Klein, Rudi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Klein, Rudi.The latest application filed is for "highly transparent thermoformable polyamide film".

Company Profile

0.5.4

Klein, Rudi - Walsrode DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Highly transparent thermoformable polyamide film App 20040086731 - Eggers, Holger ; et al.	2004-05-06
Highly transparent thermoformable polyamide film App 20030207136 - Eggers, Holger ; et al.	2003-11-06
Multilayer film with lamination and heat-sealable sides, and having antifogging properties Grant 6,576,348 - Eggers , et al. June 10, 2	2003-06-10
Multilayer film with lamination and heat-sealable sides, and having antifogging properties App 20020187342 - Eggers, Holger ; et al.	2002-12-12
Multi-ply Heat Sealable Layer And Hermetically Sealable Packaging Material Produced Therewith App 20020168512 - EGGERS, HOLGER ; et al.	2002-11-14
Polyamide mixtures which contain solid particles Grant 5,994,445 - Kaschel , et al. November 30, 1	1999-11-30
Highly transparent thermoforming film with a heat sealing layer based on polypropylene and linear low density polyethylene Grant 5,935,697 - Gasse , et al. August 10, 1	1999-08-10
Multilayer, thermoformable, heat sealable film and use thereof in the production of boil-cured products Grant 5,906,850 - Gasse , et al. May 25, 1	1999-05-25
Heat-sealable, stretched composite flims Grant 4,830,918 - Schinkel , et al. May 16, 1	1989-05-16

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