Kitamura; Wahei

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kitamura; Wahei.The latest application filed is for "method of manufacturing semiconductor device".

Company Profile

0.11.8

Kitamura; Wahei - Nakano JP
Kitamura; Wahei - Kodaira JP
Kitamura, Wahei - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of manufacturing semiconductor device Grant 7,785,986 - Matsubara , et al. August 31, 2	2010-08-31
Method Of Manufacturing Semiconductor Device App 20090176333 - MATSUBARA; Yoshihisa ; et al.	2009-07-09
Method of transporting semiconductor device and method of manufacturing semiconductor device Grant 7,504,315 - Matsubara , et al. March 17, 2	2009-03-17
Method for carrying a semiconductor device App 20070235371 - Suzuki; Hiromichi ; et al.	2007-10-11
Method for carrying a semiconductor device Grant 7,261,207 - Suzuki , et al. August 28, 2	2007-08-28
Surface package type semiconductor package and method of producing semiconductor memory Grant 6,981,585 - Kitamura , et al. January 3, 2	2006-01-03
Method of transporting semiconductor device and method of manufacturing semiconductor device App 20050147488 - Matsubara, Yoshihisa ; et al.	2005-07-07
Method for carrying a semiconductor device App 20040181938 - Suzuki, Hiromichi ; et al.	2004-09-23
Surface package type semiconductor package and method of producing semiconductor memory App 20030057113 - Kitamura, Wahei ; et al.	2003-03-27
Surface package type semiconductor package and method of producing semiconductor memory App 20020179460 - Kitamura, Wahei ; et al.	2002-12-05
Surface package type semiconductor package and method of producing semiconductor memory App 20020174627 - Kitamura, Wahei ; et al.	2002-11-28
Surface package type semiconductor package and method of producing semiconductor memory App 20010015327 - Kitamura, Wahei ; et al.	2001-08-23
Surface package type semiconductor package and method of producing semiconductor memory Grant 5,607,059 - Kitamura , et al. March 4, 1	1997-03-04
Method of producing semiconductor memory Grant 5,295,297 - Kitamura , et al. March 22, 1	1994-03-22
Method of producing surface package type semiconductor package Grant 5,274,914 - Kitamura , et al. January 4, 1	1994-01-04
Method of producing semiconductor memory packages Grant 5,095,626 - Kitamura , et al. March 17, 1	1992-03-17
Process of producing semiconductor device Grant 4,994,411 - Naito , et al. February 19, 1	1991-02-19
Surface package type semiconductor package Grant 4,971,196 - Kitamura , et al. November 20, 1	1990-11-20
Semiconductor device and method of manufacturing the same Grant 4,845,543 - Okikawa , et al. July 4, 1	1989-07-04

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