Klassen; Holger
Patent Applications and Registrations
Patent applications and USPTO patent grants for Klassen; Holger.The latest application filed is for "method for temporarily fastening a semiconductor chip to a surface, method for producing a semiconductor component and semiconductor component".
- Klassen; Holger - Regenstauf DE
| Patent | Date |
|---|---|
| Carrier and component with a buffer layer, and method for producing a component Grant 11,450,794 - Altieri-Weimar , et al. September 20, 2 | 2022-09-20 |
| Optoelectronic component and method of producing an optoelectronic component Grant 11,437,550 - Otto , et al. September 6, 2 | 2022-09-06 |
| Method for producing an illumination device and illumination device Grant 11,094,868 - Mueller , et al. August 17, 2 | 2021-08-17 |
| Method for Temporarily Fastening a Semiconductor Chip to a Surface, Method for Producing a Semiconductor Component and Semiconductor Component App 20210183800 - Muller; Klaus ; et al. | 2021-06-17 |
| Optoelectronic Component And Method Of Producing An Optoelectronic Component App 20210050490 - Otto; Isabel ; et al. | 2021-02-18 |
| Carrier and Component with a Buffer Layer, and Method for Producing a Component App 20200235271 - Altieri-Weimar; Paola ; et al. | 2020-07-23 |
| Method For Producing An Illumination Device And Illumination Device App 20200127180 - MUELLER; Klaus ; et al. | 2020-04-23 |
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