KITAZAWA; Yoshiyuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for KITAZAWA; Yoshiyuki.The latest application filed is for "sheet transport device and non-transitory computer readable medium".

Company Profile

0.8.8

KITAZAWA; Yoshiyuki - Kanagawa JP
Kitazawa; Yoshiyuki - Ebina JP
Kitazawa; Yoshiyuki - Ebina-shi JP
Kitazawa; Yoshiyuki - Hyogo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Sheet Transport Device And Non-transitory Computer Readable Medium App 20210229941 - ARAKI; Yuichi ; et al.	2021-07-29
Sheet feeding device and image forming apparatus Grant 9,284,139 - Otsuka , et al. March 15, 2	2016-03-15
Sheet Feeding Device And Image Forming Apparatus App 20150220054 - OTSUKA; Yuji ; et al.	2015-08-06
Image forming apparatus, non-transitory computer readable medium and image forming method Grant 8,798,486 - Kitazawa August 5, 2	2014-08-05
Medium feeding device and image forming apparatus Grant 8,662,495 - Kitazawa , et al. March 4, 2	2014-03-04
Image Forming Apparatus, Non-transitory Computer Readable Medium And Image Forming Method App 20140010557 - KITAZAWA; Yoshiyuki	2014-01-09
Medium Feeding Device And Image Forming Apparatus App 20130020755 - KITAZAWA; Yoshiyuki ; et al.	2013-01-24
Sheet containing apparatus and image forming system Grant 8,047,527 - Adachi , et al. November 1, 2	2011-11-01
Medium feeding unit and image forming apparatus Grant 7,841,590 - Adachi , et al. November 30, 2	2010-11-30
Sheet Containing Apparatus And Image Forming System App 20090256303 - Adachi; Yuichi ; et al.	2009-10-15
Medium Feeding Unit And Image Forming Apparatus App 20090243187 - Adachi; Yuichi ; et al.	2009-10-01
Semiconductor device and manufacturing method thereof Grant 6,335,570 - Mori , et al. January 1, 2	2002-01-01
Semiconductor Device And Manufacturing Method Thereof App 20010045652 - MORI, TAKESHI ; et al.	2001-11-29
Semiconductor device having interconnect layer and method of manufacturing therefor Grant 6,215,189 - Toyoda , et al. April 10, 2	2001-04-10

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