Ko; Chan Hoon

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ko; Chan Hoon.The latest application filed is for "printed circuit board and electronic component package".

Company Profile

0.8.9

Ko; Chan Hoon - Suwon-si KR
Ko; Chan Hoon - Incheon KR
Ko; Chan Hoon - Ichon si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Printed Circuit Board And Electronic Component Package App 20220192017 - Ko; Chan Hoon	2022-06-16
Printed Circuit Board And Electronic Component Package App 20220189865 - KO; Chan Hoon	2022-06-16
Printed Circuit Board App 20220181245 - KO; Chan Hoon ; et al.	2022-06-09
Integrated circuit packaging system having dual sided connection and method of manufacture thereof Grant 8,906,740 - Ko , et al. December 9, 2	2014-12-09
Integrated circuit package-on-package system with underfilling structures and method of manufacture thereof Grant 8,535,981 - Ko , et al. September 17, 2	2013-09-17
Integrated Circuit Package-on-package System With Underfilling Structures And Method Of Manufacture Thereof App 20120228753 - Ko; Chan Hoon ; et al.	2012-09-13
System for solder ball inner stacking module connection Grant 8,067,828 - Ko , et al. November 29, 2	2011-11-29
Integrated circuit packaging system with interposer and method of manufacture thereof Grant 8,004,073 - Ko , et al. August 23, 2	2011-08-23
Integrated Circuit Packaging System Having Dual Sided Connection And Method Of Manufacture Thereof App 20110186994 - Ko; Chan Hoon ; et al.	2011-08-04
Integrated circuit packaging system with package-on-package and method of manufacture thereof Grant 7,968,995 - Ko , et al. June 28, 2	2011-06-28
Integrated circuit packaging system having dual sided connection and method of manufacture thereof Grant 7,923,290 - Ko , et al. April 12, 2	2011-04-12
Integrated Circuit Packaging System With Interposer And Method Of Manufacture Thereof App 20100320619 - Ko; Chan Hoon ; et al.	2010-12-23
Integrated Circuit Packaging System With Package-on-package And Method Of Manufacture Thereof App 20100314736 - Ko; Chan Hoon ; et al.	2010-12-16
Integrated Circuit Packaging System Having Dual Sided Connection And Method Of Manufacture Thereof App 20100244221 - Ko; Chan Hoon ; et al.	2010-09-30
System For Solder Ball Inner Stacking Module Connection App 20090230532 - Ko; Chan Hoon ; et al.	2009-09-17

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.