Ko; Jeng-Dar

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ko; Jeng-Dar.The latest application filed is for "wafer leveled chip packaging structure and method thereof".

Company Profile

0.9.8

Ko; Jeng-Dar - Pade TW
Ko; Jeng-Dar - Pade City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electrically stackable semiconductor wafer and chip packages Grant 9,601,474 - Chen , et al. March 21, 2	2017-03-21
Wafer Leveled Chip Packaging Structure and Method Thereof App 20150364457 - Chen; Shou-Lung ; et al.	2015-12-17
Wafer leveled chip packaging structure and method thereof Grant 9,059,181 - Chen , et al. June 16, 2	2015-06-16
Wafer Leveled Chip Packaging Structure and Method Thereof App 20140217587 - Chen; Shou-Lung ; et al.	2014-08-07
Wafer-leveled chip packaging structure and method thereof Grant 8,587,091 - Chen , et al. November 19, 2	2013-11-19
Semiconductor package device Grant 8,314,482 - Chen , et al. November 20, 2	2012-11-20
Wafer-leveled Chip Packaging Structure And Method Thereof App 20120267765 - CHEN; Shou-Lung ; et al.	2012-10-25
Electronic device package and method of manufacturing the same Grant 7,838,333 - Chen , et al. November 23, 2	2010-11-23
Electronic Device Package And Method Of Manufacturing The Same App 20100112757 - CHEN; Shou-Lung ; et al.	2010-05-06
Electronic device package and method of manufacturing the same Grant 7,632,707 - Chen , et al. December 15, 2	2009-12-15
Wafer-leveled chip packaging structure and method thereof Grant 7,528,009 - Chen , et al. May 5, 2	2009-05-05
Wafer-leveled chip packaging structure and method thereof App 20080029870 - Chen; Shou-Lung ; et al.	2008-02-07
Wafer-leveled chip packaging structure and method thereof Grant 7,294,920 - Chen , et al. November 13, 2	2007-11-13
Wafer-leveled chip packaging structure and method thereof App 20070197018 - Chen; Shou-Lung ; et al.	2007-08-23
Electronic device package and method of manufacturing the same App 20060157864 - Chen; Shou-Lung ; et al.	2006-07-20
Wafer-leveled chip packaging structure and method thereof App 20060019484 - Chen; Shou-Lung ; et al.	2006-01-26

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