Knapp; James H.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Knapp; James H..The latest application filed is for "structure and method of forming a multiple leadframe semiconductor device".
- Knapp; James H. - Gilbert AZ
- Knapp; James H. - Chandler AZ
| Patent | Date |
|---|---|
| Structure and method of forming a multiple leadframe semiconductor device Grant 6,833,290 - Knapp , et al. December 21, 2 | 2004-12-21 |
| Structure and method of forming a multiple leadframe semiconductor device Grant 6,677,672 - Knapp , et al. January 13, 2 | 2004-01-13 |
| Structure and method of forming a multiple leadframe semiconductor device App 20030209804 - Knapp, James H. ; et al. | 2003-11-13 |
| Structure and method of forming a multiple leadframe semiconductor device App 20030201520 - Knapp, James H. ; et al. | 2003-10-30 |
| Flexible substrate for packaging a semiconductor component Grant 6,300,679 - Mukerji , et al. October 9, 2 | 2001-10-09 |
| Optical coupler and method for coupling an optical fiber to an optoelectric device Grant 6,116,791 - Laninga , et al. September 12, 2 | 2000-09-12 |
| Ball grid device with optically transmissive coating Grant 5,973,337 - Knapp , et al. October 26, 1 | 1999-10-26 |
| Optoelectronic device and method of assembly Grant 5,933,558 - Sauvageau , et al. August 3, 1 | 1999-08-03 |
| Semiconductor component Grant 5,900,669 - Knapp , et al. May 4, 1 | 1999-05-04 |
| Electronic component for aligning a light transmitting structure Grant 5,883,996 - Knapp , et al. March 16, 1 | 1999-03-16 |
| Material transfer apparatus and method of using the same Grant 5,834,062 - Johnson , et al. November 10, 1 | 1998-11-10 |
| Optoelectronic package including photonic device mounted in flexible substrate Grant 5,768,456 - Knapp , et al. June 16, 1 | 1998-06-16 |
| Optical waveguide Grant 5,761,364 - Knapp , et al. June 2, 1 | 1998-06-02 |
| Polyimide optical waveguide having electrical conductivity Grant 5,659,648 - Knapp , et al. August 19, 1 | 1997-08-19 |
| Method for making semiconductor devices having electroplated leads Grant 5,529,682 - Knapp , et al. June 25, 1 | 1996-06-25 |
| Semiconductor device package and method of making Grant 5,468,910 - Knapp , et al. November 21, 1 | 1995-11-21 |
| Semiconductor package having an exposed die surface Grant 5,319,242 - Carney , et al. June 7, 1 | 1994-06-07 |
| Apparatus for encapsulating a semiconductor device Grant 5,118,271 - Baird , et al. June 2, 1 | 1992-06-02 |
| Plasma removal of unwanted material Grant 4,975,146 - Knapp , et al. * December 4, 1 | 1990-12-04 |
| Bonding method and apparatus Grant 4,795,077 - Geyer , et al. January 3, 1 | 1989-01-03 |
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