loadpatents
name:-0.052978038787842
name:-0.015707015991211
name:-0.00057506561279297
KIUCHI; KAZUYUKI Patent Filings

KIUCHI; KAZUYUKI

Patent Applications and Registrations

Patent applications and USPTO patent grants for KIUCHI; KAZUYUKI.The latest application filed is for "double-sided pressure-sensitive adhesive tape".

Company Profile
0.15.42
  • KIUCHI; KAZUYUKI - Osaka JP
  • Kiuchi; Kazuyuki - Ibaraki JP
  • KIUCHI; Kazuyuki - Ibaraki-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Double-sided Pressure-sensitive Adhesive Tape
App 20170335145 - JANNA BINTI ABDULLAH; NURUL ;   et al.
2017-11-23
Method Of Dicing Substrate
App 20130273716 - KIUCHI; Kazuyuki
2013-10-17
Heat-resistant Pressure-sensitive Adhesive Tape For Production Of Semiconductor Device And Method For Producing Semiconductor Device Using The Tape
App 20130240141 - SOEJIMA; Kazuki ;   et al.
2013-09-19
Self-rolling Adhesive Film
App 20130224418 - KIUCHI; Kazuyuki ;   et al.
2013-08-29
Self-rolling Adhesive Film
App 20130220532 - KIUCHI; Kazuyuki ;   et al.
2013-08-29
Heat-resistant adhesive sheet for semiconductor device fabrication, adhesive used for the sheet, and method for fabricating semiconductor device using the sheet
Grant 8,502,397 - Yanagi , et al. August 6, 2
2013-08-06
Heat-resistant adhesive sheet for substrateless semiconductor package fabrication and method for fabricating substrateless semiconductor package using the adhesive sheet
Grant 8,436,481 - Hoshino , et al. May 7, 2
2013-05-07
Pressure-sensitive adhesive sheet, method of processing adherend with the pressure-sensitive adhesive sheet, and apparatus for stripping pressure-sensitive adhesive sheet
Grant 8,337,656 - Nishio , et al. December 25, 2
2012-12-25
Pressure-sensitive Adhesive Tape For Electrochemical Device
App 20120270036 - KIUCHI; Kazuyuki ;   et al.
2012-10-25
Spontaneously Rolling Adhesive Sheet And Method Of Manufacturing Cut Piece
App 20120205030 - KIUCHI; Kazuyuki ;   et al.
2012-08-16
Method For Processing Wafer
App 20110237050 - SUGIMURA; Toshimasa ;   et al.
2011-09-29
Surface Protection Tape For Dicing And Method For Peeling And Removing Surface Protection Tape For Dicing
App 20110220268 - Nishio; Akinori ;   et al.
2011-09-15
Adhesive Sheet, Process For Producing The Same, And Method Of Cutting Multilayered Ceramic Sheet
App 20110200744 - HIRAYAMA; Takamasa ;   et al.
2011-08-18
Pressure-sensitive Adhesive Sheet With Spontaneously Rolling Property
App 20110195248 - Kiuchi; Kazuyuki ;   et al.
2011-08-11
Heat-resistant Adhesive Sheet For Substrateless Semiconductor Package Fabrication And Method For Fabricating Substrateless Semiconductor Package Using The Adhesive Sheet
App 20110151625 - HOSHINO; Shinji ;   et al.
2011-06-23
Heat-resistant Adhesive Sheet For Semiconductor Device Fabrication, Adhesive Used For The Sheet, And Method For Fabricating Semiconductor Device Using The Sheet
App 20110143552 - YANAGI; Yuichiro ;   et al.
2011-06-16
Protective Tape Joining Method And Protective Tape Joining Apparatus
App 20110117706 - Nishio; Akinori ;   et al.
2011-05-19
Pressure-sensitive Adhesive Sheet, Method Of Processing Adherend With The Pressure-sensitive Adhesive Sheet, And Apparatus For Stripping Pressure-sensitive Adhesive Sheet
App 20110067808 - Nishio; Akinori ;   et al.
2011-03-24
Self-rolling laminated sheet and self-rolling pressure-sensitive adhesive sheet
Grant 7,910,206 - Kiuchi , et al. March 22, 2
2011-03-22
Method For Separating And Removing Dicing Surface Protection Tape From Object To Be Cut
App 20110048641 - SUGIMURA; Toshimasa ;   et al.
2011-03-03
Die Attach Film-provided Dicing Tape And Production Process Of Semiconductor Device
App 20100279491 - KIUCHI; Kazuyuki ;   et al.
2010-11-04
Removable Pressure Sensitive Adhesive Sheet And Method For Processing Adherend Using The Same
App 20100252185 - Kiuchi; Kazuyuki ;   et al.
2010-10-07
Resin Laminate, Pressure Sensitive Adhesive Sheet, Method For Working Adherend Using The Pressure Sensitive Adhesive Sheet, And Device For Separating The Pressure Sensitive Adhesive Sheet
App 20100243159 - Nishio; Akinori ;   et al.
2010-09-30
Heat-peelable pressure-sensitive adhesive sheet
Grant 7,718,257 - Murata , et al. May 18, 2
2010-05-18
Heat-peelable pressure-sensitive adhesive sheet and method of recovering adherend
App 20100028588 - Kiuchi; Kazuyuki
2010-02-04
Thermally strippable double faced adhesive sheet and method of working work piece
App 20090288763 - Kiuchi; Kazuyuki ;   et al.
2009-11-26
Re-peelable pressure-sensitive adhesive sheet
Grant 7,514,143 - Matsumura , et al. April 7, 2
2009-04-07
Heat-Peelable Double-Faced Pressure-Sensitive Adhesive Sheet, Method Of Processing Adherend, and Electronic Part
App 20080216949 - KIUCHI; Kazuyuki ;   et al.
2008-09-11
Self-rolling Laminated Sheet And Self-rolling Pressure-sensitive Adhesive Sheet
App 20080131634 - KIUCHI; Kazuyuki ;   et al.
2008-06-05
Method For Attaching And Peeling Pressure-sensitive Adhesive Sheet, And Attaching Apparatus Of Pressure-sensitive Adhesive Sheet And Peeling Apparatus Of Pressure-sensitive Adhesive Sheet
App 20080121335 - KIUCHI; Kazuyuki ;   et al.
2008-05-29
Heat-resistant Dicing Tape Or Sheet
App 20080085409 - KIUCHI; Kazuyuki ;   et al.
2008-04-10
Adhesive Sheet, Process For Producing The Same, And Method Of Cutting Multilayered Ceramic Sheet
App 20080038540 - HIRAYAMA; Takamasa ;   et al.
2008-02-14
Method for working object to be worked
App 20080011415 - Kiuchi; Kazuyuki ;   et al.
2008-01-17
Method for thermally releasing chip cut piece from thermal release type pressure sensitive adhesive sheet, electronic component and circuit board
App 20070111392 - Murata; Akihisa ;   et al.
2007-05-17
Heat-peelable pressure-sensitive adhesive sheet
Grant 7,214,424 - Kiuchi , et al. May 8, 2
2007-05-08
Heat-peelable adhesive sheet
Grant 7,175,728 - Kiuchi , et al. February 13, 2
2007-02-13
Heat-peelable pressure-sensitive adhesive sheet
Grant 7,163,597 - Murata , et al. January 16, 2
2007-01-16
Energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet and method for producing cut pieces using the same
Grant 7,147,743 - Kiuchi , et al. December 12, 2
2006-12-12
Pressure-sensitive Adhesive Sheet For Use In Dicing And Method Of Processing Products Worked With It
App 20060257651 - Shintani; Toshio 1-1-2, Shimohozumi ;   et al.
2006-11-16
Heat-peelable adhesive sheet
Grant 7,067,030 - Kiuchi , et al. June 27, 2
2006-06-27
Energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet and method for producing cut pieces using the same
Grant 7,029,550 - Kiuchi , et al. April 18, 2
2006-04-18
Heat-peelable pressure-sensitive adhesive sheet
Grant 6,998,175 - Murata , et al. February 14, 2
2006-02-14
Heat-peelable adhesive sheet
App 20050186419 - Kiuchi, Kazuyuki ;   et al.
2005-08-25
Re-peelable pressure-sensitive adhesive sheet
App 20050031861 - Matsumura, Takeshi ;   et al.
2005-02-10
Heat-peelable double-faced pressure-sensitive adhesive sheet, method of processing adherend, and electronic part
App 20040191510 - Kiuchi, Kazuyuki ;   et al.
2004-09-30
Method of heat-peeling chip cut pieces from heat peel type adhesive sheet, electronic part, and circuit board
App 20040177918 - Murata, Akihisa ;   et al.
2004-09-16
Heat-peelable pressure-sensitive adhesive sheet
App 20040038020 - Murata, Akihisa ;   et al.
2004-02-26
Energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet and method for producing cut pieces using the same
App 20040003883 - Kiuchi, Kazuyuki ;   et al.
2004-01-08
Energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet and method for producing cut pieces using the same
App 20040000370 - Kiuchi, Kazuyuki ;   et al.
2004-01-01
Heat-peelable adhesive sheet
App 20030203192 - Kiuchi, Kazuyuki ;   et al.
2003-10-30
Heat-peelable pressure-sensitive adhesive sheet
App 20030203193 - Murata, Akihisa ;   et al.
2003-10-30
Heat-peelable pressure-sensitive adhesive sheet
App 20020192463 - Kiuchi, Kazuyuki ;   et al.
2002-12-19
Heat-peelable pressure-sensitive adhesive sheet
App 20010055678 - Murata, Akihisa ;   et al.
2001-12-27
Radiation-curable heat-peelable pressure-sensitive adhesive sheet and process for producing cut pieces with the same
App 20010019765 - Kiuchi, Kazuyuki ;   et al.
2001-09-06

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.

© 2024 USPTO.report | Privacy Policy | Resources | RSS Feed of Trademarks | Trademark Filings Twitter Feed