KO; Cheng-Yuan

Patent Applications and Registrations

Patent applications and USPTO patent grants for KO; Cheng-Yuan.The latest application filed is for "titanium dioxide containing ruthenium chemical mechanical polishing slurry".

Company Profile

4.3.11

KO; Cheng-Yuan - Kaohsiung City TW
Ko; Cheng-Yuan - New Taipei TW
KO; Cheng-Yuan - New Taipei City TW
KO; Cheng-Yuan - Aurora IL
Ko; Cheng-Yuan - Taipei TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Cmp Composition Including Anionic And Cationic Inhibitors App 20220033682 - WU; Hsin-Yen ; et al.	2022-02-03
Titanium Dioxide Containing Ruthenium Chemical Mechanical Polishing Slurry App 20220033683 - Jhang; Jin-Hao ; et al.	2022-02-03
Additives To Improve Particle Dispersion For Cmp Slurry App 20200308451 - LEE; Yang-Yao ; et al.	2020-10-01
Oxidizer Free Slurry For Ruthenium Cmp App 20200181454 - KO; Cheng-Yuan ; et al.	2020-06-11
Composition And Method For Polishing Silicon Carbide App 20190241783 - IVANOV; Roman ; et al.	2019-08-08
Composition and method for polishing silicon carbide Grant 10,294,399 - Ivanov , et al.	2019-05-21
Cleaning composition following CMP and methods related thereto Grant 10,100,272 - Ivanov , et al. October 16, 2	2018-10-16
Composition And Method For Polishing Silicon Carbide App 20180190506 - IVANOV; Roman ; et al.	2018-07-05
Cleaning composition and method for cleaning semiconductor wafers after CMP Grant 9,828,574 - Ivanov , et al. November 28, 2	2017-11-28
Stabilization Of Tris(2 Hydroxyethyl)methylammonium Hydroxide Against Decomposition With Dialkyhydroxylamine App 20170158993 - IVANOV; Roman ; et al.	2017-06-08
Cleaning Composition Following Cmp And Methods Related Thereto App 20170158992 - IVANOV; Roman ; et al.	2017-06-08
Cleaning Composition And Method For Cleaning Semiconductor Wafers After Cmp App 20160201016 - Ivanov; Roman ; et al.	2016-07-14
Aqueous Cleaning Composition For Post Copper Chemical Mechanical Planarization App 20140264151 - KO; Cheng-Yuan	2014-09-18
System And Method Of Viewer Centric Depth Adjustment App 20140063206 - Chen; Liang-Gee ; et al.	2014-03-06

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