Ko; ChanHoon

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ko; ChanHoon.The latest application filed is for "integrated circuit packaging system with redistribution layer and method of manufacture thereof".

Company Profile

0.8.6

Ko; ChanHoon - Incheon N/A KR
Ko; ChanHoon - Ichon si N/A KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated circuit packaging system with redistribution layer and method of manufacture thereof Grant 9,054,098 - Cho , et al. June 9, 2	2015-06-09
Integrated circuit packaging system with package on package support and method of manufacture thereof Grant 8,530,277 - Ko , et al. September 10, 2	2013-09-10
Integrated circuit package system with embedded die superstructure and method of manufacture thereof Grant 8,455,300 - Chi , et al. June 4, 2	2013-06-04
Integrated Circuit Packaging System With Redistribution Layer And Method Of Manufacture Thereof App 20130049208 - Cho; NamJu ; et al.	2013-02-28
Integrated Circuit Packaging System With Package On Package Support And Method Of Manufacture Thereof App 20120319284 - Ko; ChanHoon ; et al.	2012-12-20
Semiconductor packaging system with multipart conductive pillars and method of manufacture thereof Grant 8,304,296 - Ko , et al. November 6, 2	2012-11-06
Integrated circuit packaging system with multipart conductive pillars and method of manufacture thereof Grant 8,217,502 - Ko July 10, 2	2012-07-10
Semiconductor Packaging System With Multipart Conductive Pillars And Method Of Manufacture Thereof App 20110316155 - Ko; ChanHoon ; et al.	2011-12-29
Integrated Circuit Packaging System With Multipart Conductive Pillars And Method Of Manufacture Thereof App 20110298125 - Ko; ChanHoon	2011-12-08
Integrated Circuit Package System With Embedded Die Superstructure And Method Of Manufacture Thereof App 20110291283 - Chi; HeeJo ; et al.	2011-12-01

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