Kitamura; Kimio

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kitamura; Kimio.The latest application filed is for "substrate processing apparatus, heating apparatus for use in the same, method of manufacturing semiconductors with those apparatuses, and heating element supporting structure".

Company Profile

0.5.5

Kitamura; Kimio - Osaka JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Heating apparatus, substrate processing apparatus employing the same, method of manufacturing semiconductor devices, and insulator Grant 9,184,069 - Hayashida , et al. November 10, 2	2015-11-10
Heating apparatus, substrate processing apparatus employing the same, method of manufacturing semiconductor devices, and extending member Grant 8,158,911 - Hayashida , et al. April 17, 2	2012-04-17
Heating apparatus, substrate processing apparatus, and method of manufacturing semiconductor devices Grant 8,116,618 - Hayashida , et al. February 14, 2	2012-02-14
Substrate processing apparatus, heating apparatus for use in the same, method of manufacturing semiconductors with those apparatuses, and heating element supporting structure Grant 7,863,204 - Miyata , et al. January 4, 2	2011-01-04
Substrate processing apparatus, heating apparatus for use in the same, method of manufacturing semiconductors with those apparatuses, and heating element supporting structure App 20090035948 - Miyata; Toshimitsu ; et al.	2009-02-05
Heating apparatus, substrate processing apparatus employing the same, method of manufacturing semiconductor devices, and extending member App 20090014428 - Hayashida; Akira ; et al.	2009-01-15
Heating apparatus, substrate processing apparatus employing the same, method of manufacturing semiconductor devices, and insulator App 20090014435 - Hayashida; Akira ; et al.	2009-01-15
Heating apparatus, substrate processing apparatus, and method of manufacturing semiconductor devices App 20090016706 - Hayashida; Akira ; et al.	2009-01-15
Heater supporting structure and heating furnace for bending a glass sheet App 20020005404 - Maeda, Kenji ; et al.	2002-01-17

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