Patent | Date |
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Double-sided Pressure-sensitive Adhesive Tape App 20170335145 - JANNA BINTI ABDULLAH; NURUL ;   et al. | 2017-11-23 |
Method Of Dicing Substrate App 20130273716 - KIUCHI; Kazuyuki | 2013-10-17 |
Heat-resistant Pressure-sensitive Adhesive Tape For Production Of Semiconductor Device And Method For Producing Semiconductor Device Using The Tape App 20130240141 - SOEJIMA; Kazuki ;   et al. | 2013-09-19 |
Self-rolling Adhesive Film App 20130224418 - KIUCHI; Kazuyuki ;   et al. | 2013-08-29 |
Self-rolling Adhesive Film App 20130220532 - KIUCHI; Kazuyuki ;   et al. | 2013-08-29 |
Heat-resistant adhesive sheet for semiconductor device fabrication, adhesive used for the sheet, and method for fabricating semiconductor device using the sheet Grant 8,502,397 - Yanagi , et al. August 6, 2 | 2013-08-06 |
Heat-resistant adhesive sheet for substrateless semiconductor package fabrication and method for fabricating substrateless semiconductor package using the adhesive sheet Grant 8,436,481 - Hoshino , et al. May 7, 2 | 2013-05-07 |
Pressure-sensitive adhesive sheet, method of processing adherend with the pressure-sensitive adhesive sheet, and apparatus for stripping pressure-sensitive adhesive sheet Grant 8,337,656 - Nishio , et al. December 25, 2 | 2012-12-25 |
Pressure-sensitive Adhesive Tape For Electrochemical Device App 20120270036 - KIUCHI; Kazuyuki ;   et al. | 2012-10-25 |
Spontaneously Rolling Adhesive Sheet And Method Of Manufacturing Cut Piece App 20120205030 - KIUCHI; Kazuyuki ;   et al. | 2012-08-16 |
Method For Processing Wafer App 20110237050 - SUGIMURA; Toshimasa ;   et al. | 2011-09-29 |
Surface Protection Tape For Dicing And Method For Peeling And Removing Surface Protection Tape For Dicing App 20110220268 - Nishio; Akinori ;   et al. | 2011-09-15 |
Adhesive Sheet, Process For Producing The Same, And Method Of Cutting Multilayered Ceramic Sheet App 20110200744 - HIRAYAMA; Takamasa ;   et al. | 2011-08-18 |
Pressure-sensitive Adhesive Sheet With Spontaneously Rolling Property App 20110195248 - Kiuchi; Kazuyuki ;   et al. | 2011-08-11 |
Heat-resistant Adhesive Sheet For Substrateless Semiconductor Package Fabrication And Method For Fabricating Substrateless Semiconductor Package Using The Adhesive Sheet App 20110151625 - HOSHINO; Shinji ;   et al. | 2011-06-23 |
Heat-resistant Adhesive Sheet For Semiconductor Device Fabrication, Adhesive Used For The Sheet, And Method For Fabricating Semiconductor Device Using The Sheet App 20110143552 - YANAGI; Yuichiro ;   et al. | 2011-06-16 |
Protective Tape Joining Method And Protective Tape Joining Apparatus App 20110117706 - Nishio; Akinori ;   et al. | 2011-05-19 |
Pressure-sensitive Adhesive Sheet, Method Of Processing Adherend With The Pressure-sensitive Adhesive Sheet, And Apparatus For Stripping Pressure-sensitive Adhesive Sheet App 20110067808 - Nishio; Akinori ;   et al. | 2011-03-24 |
Self-rolling laminated sheet and self-rolling pressure-sensitive adhesive sheet Grant 7,910,206 - Kiuchi , et al. March 22, 2 | 2011-03-22 |
Method For Separating And Removing Dicing Surface Protection Tape From Object To Be Cut App 20110048641 - SUGIMURA; Toshimasa ;   et al. | 2011-03-03 |
Die Attach Film-provided Dicing Tape And Production Process Of Semiconductor Device App 20100279491 - KIUCHI; Kazuyuki ;   et al. | 2010-11-04 |
Removable Pressure Sensitive Adhesive Sheet And Method For Processing Adherend Using The Same App 20100252185 - Kiuchi; Kazuyuki ;   et al. | 2010-10-07 |
Resin Laminate, Pressure Sensitive Adhesive Sheet, Method For Working Adherend Using The Pressure Sensitive Adhesive Sheet, And Device For Separating The Pressure Sensitive Adhesive Sheet App 20100243159 - Nishio; Akinori ;   et al. | 2010-09-30 |
Heat-peelable pressure-sensitive adhesive sheet Grant 7,718,257 - Murata , et al. May 18, 2 | 2010-05-18 |
Heat-peelable pressure-sensitive adhesive sheet and method of recovering adherend App 20100028588 - Kiuchi; Kazuyuki | 2010-02-04 |
Thermally strippable double faced adhesive sheet and method of working work piece App 20090288763 - Kiuchi; Kazuyuki ;   et al. | 2009-11-26 |
Re-peelable pressure-sensitive adhesive sheet Grant 7,514,143 - Matsumura , et al. April 7, 2 | 2009-04-07 |
Heat-Peelable Double-Faced Pressure-Sensitive Adhesive Sheet, Method Of Processing Adherend, and Electronic Part App 20080216949 - KIUCHI; Kazuyuki ;   et al. | 2008-09-11 |
Self-rolling Laminated Sheet And Self-rolling Pressure-sensitive Adhesive Sheet App 20080131634 - KIUCHI; Kazuyuki ;   et al. | 2008-06-05 |
Method For Attaching And Peeling Pressure-sensitive Adhesive Sheet, And Attaching Apparatus Of Pressure-sensitive Adhesive Sheet And Peeling Apparatus Of Pressure-sensitive Adhesive Sheet App 20080121335 - KIUCHI; Kazuyuki ;   et al. | 2008-05-29 |
Heat-resistant Dicing Tape Or Sheet App 20080085409 - KIUCHI; Kazuyuki ;   et al. | 2008-04-10 |
Adhesive Sheet, Process For Producing The Same, And Method Of Cutting Multilayered Ceramic Sheet App 20080038540 - HIRAYAMA; Takamasa ;   et al. | 2008-02-14 |
Method for working object to be worked App 20080011415 - Kiuchi; Kazuyuki ;   et al. | 2008-01-17 |
Method for thermally releasing chip cut piece from thermal release type pressure sensitive adhesive sheet, electronic component and circuit board App 20070111392 - Murata; Akihisa ;   et al. | 2007-05-17 |
Heat-peelable pressure-sensitive adhesive sheet Grant 7,214,424 - Kiuchi , et al. May 8, 2 | 2007-05-08 |
Heat-peelable adhesive sheet Grant 7,175,728 - Kiuchi , et al. February 13, 2 | 2007-02-13 |
Heat-peelable pressure-sensitive adhesive sheet Grant 7,163,597 - Murata , et al. January 16, 2 | 2007-01-16 |
Energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet and method for producing cut pieces using the same Grant 7,147,743 - Kiuchi , et al. December 12, 2 | 2006-12-12 |
Pressure-sensitive Adhesive Sheet For Use In Dicing And Method Of Processing Products Worked With It App 20060257651 - Shintani; Toshio 1-1-2, Shimohozumi ;   et al. | 2006-11-16 |
Heat-peelable adhesive sheet Grant 7,067,030 - Kiuchi , et al. June 27, 2 | 2006-06-27 |
Energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet and method for producing cut pieces using the same Grant 7,029,550 - Kiuchi , et al. April 18, 2 | 2006-04-18 |
Heat-peelable pressure-sensitive adhesive sheet Grant 6,998,175 - Murata , et al. February 14, 2 | 2006-02-14 |
Heat-peelable adhesive sheet App 20050186419 - Kiuchi, Kazuyuki ;   et al. | 2005-08-25 |
Re-peelable pressure-sensitive adhesive sheet App 20050031861 - Matsumura, Takeshi ;   et al. | 2005-02-10 |
Heat-peelable double-faced pressure-sensitive adhesive sheet, method of processing adherend, and electronic part App 20040191510 - Kiuchi, Kazuyuki ;   et al. | 2004-09-30 |
Method of heat-peeling chip cut pieces from heat peel type adhesive sheet, electronic part, and circuit board App 20040177918 - Murata, Akihisa ;   et al. | 2004-09-16 |
Heat-peelable pressure-sensitive adhesive sheet App 20040038020 - Murata, Akihisa ;   et al. | 2004-02-26 |
Energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet and method for producing cut pieces using the same App 20040003883 - Kiuchi, Kazuyuki ;   et al. | 2004-01-08 |
Energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet and method for producing cut pieces using the same App 20040000370 - Kiuchi, Kazuyuki ;   et al. | 2004-01-01 |
Heat-peelable adhesive sheet App 20030203192 - Kiuchi, Kazuyuki ;   et al. | 2003-10-30 |
Heat-peelable pressure-sensitive adhesive sheet App 20030203193 - Murata, Akihisa ;   et al. | 2003-10-30 |
Heat-peelable pressure-sensitive adhesive sheet App 20020192463 - Kiuchi, Kazuyuki ;   et al. | 2002-12-19 |
Heat-peelable pressure-sensitive adhesive sheet App 20010055678 - Murata, Akihisa ;   et al. | 2001-12-27 |
Radiation-curable heat-peelable pressure-sensitive adhesive sheet and process for producing cut pieces with the same App 20010019765 - Kiuchi, Kazuyuki ;   et al. | 2001-09-06 |