Knouff; Brian J.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Knouff; Brian J..The latest application filed is for "leaf spring end mount interface".
- Knouff; Brian J. - Dayton OH
- Knouff; Brian J. - Akron OH
- Knouff; Brian J. - Massillon OH
| Patent | Date |
|---|---|
| Composite spring with resilient attachment interface Grant 7,722,065 - Platner , et al. May 25, 2 | 2010-05-25 |
| Leaf Spring End Mount Interface App 20090115157 - Platner; David K. ; et al. | 2009-05-07 |
| Composite Spring With Resilient Attachment Interface App 20080252033 - Platner; David K. ; et al. | 2008-10-16 |
| Flexible Fiber Reinforced Composite Rebar App 20080141614 - Knouff; Brian J. ; et al. | 2008-06-19 |
| Composite spring with bushing attachment App 20080128968 - Platner; David K. ; et al. | 2008-06-05 |
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