Kloter; Urs
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kloter; Urs.The latest application filed is for "method and device for cooling a heat generating component".
- Kloter; Urs - Dietikon CH
- Kloter; Urs - Yorktown Heights NY
| Patent | Date |
|---|---|
| Method and device for cooling a heat generating component Grant 10,278,306 - Brunschwiler , et al. | 2019-04-30 |
| Method and device for cooling a heat generating component Grant 10,091,909 - Brunschwiler , et al. October 2, 2 | 2018-10-02 |
| Method And Device For Cooling A Heat Generating Component App 20150195955 - Brunschwiler; Thomas J. ; et al. | 2015-07-09 |
| Cooling device Grant 8,413,712 - Brunschwiler , et al. April 9, 2 | 2013-04-09 |
| Heat Spreader App 20130008632 - Brunschwiler; Thomas J. ; et al. | 2013-01-10 |
| Patterned structure for a thermal interface Grant 8,327,540 - Michel , et al. December 11, 2 | 2012-12-11 |
| Coolant Pumping System For Mobile Electronic Systems App 20120273183 - Bruno; Michel ; et al. | 2012-11-01 |
| Stamp for patterning, method for manufacturing such stamp and method for manufacturing an object using the stamp Grant 8,268,544 - Schmid , et al. September 18, 2 | 2012-09-18 |
| Patterned structure for a thermal interface Grant 7,748,440 - Michel , et al. July 6, 2 | 2010-07-06 |
| Coolant Pumping System For Mobile Electronic Systems App 20100044005 - Bruno; Michel ; et al. | 2010-02-25 |
| Patterned Structure For A Thermal Interface App 20100037461 - Michel; Bruno ; et al. | 2010-02-18 |
| Stamp For Patterning, Method For Manufacturing Such Stamp And Method For Manufacturing An Object Using The Stamp App 20090208882 - Schmid; Heinz ; et al. | 2009-08-20 |
| Method of fabricating a surface adapting cap with integral adapting material for single and multi chip assemblies Grant 7,547,582 - Brunschwiler , et al. June 16, 2 | 2009-06-16 |
| Semiconductor chip assembly with flexible metal cantilevers Grant 7,532,475 - Michel , et al. May 12, 2 | 2009-05-12 |
| Surface Adapting Cap With Integral Adapting Material For Single And Multi Chip Module Assembly App 20080073775 - Brunschwiler; Thomas J ; et al. | 2008-03-27 |
| Thermal interface with a patterned structure Grant 7,282,799 - Brunschwiler , et al. October 16, 2 | 2007-10-16 |
| Stress release thermal interfaces App 20070230133 - Michel; Bruno ; et al. | 2007-10-04 |
| Cooling device App 20070119565 - Brunschwiler; Thomas J. ; et al. | 2007-05-31 |
| Heat spreader App 20070017659 - Brunschwiler; Thomas J. ; et al. | 2007-01-25 |
| Thermal interface with a patterned structure App 20060286712 - Brunschwiler; Thomas J. ; et al. | 2006-12-21 |
| Patterned structure for a thermal interface App 20050263879 - Michel, Bruno ; et al. | 2005-12-01 |
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