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Patent applications and USPTO patent grants for Klemovage; Jeffrey M.The latest application filed is for "method of generating a leadframe ic package model, a leadframe modeler and an ic design system".
Patent | Date |
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Method for electrical interconnection between printed wiring board layers using through holes with solid core conductive material Grant 8,601,683 - Cohn , et al. December 10, 2 | 2013-12-10 |
Method of generating a leadframe IC package model, a leadframe modeler and an IC design system Grant 8,370,777 - Hawk, Jr. , et al. February 5, 2 | 2013-02-05 |
Method Of Generating A Leadframe Ic Package Model, A Leadframe Modeler And An Ic Design System App 20100318340 - Hawk, JR.; Donald E. ;   et al. | 2010-12-16 |
Method For Electrical Interconnection Between Printed Wiring Board Layers Using Through Holes With Solid Core Conductive Material App 20060175081 - Cohn; Charles ;   et al. | 2006-08-10 |
Method for electrical interconnection between printed wiring board layers using through holes with solid core conductive material App 20050150682 - Cohn, Charles ;   et al. | 2005-07-14 |
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