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name:-0.011108875274658
name:-0.0032768249511719
name:-0.00036191940307617
Kleinfeld; Marlies Patent Filings

Kleinfeld; Marlies

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kleinfeld; Marlies.The latest application filed is for "water soluble and air stable phosphaadamantanes as stabilizers for electroless metal deposition".

Company Profile
0.2.11
  • Kleinfeld; Marlies - Wuppertal DE
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Water Soluble And Air Stable Phosphaadamantanes As Stabilizers For Electroless Metal Deposition
App 20190085461 - Schafer; Stefan ;   et al.
2019-03-21
Apparatus For Electrochemical Deposition Of A Metal
App 20140158545 - Schafer; Stefan ;   et al.
2014-06-12
Tin-silver solder bumping in electronics manufacture
Grant 7,713,859 - Richardson , et al. May 11, 2
2010-05-11
Preserving Solderability and Inhibiting Whisker Growth in Tin Surfaces of Electronic Components
App 20080261071 - Xu; Chen ;   et al.
2008-10-23
Tin-silver Solder Bumping In Electronics Manufacture
App 20070037377 - Richardson; Thomas B. ;   et al.
2007-02-15
Method For Electrodeposition Of Bronzes
App 20060260948 - Zschintzsch; Katrin ;   et al.
2006-11-23
Method for bronze galvanic coating
App 20060137991 - Zschintzsch; Katrin ;   et al.
2006-06-29
Method for the electrolytic deposition of metals
App 20060049058 - van Wijngaarden; Christel ;   et al.
2006-03-09
Method for electrodeposition of bronzes
App 20050263403 - Zschintzsch, Katrin ;   et al.
2005-12-01
Preserving solderability and inhibiting whisker growth in tin surfaces of electronic components
App 20050249969 - Xu, Chen ;   et al.
2005-11-10
Non-reactive coatings for inertization
App 20050034996 - Horsthemke, Helmut ;   et al.
2005-02-17
Process for the non-galvanic tin plating of copper or copper alloys
Grant 6,821,323 - Bell , et al. November 23, 2
2004-11-23

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