loadpatents
Patent applications and USPTO patent grants for Kitayama; Yoshifumi.The latest application filed is for "semiconductor element having protruded bump electrodes".
Patent | Date |
---|---|
Semiconductor element having protruded bump electrodes Grant 7,071,090 - Higashi , et al. July 4, 2 | 2006-07-04 |
Semiconductor element having protruded bump electrodes App 20050146029 - Higashi, Kazushi ;   et al. | 2005-07-07 |
Semiconductor element having protruded bump electrodes Grant 6,894,387 - Higashi , et al. May 17, 2 | 2005-05-17 |
Recycling system App 20020022968 - Shimada, Masaharu ;   et al. | 2002-02-21 |
Method of forming a ball bond using a bonding capillary App 20010005054 - Higashi, Kazushi ;   et al. | 2001-06-28 |
Method of forming a ball bond using a bonding capillary Grant 6,207,549 - Higashi , et al. March 27, 2 | 2001-03-27 |
Method of packaging electronic chip component and method of bonding of electrode thereof Grant 5,744,382 - Kitayama , et al. April 28, 1 | 1998-04-28 |
Semiconductor device and method of manufacturing the same Grant 5,622,590 - Kunitomo , et al. April 22, 1 | 1997-04-22 |
Semiconductor device and method of manufacturing the same Grant 5,436,503 - Kunitomo , et al. July 25, 1 | 1995-07-25 |
Method for bonding lead of IC component with electrode Grant 5,240,170 - Nishida , et al. August 31, 1 | 1993-08-31 |
Method for bump formation and its equipment Grant 5,116,228 - Kabeshita , et al. May 26, 1 | 1992-05-26 |
Bonding method of semiconductor device Grant 4,676,864 - Maeda , et al. June 30, 1 | 1987-06-30 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.