Patent | Date |
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Modular Integrated Circuit Chip Carrier App 20110019377 - Kledzik; Kenneth J. ;   et al. | 2011-01-27 |
Modular integrated circuit chip carrier Grant 7,796,400 - Kledzik , et al. September 14, 2 | 2010-09-14 |
Carrier-based electronic module Grant 7,405,471 - Kledzik , et al. July 29, 2 | 2008-07-29 |
System for populating a circuit board with semiconductor chips Grant 7,316,060 - Kledzik January 8, 2 | 2008-01-08 |
Modular integrated circuit chip carrier App 20060254809 - Kledzik; Kenneth J. ;   et al. | 2006-11-16 |
Method for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips Grant 7,103,970 - Kledzik September 12, 2 | 2006-09-12 |
Modular integrated circuit chip carrier Grant 7,102,892 - Kledzik , et al. September 5, 2 | 2006-09-05 |
Electronic module having a three dimensional array of carrier-mounted integrated circuit packages Grant 6,900,529 - Kledzik , et al. May 31, 2 | 2005-05-31 |
Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips App 20040194301 - Kledzik, Kenneth J. | 2004-10-07 |
Carrier-based electronic module App 20040108590 - Kledzik, Kenneth J. ;   et al. | 2004-06-10 |
Electronic circuit module with a carrier having a mounting pad array Grant 6,713,854 - Kledzik , et al. March 30, 2 | 2004-03-30 |
Modular integrated circuit chip carrier App 20030165051 - Kledzik, Kenneth J. ;   et al. | 2003-09-04 |
Electronic module having canopy-type carriers App 20030137808 - Kledzik, Kenneth J. ;   et al. | 2003-07-24 |
Electronic module having canopy-type carriers Grant 6,545,868 - Kledzik , et al. April 8, 2 | 2003-04-08 |
Electronic module having a three dimensional array of carrier-mounted integrated circuit packages App 20020181216 - Kledzik, Kenneth J. ;   et al. | 2002-12-05 |
Electronic module having a three dimensional array of carrier-mounted integrated circuit packages Grant 6,487,078 - Kledzik , et al. November 26, 2 | 2002-11-26 |
Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips App 20020162215 - Kledzik, Kenneth J. | 2002-11-07 |
Electronic Module Having A Three Dimensional Array Of Integrated Circuit Packages App 20020135982 - Kledzik, Kenneth J. ;   et al. | 2002-09-26 |
Circuit board assembly having a three dimensional array of integrated circuit packages Grant 6,313,998 - Kledzik , et al. November 6, 2 | 2001-11-06 |
Inherently impedance matched integrated circuit socket Grant 5,612,657 - Kledzik March 18, 1 | 1997-03-18 |
Module having voltage control circuit to reduce surges in potential Grant 5,563,838 - Mart , et al. October 8, 1 | 1996-10-08 |
Switched memory expansion buffer Grant 5,440,519 - Mart , et al. August 8, 1 | 1995-08-08 |
Inherently impedance matched integrated circuit module Grant 5,400,003 - Kledzik * March 21, 1 | 1995-03-21 |
Inherently impedance matched multiple integrated circuit module Grant 5,266,912 - Kledzik November 30, 1 | 1993-11-30 |