Kitamura; Kazunori

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kitamura; Kazunori.The latest application filed is for "method for manufacturing hole-filling printed wiring board, curable resin composition and hole-filling printed wiring board".

Company Profile

0.13.15

Kitamura; Kazunori - Saitama JP
Kitamura; Kazunori - Tokyo N/A JP
Kitamura; Kazunori - Saitama-ken JP
KITAMURA; Kazunori - Kounosu-shi JP
Kitamura; Kazunori - Kariya-shi JP
Kitamura, Kazunori - Aichi-ken JP
Kitamura, Kazunori - Kita-ku JP
Kitamura; Kazunori - Yokohama JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for manufacturing hole-filling printed wiring board, curable resin composition and hole-filling printed wiring board Grant 9,732,183 - Usui , et al. August 15, 2	2017-08-15
Method For Manufacturing Hole-filling Printed Wiring Board, Curable Resin Composition And Hole-filling Printed Wiring Board App 20170066868 - USUI; Yukihiro ; et al.	2017-03-09
Solder-mounted board, production method therefor, and semiconductor device Grant 9,565,754 - Kitamura February 7, 2	2017-02-07
Resin composition for solder bump formation, solder bump formation method, and member having solder bumps Grant 9,415,469 - Takase , et al. August 16, 2	2016-08-16
Surface mounting method utilizing active resin composition Grant 9,072,205 - Kitamura , et al. June 30, 2	2015-06-30
Surface Mounting Method Utilizing Active Resin Composition App 20150158103 - KITAMURA; Kazunori ; et al.	2015-06-11
Resin Composition For Solder Bump Formation, Solder Bump Formation Method, And Member Having Solder Bumps App 20150027768 - TAKASE; Yasuhiro ; et al.	2015-01-29
Printed wiring board and method for producing the same Grant 8,758,986 - Saito , et al. June 24, 2	2014-06-24
Solder-mounted Board, Production Method Therefor, And Semiconductor Device App 20130264105 - KITAMURA; Kazunori	2013-10-10
Method for surface mounting using cleaning-free activated resinous composition Grant 8,551,819 - Kitamura , et al. October 8, 2	2013-10-08
Curable resin composition, halogen-free resin substrate, and halogen-free build-up printed wiring board Grant 8,232,477 - Kitamura , et al. July 31, 2	2012-07-31
Active Resin Composition, Surface Mounting Method And Printed Wiring Board App 20120168219 - KITAMURA; Kazunori ; et al.	2012-07-05
Method For Surface Mounting Using Cleaning-free Activated Resinous Composition App 20120153009 - KITAMURA; Kazunori ; et al.	2012-06-21
Printed Wiring Board And Method For Producing The Same App 20110132639 - SAITO; Takeshi ; et al.	2011-06-09
Cleaning-free Activated Resinous Composition And Method For Surface Mounting Using The Same App 20110031300 - Kitamura; Kazunori ; et al.	2011-02-10
Curable Resin Composition, Halogen-free Resin Substrate, And Halogen-free Build-up Printed Wiring Board App 20100006324 - KITAMURA; Kazunori ; et al.	2010-01-14
Smooth board and process for preparing a smooth board Grant 7,410,673 - Sato , et al. August 12, 2	2008-08-12
Photo-setting and thermosetting resin composition, process for preparing plugged-through-hole printed wiring board and plugged-through-hole printed wiring board Grant 7,396,885 - Sato , et al. July 8, 2	2008-07-08
Organic electroluminescent display panel App 20070188093 - Nagara; Yoshiaki ; et al.	2007-08-16
Multilayer circuit board and method of producing the same App 20060042832 - Sato; Kiyoshi ; et al.	2006-03-02
Organic EL device and method of manufacturing the same App 20050218803 - Takeuchi, Kazuyoshi ; et al.	2005-10-06
Thermosetting resin composition App 20050019582 - Sato, Kiyoshi ; et al.	2005-01-27
Composition of epoxy resin-unsaturated acid adduct, (meth)acrylate and crystallizable epoxy resin Grant 6,812,299 - Sato , et al. November 2, 2	2004-11-02
Photo-setting and thermosetting resin composition, process for preparing plugged-through-hole printed wiring board and plugged-through-hole printed wiring board App 20030215567 - Sato, Kiyoshi ; et al.	2003-11-20
Thermosetting resin composition App 20030162898 - Sato, Kiyoshi ; et al.	2003-08-28
Metal seal flange assembly Grant 4,988,130 - Obara , et al. January 29, 1	1991-01-29

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