Kitamura; Yoichi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kitamura; Yoichi.The latest application filed is for "array antenna apparatus and method for fabricating same".
- Kitamura; Yoichi - Tokyo JP
- KITAMURA; Yoichi - Chiyoda-ku Tokyo
- Kitamura; Yoichi - Takarazuka JP
- Kitamura; Yoichi - Hyogo JP
- Kitamura; Yoichi - Yokohama JP
| Patent | Date |
|---|---|
| Vacuum flask Grant D942,201 - Kitamura February 1, 2 | 2022-02-01 |
| Array antenna apparatus and method for fabricating same Grant 11,211,710 - Kitamura , et al. December 28, 2 | 2021-12-28 |
| Flexible printed circuit board and joined body Grant 10,863,625 - Nagamine , et al. December 8, 2 | 2020-12-08 |
| Array Antenna Apparatus and Method For Fabricating Same App 20200235478 - KITAMURA; Yoichi ; et al. | 2020-07-23 |
| Array antenna apparatus and method of manufacturing the same Grant 10,714,838 - Kitamura , et al. | 2020-07-14 |
| Flexible Printed Circuit Board and Joined Body App 20200146150 - NAGAMINE; Takumi ; et al. | 2020-05-07 |
| Irreversible Circuit Element, Irreversible Circuit Device, And Method For Manufacturing Said Element And Device App 20190139702 - KITAMURA; Yoichi ; et al. | 2019-05-09 |
| Array Antenna Apparatus And Method Of Manufacturing The Same App 20170229784 - KITAMURA; Yoichi ; et al. | 2017-08-10 |
| Multifunction measuring instrument Grant D719,472 - Sakaue , et al. December 16, 2 | 2014-12-16 |
| Electronic component package Grant 8,912,453 - Hashimoto , et al. December 16, 2 | 2014-12-16 |
| Semiconductor chip and radio frequency circuit Grant 8,548,416 - Suzuki , et al. October 1, 2 | 2013-10-01 |
| Electronic Component Package App 20120273264 - Hashimoto; Minoru ; et al. | 2012-11-01 |
| Process for producing a circuit module Grant 8,240,037 - Kitamura , et al. August 14, 2 | 2012-08-14 |
| Even harmonic mixer Grant 8,229,387 - Kawakami , et al. July 24, 2 | 2012-07-24 |
| Even Harmonic Mixer App 20100315177 - Kawakami; Kenji ; et al. | 2010-12-16 |
| Process for preparing a metal coating material comprising condensation polymerized resin nanoparticles Grant 7,763,315 - Yamazaki , et al. July 27, 2 | 2010-07-27 |
| Circuit module and process for producing the same Grant 7,738,263 - Kitamura , et al. June 15, 2 | 2010-06-15 |
| Circuit module and process for producing the same App 20100126008 - Kitamura; Yoichi ; et al. | 2010-05-27 |
| Semiconductor Chip And Radio Frequency Circuit App 20100117711 - Suzuki; Takuya ; et al. | 2010-05-13 |
| Circuit Module and process for producing the same App 20080174983 - Kitamura; Yoichi ; et al. | 2008-07-24 |
| Coating material for metal and metallic container coated with the coating material App 20060292382 - Yamazaki; Masao ; et al. | 2006-12-28 |
| Connection structure for high-frequency circuit substrate, manufacturing method thereof and high frequency circuit device Grant 6,791,439 - Kitamura , et al. September 14, 2 | 2004-09-14 |
| Connection structure for high-frequency circuit substrate, manufacturing method thereof and high frequency circuit device App 20040080386 - Kitamura, Yoichi ; et al. | 2004-04-29 |
| Surface-treated steel plate and bonded structure of metal material Grant 4,916,031 - Kitamura , et al. April 10, 1 | 1990-04-10 |
| Retortable bonded can Grant 4,392,582 - Kitamura , et al. July 12, 1 | 1983-07-12 |
| Side seam-coated tin-free steel welded can Grant 4,384,657 - Ueno , et al. May 24, 1 | 1983-05-24 |
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