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Electroplating System
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Electroplating system
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Systems and methods for copper (I) suppression in electrochemical deposition
Grant 11,211,252 - Bergman , et al. December 28, 2 | 2021-12-28 |
Electroplating System
App 20210348296 - McHugh; Paul R ; et al. | 2021-11-11 |
Drying high aspect ratio features
Grant 10,971,354 - Bergman , et al. April 6, 2 | 2021-04-06 |
Controlled etch of nitride features
Grant 10,840,104 - Bergman , et al. November 17, 2 | 2020-11-17 |
Drying high aspect ratio features
Grant 10,546,762 - Bergman , et al. Ja | 2020-01-28 |
Systems And Methods For Copper (i) Suppression In Electrochemical Deposition
App 20190237335 - Bergman; Eric J. ; et al. | 2019-08-01 |
Adaptive electric field shielding in an electroplating processor using agitator geometry and motion control
Grant 10,240,248 - Van Valkenburg , et al. | 2019-03-26 |
Inert anode electroplating processor and replenisher
Grant 10,227,707 - Wilson , et al. | 2019-03-12 |
Removing photoresist from a wafer
Grant 10,191,379 - McHugh , et al. Ja | 2019-01-29 |
Controlled Etch Of Nitride Features
App 20190019688 - Bergman; Eric J. ; et al. | 2019-01-17 |
Methods for chemical mechanical polishing (CMP) processing with ozone
Grant 10,002,771 - Lianto , et al. June 19, 2 | 2018-06-19 |
Drying High Aspect Ratio Features
App 20180144954 - Bergman; Eric J. ; et al. | 2018-05-24 |
Drying High Aspect Ratio Features
App 20180019119 - Bergman; Eric J. ; et al. | 2018-01-18 |
Removing Photoresist From A Wafer
App 20170357158 - McHugh; Paul R. ; et al. | 2017-12-14 |
Multiple Wafer Rotary Processing
App 20170263472 - Klocke; John L. ; et al. | 2017-09-14 |
Adaptive Electric Field Shielding In An Electroplating Processor Using Agitator Geometry And Motion Control
App 20170051423 - Van Valkenburg; Paul ; et al. | 2017-02-23 |
Inert Anode Electroplating Processor And Replenisher
App 20170016137 - Wilson; Gregory J. ; et al. | 2017-01-19 |
Electroplating With Reduced Air Bubble Defects
App 20160237584 - McHugh; Paul R. ; et al. | 2016-08-18 |
Super Conformal Plating
App 20150322587 - Pabelico; Chris ; et al. | 2015-11-12 |
Electrolytic process using cation permeable barrier
Grant 8,961,771 - Baskaran , et al. February 24, 2 | 2015-02-24 |
Methods For Electrochemical Deposition Of Multi-component Solder Using Cation Permeable Barrier
App 20140246324 - Baskaran; Rajesh ; et al. | 2014-09-04 |
Electrolytic Process Using Cation Permeable Barrier
App 20140209472 - Baskaran; Rajesh ; et al. | 2014-07-31 |
Deplating contacts in an electrochemical plating apparatus
Grant 8,500,968 - Woodruff , et al. August 6, 2 | 2013-08-06 |
Electrolytic Process Using Cation Permeable Barrier
App 20120292194 - Baskaran; Rajesh ; et al. | 2012-11-22 |
Electrolytic process using cation permeable barrier
Grant 8,236,159 - Baskaran , et al. August 7, 2 | 2012-08-07 |
Electrolytic copper process using anion permeable barrier
Grant 8,123,926 - Baskaran , et al. February 28, 2 | 2012-02-28 |
Deplating Contacts In An Electrochemical Plating Apparatus
App 20120037495 - Woodruff; Daniel J. ; et al. | 2012-02-16 |
Systems and methods for electrochemically processing microfeature workpieces
Grant 7,794,573 - Klocke September 14, 2 | 2010-09-14 |
Chambers, systems, and methods for electrochemically processing microfeature workpieces
Grant 7,585,398 - Hanson , et al. September 8, 2 | 2009-09-08 |
Chambers, systems, and methods for electrochemically processing microfeature workpieces
App 20090114533 - Hanson; Kyle M. ; et al. | 2009-05-07 |
Electrolytic copper process using anion permeable barrier
App 20070068820 - Baskaran; Rajesh ; et al. | 2007-03-29 |
Apparatus and method for deposition of an electrophoretic emulsion
Grant 7,169,280 - Klocke , et al. January 30, 2 | 2007-01-30 |
Apparatus and method for deposition of an electrophoretic emulsion
Grant 7,150,816 - Klocke , et al. December 19, 2 | 2006-12-19 |
Copper electrolytic process using cation permeable barrier
App 20060260946 - Baskaran; Rajesh ; et al. | 2006-11-23 |
Electrolytic process using cation permeable barrier
App 20060237323 - Baskaran; Rajesh ; et al. | 2006-10-26 |
Method for applying metal features onto barrier layers using ion permeable barriers
App 20060189129 - Baskaran; Rajesh ; et al. | 2006-08-24 |
Electrolytic process using anion permeable barrier
App 20060163072 - Baskaran; Rajesh ; et al. | 2006-07-27 |
Electrolytic process using anion permeable barrier
App 20060157355 - Baskaran; Rajesh ; et al. | 2006-07-20 |
Systems and methods for electrochemically processing microfeature workpieces
App 20060144699 - Klocke; John L. | 2006-07-06 |
Systems and methods for electrochemically processing microfeature workpieces
App 20060144712 - Klocke; John L. | 2006-07-06 |
Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
Grant 7,048,841 - Batz, Jr. , et al. May 23, 2 | 2006-05-23 |
Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
Grant 6,939,448 - Batz, Jr. , et al. September 6, 2 | 2005-09-06 |
Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
Grant 6,911,127 - Batz, Jr. , et al. June 28, 2 | 2005-06-28 |
Chambers, systems, and methods for electrochemically processing microfeature workpieces
App 20050087439 - Hanson, Kyle M. ; et al. | 2005-04-28 |
Electroplating compositions and methods for electroplating
App 20050081744 - Klocke, John L. ; et al. | 2005-04-21 |
Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
App 20040035694 - Batz, Robert W. JR. ; et al. | 2004-02-26 |
Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
App 20030196892 - Batz, Robert W. JR. ; et al. | 2003-10-23 |
Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
App 20030173209 - Batz, Robert W. JR. ; et al. | 2003-09-18 |
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