Kiumi; Rei
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kiumi; Rei.The latest application filed is for "plating apparatus".
- Kiumi; Rei - Tokyo JP
| Patent | Date |
|---|---|
| Plating method and apparatus Grant 8,317,993 - Kuriyama , et al. November 27, 2 | 2012-11-27 |
| Plating apparatus Grant 8,252,167 - Kuriyama , et al. August 28, 2 | 2012-08-28 |
| Plating Apparatus App 20110073482 - Kuriyama; Fumio ; et al. | 2011-03-31 |
| Plating apparatus Grant 7,875,158 - Kuriyama , et al. January 25, 2 | 2011-01-25 |
| Plating method and apparatus App 20090311429 - Kuriyama; Fumio ; et al. | 2009-12-17 |
| Plating apparatus App 20090218231 - Yajima; Toshikazu ; et al. | 2009-09-03 |
| Plating method and apparatus App 20070117365 - Kuriyama; Fumio ; et al. | 2007-05-24 |
| Plating apparatus App 20060113185 - Kuriyama; Fumio ; et al. | 2006-06-01 |
| Lead free bump and method of forming the same Grant 7,012,333 - Shimoyama , et al. March 14, 2 | 2006-03-14 |
| Method of forming a lead-free bump and a plating apparatus therefor App 20050279640 - Shimoyama, Masashi ; et al. | 2005-12-22 |
| Plating device App 20040262150 - Yajima, Toshikazu ; et al. | 2004-12-30 |
| Lead free bump and method of forming the same App 20040219775 - Shimoyama, Masashi ; et al. | 2004-11-04 |
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