KITAMURA; Yukihiro
Patent Applications and Registrations
Patent applications and USPTO patent grants for KITAMURA; Yukihiro.The latest application filed is for "semiconductor module and method for manufacturing same".
- KITAMURA; Yukihiro - Tokyo JP
- Kitamura; Yukihiro - Nagano JP
- Kitamura, Yukihiro - Shiojiri-shi JP
| Patent | Date |
|---|---|
| Semiconductor Module And Method For Manufacturing Same App 20200388553 - NISHIDA; Yuhei ; et al. | 2020-12-10 |
| Metal/ceramic bonding substrate and method for producing same Grant 9,944,565 - Osanai , et al. April 17, 2 | 2018-04-17 |
| Metal/ceramic Bonding Substrate And Method For Producing Same App 20150284296 - Osanai; Hideyo ; et al. | 2015-10-08 |
| Metal-coated substrate and manufacturing method of the same App 20060292383 - Kohayashi; Shuichi ; et al. | 2006-12-28 |
| Metal coated substrate and manufacturing method of the same App 20060093838 - Kohayashi; Shuichi ; et al. | 2006-05-04 |
| Metal/ceramic bonding article and method for producing same Grant 6,858,151 - Tsukaguchi , et al. February 22, 2 | 2005-02-22 |
| Ceramic circuit board and power module Grant 6,791,180 - Kitamura , et al. September 14, 2 | 2004-09-14 |
| Metal/ceramic bonding article and method for producing same Grant 6,780,520 - Tsukaguchi , et al. August 24, 2 | 2004-08-24 |
| Method for producing metal/ceramic bonding substrate App 20040149689 - Ning, Xiao-Shan ; et al. | 2004-08-05 |
| Metal/ceramic bonding article and method for producing same App 20030232205 - Tsukaguchi, Nobuyoshi ; et al. | 2003-12-18 |
| Metal/ceramic bonding article and method for producing same App 20030232204 - Tsukaguchi, Nobuyoshi ; et al. | 2003-12-18 |
| Ceramic circuit board and power module App 20030173660 - Kitamura, Yukihiro ; et al. | 2003-09-18 |
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