Knabl; Michael

Patent Applications and Registrations

Patent applications and USPTO patent grants for Knabl; Michael.The latest application filed is for "method of processing a semiconductor wafer, semiconductor wafer, and semiconductor die produced from a semiconductor wafer".

Company Profile

4.6.9

Knabl; Michael - Finkenstein AT
Knabl; Michael - Sattendorf AT

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method Of Processing A Semiconductor Wafer, Semiconductor Wafer, And Semiconductor Die Produced From A Semiconductor Wafer App 20220301933 - Kitzler; Andreas ; et al.	2022-09-22
Method Of Manufacturing A Semiconductor Device Having Frame Structures Laterally Surrounding Backside Metal Structures App 20220085174 - Brockmeier; Andre ; et al.	2022-03-17
Semiconductor device and method of manufacturing a semiconductor device Grant 11,211,459 - Brockmeier , et al. December 28, 2	2021-12-28
Semiconductor Device and Method of Manufacturing a Semiconductor Device App 20200194558 - Brockmeier; Andre ; et al.	2020-06-18
Method for manufacturing semiconductor devices Grant 10,580,753 - Mischitz , et al.	2020-03-03
Method for Processing a Semiconductor Wafer, Semiconductor Composite Structure and Support Structure for Semiconductor Wafer App 20190363057 - Santos Rodriguez; Francisco Javier ; et al.	2019-11-28
Method For Manufacturing Semiconductor Devices App 20190027464 - Mischitz; Martin ; et al.	2019-01-24
Metal deposition on substrates Grant 9,698,106 - Wang , et al. July 4, 2	2017-07-04
Metal Deposition on Substrates App 20160203979 - Wang; Kae-Horng ; et al.	2016-07-14
Metal deposition on substrates Grant 9,318,446 - Wang , et al. April 19, 2	2016-04-19
Chip package and a method for manufacturing a chip package Grant 8,841,768 - Von Koblinski , et al. September 23, 2	2014-09-23
Metal Deposition on Substrates App 20140264779 - Wang; Kae-Horng ; et al.	2014-09-18
Chip Package And A Method For Manufacturing A Chip Package App 20140021610 - VON KOBLINSKI; Carsten ; et al.	2014-01-23

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