductor Package
App 20150179625 - PARK; Jae-Yong ; et al. | 2015-06-25 |
Flexible Display Device Including Touch Sensor
App 20150153779 - KO; Jun-Young ; et al. | 2015-06-04 |
Method Of Molding Semiconductor Package
App 20150118798 - Ko; Jun-young ; et al. | 2015-04-30 |
Methods of fabricating semiconductor devices and underfill equipment for the same
Grant 8,956,923 - Kim , et al. February 17, 2 | 2015-02-17 |
Method of molding semiconductor package
Grant 8,956,921 - Ko , et al. February 17, 2 | 2015-02-17 |
Method Of Fabricating Semiconductor Package
App 20140242752 - PARK; Jae-Yong ; et al. | 2014-08-28 |
Apparatus For Inspecting Touch Panel And Method Thereof
App 20140197845 - KO; Jun-Young | 2014-07-17 |
Test Apparatus For Semiconductor Package
App 20140062496 - KWON; Chan-Sik ; et al. | 2014-03-06 |
Methods Of Fabricating Semiconductor Devices And Underfill Equipment For The Same
App 20130337616 - KIM; Young-Ja ; et al. | 2013-12-19 |
Printed Circuit Board And Memory Module Comprising The Same
App 20130223001 - Ryu; Hwang-bok ; et al. | 2013-08-29 |
Method Of Molding Semiconductor Package
App 20130203220 - Ko; Jun-young ; et al. | 2013-08-08 |
Semiconductor package
Grant 8,482,133 - Ko , et al. July 9, 2 | 2013-07-09 |
Method of molding semiconductor package
Grant 8,420,450 - Ko , et al. April 16, 2 | 2013-04-16 |
Display Apparatus And Method Of Manufacturing The Same
App 20120244367 - Han; Kwanyoung ; et al. | 2012-09-27 |
Flat Panel Display With Integrated Touch Screen Panel
App 20120105344 - KO; Jun-Young ; et al. | 2012-05-03 |
Semiconductor Package
App 20120049365 - Ko; Jun-young ; et al. | 2012-03-01 |
Method Of Molding Semiconductor Package
App 20110318887 - Ko; Jun-young ; et al. | 2011-12-29 |
Printed circuit board and method thereof and a solder ball land and method thereof
Grant 8,039,972 - Jung , et al. October 18, 2 | 2011-10-18 |
Stack-type semiconductor device having chips having different backside structure and electronic apparatus including the same
App 20110110062 - Park; Jae-yong ; et al. | 2011-05-12 |
Method of cutting a wafer
Grant 7,863,161 - Chan , et al. January 4, 2 | 2011-01-04 |
Semiconductor package, semiconductor package module including the semiconductor package, and methods of fabricating the same
Grant 7,745,932 - Ko , et al. June 29, 2 | 2010-06-29 |
Method of manufacturing semiconductor package using redistribution substrate
Grant 7,713,788 - Ko , et al. May 11, 2 | 2010-05-11 |
Semiconductor device having pillar-shaped terminal
Grant 7,696,615 - Ko , et al. April 13, 2 | 2010-04-13 |
Printed circuit board and method thereof and a solder ball land and method thereof
App 20090278249 - Jung; Ky-hyun ; et al. | 2009-11-12 |
Wafer grinding and tape attaching apparatus and method
Grant 7,591,714 - Ko , et al. September 22, 2 | 2009-09-22 |
Printed circuit board and method thereof and a solder ball land and method thereof
Grant 7,576,438 - Jung , et al. August 18, 2 | 2009-08-18 |
Method Of Manufacturing Semiconductor Package Using Redistribution Substrate
App 20090053858 - KO; Jun-Young ; et al. | 2009-02-26 |
Semiconductor package, semiconductor package module including the semiconductor package, and methods of fabricating the same
App 20080315408 - Ko; Jun-young ; et al. | 2008-12-25 |
Method Of Cutting A Wafer
App 20080311727 - CHAN; Dae-Sang ; et al. | 2008-12-18 |
Apparatus and method for testing semiconductor chip
Grant 7,420,382 - Ko , et al. September 2, 2 | 2008-09-02 |
Fixing Apparatus For Semiconductor Wafer
App 20080070382 - CHAN; Dae-Sang ; et al. | 2008-03-20 |
Substrate For Semiconductor Package And Method Of Manufacturing The Same
App 20080061434 - JUNG; Ky-Hyun ; et al. | 2008-03-13 |
Semiconductor Device And Method Of Forming The Same
App 20080012116 - KO; Jun-Young ; et al. | 2008-01-17 |
Apparatus and method for separating a semiconductor chip
App 20070193920 - Ko; Jun-young ; et al. | 2007-08-23 |
Wafer grinding and tape attaching apparatus and method
App 20070099550 - Ko; Jun-Young ; et al. | 2007-05-03 |
Method of fabricating wafer chips
App 20070057410 - Chan; Dae-sang ; et al. | 2007-03-15 |
Printed circuit board and method thereof and a solder ball land and method thereof
App 20070040282 - Jung; Ky-hyun ; et al. | 2007-02-22 |
Wire bonding method and device of performing the same
App 20070023487 - Ko; Jun-young ; et al. | 2007-02-01 |
Apparatus and method for testing semiconductor chip
App 20060119375 - Ko; Jun-Young ; et al. | 2006-06-08 |
| 