Knickerbocker; John Ulrich

Patent Applications and Registrations

Patent applications and USPTO patent grants for Knickerbocker; John Ulrich.The latest application filed is for "silicon carrier space transformer and temporary chip attach burn-in vehicle for high density connections".

Company Profile

1.36.29

Knickerbocker; John Ulrich - Monroe NY US
Knickerbocker; John Ulrich - Hopewell Junction NY
Knickerbocker; John Ulrich - Wappingers Falls NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Silicon carrier space transformer and temporary chip attach burn-in vehicle for high density connections Grant 9,159,616 - Hamel , et al. October 13, 2	2015-10-13
Silicon Carrier Space Transformer And Temporary Chip Attach Burn-in Vehicle For High Density Connections App 20140235027 - Hamel; Harvey ; et al.	2014-08-21
Method for forming integrated circuit assembly Grant 8,689,437 - Dang , et al. April 8, 2	2014-04-08
Techniques for modular chip fabrication Grant 8,629,562 - Caron , et al. January 14, 2	2014-01-14
Silicon based microchannel cooling and electrical package Grant 8,581,392 - Knickerbocker , et al. November 12, 2	2013-11-12
Silicon Based Microchannel Cooling And Electrical Package App 20130092938 - Knickerbocker; John Ulrich ; et al.	2013-04-18
Silicon based microchannel cooling and electrical package Grant 8,421,220 - Knickerbocker , et al. April 16, 2	2013-04-16
Small area, robust silicon via structure and process Grant 8,354,737 - Andry , et al. January 15, 2	2013-01-15
Techniques for Modular Chip Fabrication App 20120326321 - Caron; Alain ; et al.	2012-12-27
Silicon Carrier Structure And Method Of Forming Same App 20120301977 - Andry; Paul Stephen ; et al.	2012-11-29
Silicon carrier space transformer and temporary chip attach burn-in vehicle for high density connections Grant 8,310,259 - Hamel , et al. November 13, 2	2012-11-13
Silicon carrier structure and method of forming same Grant 8,295,056 - Andry , et al. October 23, 2	2012-10-23
Techniques for modular chip fabrication Grant 8,288,866 - Caron , et al. October 16, 2	2012-10-16
Silicon Carrier Space Transformer And Temporary Chip Attach Burn-in Vehicle For High Density Connections App 20120249173 - HAMEL; HARVEY ; et al.	2012-10-04
Method of testing using a temporary chip attach carrier Grant 8,213,184 - Knickerbocker July 3, 2	2012-07-03
Silicon Based Microchannel Cooling And Electrical Package App 20120133051 - Knickerbocker; John Ulrich ; et al.	2012-05-31
Interconnection in multi-chip with interposers and bridges Grant 8,138,015 - Joseph , et al. March 20, 2	2012-03-20
Method and apparatus for depositing coplanar microelectronic interconnectors using a compliant mold Grant 8,117,982 - Gruber , et al. February 21, 2	2012-02-21
Silicon based microchannel cooling and electrical package Grant 8,110,415 - Knickerbocker , et al. February 7, 2	2012-02-07
Interconnection In Multi-chip With Interposers And Bridges App 20110312129 - Joseph; Douglas James ; et al.	2011-12-22
Bridges for interconnecting interposers in multi-chip integrated circuits Grant 8,008,764 - Joseph , et al. August 30, 2	2011-08-30
Techniques for Modular Chip Fabrication App 20110121456 - Caron; Alain ; et al.	2011-05-26
Small Area, Robust Silicon Via Structure And Process App 20110095428 - Andry; Paul S. ; et al.	2011-04-28
Small area, robust silicon via structure and process Grant 7,902,069 - Andry , et al. March 8, 2	2011-03-08
Techniques for modular chip fabrication Grant 7,892,885 - Caron , et al. February 22, 2	2011-02-22
Silicon Carrier Structure and Method of Forming Same App 20110019368 - Andry; Paul Stephen ; et al.	2011-01-27
Methods for fabricating silicon carriers with conductive through-vias with low stress and low defect density Grant 7,863,189 - Basker , et al. January 4, 2	2011-01-04
Integrated Circuit Assembly App 20100326702 - Dang; Bing ; et al.	2010-12-30
Versatile Si-based packaging with integrated passive components for mmWave applications Grant 7,808,798 - Cotte , et al. October 5, 2	2010-10-05
Integrated module for data processing system Grant 7,750,459 - Dang , et al. July 6, 2	2010-07-06
Modular chip integration techniques Grant 7,741,153 - Caron , et al. June 22, 2	2010-06-22
Method and apparatus for depositing coplanar microelectronic interconnectors using a compliant mold Grant 7,713,575 - Gruber , et al. May 11, 2	2010-05-11
Method And Apparatus For Depositing Coplanar Microelectronic Interconnectors Using A Compliant Mold App 20090308308 - Gruber; Peter A. ; et al.	2009-12-17
Method for precision assembly of integrated circuit chip packages Grant 7,615,405 - Andry , et al. November 10, 2	2009-11-10
Bridges For Interconnecting Interposers In Multi-chip Integrated Circuits App 20090267238 - Joseph; Douglas James ; et al.	2009-10-29
Silicon Based Microchannel Cooling And Electrical Package App 20090251862 - Knickerbocker; John Ulrich ; et al.	2009-10-08
Integrated Module For Data Processing System App 20090194864 - Dang; Bing ; et al.	2009-08-06
Techniques for Modular Chip Fabrication App 20090108427 - Caron; Alain ; et al.	2009-04-30
Modular Chip Integration Techniques App 20090111215 - Caron; Alain ; et al.	2009-04-30
Versatile Si-based packaging with integrated passive components for mmWave applications Grant 7,518,229 - Cotte , et al. April 14, 2	2009-04-14
Chip-to-wafer integration technology for three-dimensional chip stacking Grant 7,514,290 - Sakuma , et al. April 7, 2	2009-04-07
Methods and Apparatus for Assembling Integrated Circuit Device Utilizing a Thin Si Interposer App 20090085202 - Dang; Bing ; et al.	2009-04-02
Method Of Testing Using A Temporary Chip Attach Carrier App 20090079454 - Knickerbocker; John Ulrich	2009-03-26
Apparatus and methods for constructing balanced chip packages to reduce thermally induced mechanical strain Grant 7,504,718 - Gaynes , et al. March 17, 2	2009-03-17
Small Area, Robust Silicon Via Structure and Process App 20090032951 - Andry; Paul S. ; et al.	2009-02-05
Temporary chip attach carrier Grant 7,486,525 - Knickerbocker February 3, 2	2009-02-03
Temporary Chip Attach Carrier App 20080285244 - Knickerbocker; John Ulrich	2008-11-20
VERSATILE Si-BASED PACKAGING WITH INTEGRATED PASSIVE COMPONENTS FOR mmWAVE APPLICATIONS App 20080186247 - Cotte; John Michael ; et al.	2008-08-07
Method For Precision Assembly Of Integrated Circuit Chip Packages App 20080182362 - Andry; Paul Stephen ; et al.	2008-07-31
Methods For Fabricating Silicon Carriers With Conductive Through-vias With Low Stress And Low Defect Density App 20080164573 - Basker; Veeraraghaven S. ; et al.	2008-07-10
Versatile Si-based packaging with integrated passive components for mmWave applications App 20080029886 - Cotte; John Michael ; et al.	2008-02-07
Method and apparatus for depositing coplanar microelectronic interconnectors using a compliant mold App 20070272389 - Gruber; Peter A. ; et al.	2007-11-29
Method for precision assembly of integrated circuit chip packages Grant 7,282,391 - Andry , et al. October 16, 2	2007-10-16
Method For Precision Assembly Of Integrated Circuit Chip Packages App 20070222065 - Andry; Paul Stephen ; et al.	2007-09-27
Apparatus and methods for constructing balanced chip packages to reduce thermally induced mechanical strain App 20060255442 - Gaynes; Michael Anthony ; et al.	2006-11-16
Polymer and ceramic composite electronic substrates Grant 6,528,145 - Berger , et al. March 4, 2	2003-03-04
Etched and formed extractor grid Grant 6,376,983 - Beeteson , et al. April 23, 2	2002-04-23
Method for forming multiple cavity products Grant 5,707,476 - Bezama , et al. January 13, 1	1998-01-13
Apparatus for forming cavities without using an insert Grant 5,665,195 - Natarajan , et al. September 9, 1	1997-09-09