Kitazato; Keisuke
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kitazato; Keisuke.The latest application filed is for "method for manufacturing wire, apparatus for manufacturing wire, and copper alloy wire".
- Kitazato; Keisuke - Tokyo JP
- Kitazato; Keisuke - Kumamoto JP
| Patent | Date |
|---|---|
| Method For Manufacturing Wire, Apparatus For Manufacturing Wire, And Copper Alloy Wire App 20140332124 - TAKAHASHI; Isao ; et al. | 2014-11-13 |
| Method for manufacturing wire, apparatus for manufacturing wire, and copper alloy wire Grant 8,815,028 - Takahashi , et al. August 26, 2 | 2014-08-26 |
| Copper Alloy Material For Electric/electronic Parts And Method Of Producing The Same App 20090229716 - NAKANO; Junsuke ; et al. | 2009-09-17 |
| Method For Manufacturing Wire, Apparatus For Manufacturing Wire, And Copper Alloy Wire App 20090229715 - TAKAHASHI; Isao ; et al. | 2009-09-17 |
| Process for scrubbing porous hollow fiber membranes in hollow fiber membrane module Grant 5,209,852 - Sunaoka , et al. May 11, 1 | 1993-05-11 |
| Filtration process using hollow fiber membrane module Grant 5,151,191 - Sunaoka , et al. September 29, 1 | 1992-09-29 |
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