Klodowski; Michael Joseph
Patent Applications and Registrations
Patent applications and USPTO patent grants for Klodowski; Michael Joseph.The latest application filed is for "manufacturing methods for printed circuit boards".
- Klodowski; Michael Joseph - Endicott NY
| Patent | Date |
|---|---|
| Manufacturing methods for printed circuit boards Grant 7,240,430 - Appelt , et al. July 10, 2 | 2007-07-10 |
| Enhanced design and process for a conductive adhesive Grant 7,063,756 - Farquhar , et al. June 20, 2 | 2006-06-20 |
| Manufacturing methods for printed circuit boards App 20050124096 - Appelt, Bernd Karl-Heinz ; et al. | 2005-06-09 |
| Manufacturing methods for printed circuit boards Grant 6,902,869 - Appelt , et al. June 7, 2 | 2005-06-07 |
| Manufacturing methods for printed circuit boards App 20040091821 - Appelt, Bernd Karl-Heinz ; et al. | 2004-05-13 |
| Manufacturing methods for printed circuit boards Grant 6,684,497 - Appelt , et al. February 3, 2 | 2004-02-03 |
| Platen for use in laminating press Grant 6,675,852 - Calmidi , et al. January 13, 2 | 2004-01-13 |
| Enhanced design and process for a conductive adhesive App 20030140488 - Farquhar, Donald Seton ; et al. | 2003-07-31 |
| Platen for use in laminating press and method of lamination App 20020189755 - Calmidi, Varaprasad Venkata ; et al. | 2002-12-19 |
| Method and apparatus for injection molded flip chip encapsulation App 20020111016 - Farquhar, Donald Seton ; et al. | 2002-08-15 |
| Integrated circuit chip carrier assembly comprising a stiffener attached to a dielectric substrate Grant 6,329,713 - Farquhar , et al. December 11, 2 | 2001-12-11 |
| Method And Apparatus For Injection Molded Flip Chip Encapsulation App 20010045637 - FARQUHAR, DONALD SETON ; et al. | 2001-11-29 |
| Manufacturing methods for printed circuit boards App 20010032828 - Appelt, Bernd Karl-Heinz ; et al. | 2001-10-25 |
| Printed circuit board with continuous connective bumps Grant 6,222,136 - Appelt , et al. April 24, 2 | 2001-04-24 |
| Printed circuit board with circuitized cavity and methods of producing same Grant 6,214,525 - Boyko , et al. April 10, 2 | 2001-04-10 |
| Printed circuit board with cavity for circuitization Grant 6,066,386 - Boyko , et al. May 23, 2 | 2000-05-23 |
| Method for filling holes in printed wiring boards Grant 6,015,520 - Appelt , et al. January 18, 2 | 2000-01-18 |
| Method for injection molded flip chip encapsulation Grant 5,981,312 - Farquhar , et al. November 9, 1 | 1999-11-09 |
| Method for fabricating printed circuit boards with cavities Grant 5,784,782 - Boyko , et al. July 28, 1 | 1998-07-28 |
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