Ko; Chang-Yen
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ko; Chang-Yen.The latest application filed is for "electronic device having inverted lead pins".
- Ko; Chang-Yen - Taipei TW
- Ko; Chang-Yen - Taipei City TW
- Ko; Chang-Yen - New Taipei City TW
- Ko; Chang-Yen - New Taipei TW
| Patent | Date |
|---|---|
| Packaged electronic device with split die pad in robust package substrate Grant 11,444,012 - Chien , et al. September 13, 2 | 2022-09-13 |
| Floated singulation Grant 11,437,303 - Ko , et al. September 6, 2 | 2022-09-06 |
| Electronic Device Having Inverted Lead Pins App 20220068790 - Ko; Chang-Yen ; et al. | 2022-03-03 |
| Electronic device having inverted lead pins Grant 11,183,450 - Ko , et al. November 23, 2 | 2021-11-23 |
| Packaged Electronic Device With Split Die Pad In Robust Package Substrate App 20210305139 - Chien; Yuh-Harng ; et al. | 2021-09-30 |
| Microelectronic Device With Floating Pads App 20210082794 - Ko; Chang-Yen ; et al. | 2021-03-18 |
| Microelectronic device with floating pads Grant 10,854,538 - Ko , et al. December 1, 2 | 2020-12-01 |
| Electronic Device Having Inverted Lead Pins App 20200294906 - Ko; Chang-Yen ; et al. | 2020-09-17 |
| Floated Singulation App 20200258819 - A1 | 2020-08-13 |
| Microelectronic Device With Floating Pads App 20200258820 - A1 | 2020-08-13 |
| Electronic device having inverted lead pins Grant 10,714,418 - Ko , et al. | 2020-07-14 |
| Leadframe For Multichip Devices With Thinned Die Pad Portions App 20200211934 - KO; CHANG-YEN | 2020-07-02 |
| Edge Bend for Isolation Packages App 20200118899 - Tellkamp; John Paul ; et al. | 2020-04-16 |
| Dam Laminate Isolation Substrate App 20190385899 - Ko; Chang-Yen ; et al. | 2019-12-19 |
| Electronic Device Having Inverted Lead Pins App 20190295939 - KO; CHANG-YEN ; et al. | 2019-09-26 |
| Dam laminate isolation substrate Grant 10,395,971 - Ko , et al. A | 2019-08-27 |
| Dam Laminate Isolation Substrate App 20190198383 - KO; Chang-Yen ; et al. | 2019-06-27 |
| Edge Bend for Isolation Packages App 20190109061 - Tellkamp; John Paul ; et al. | 2019-04-11 |
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