Kitakado; Ryuji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kitakado; Ryuji.The latest application filed is for "high pressure processing method".

Company Profile

0.17.9

Kitakado; Ryuji - Kyoto JP
Kitakado; Ryuji - Kamikyo-Ku JP
Kitakado; Ryuji - Kyoto-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
High pressure processing method Grant 7,252,719 - Sakashita , et al. August 7, 2	2007-08-07
High pressure processing apparatus and method Grant 7,111,630 - Mizobata , et al. September 26, 2	2006-09-26
High pressure processing apparatus and method Grant 7,080,651 - Mizobata , et al. July 25, 2	2006-07-25
High pressure processing apparatus and high pressure processing method Grant 7,000,653 - Sakashita , et al. February 21, 2	2006-02-21
High Pressure Processing Method App 20060032520 - Sakashita; Yoshihiko ; et al.	2006-02-16
High pressure processing apparatus Grant 6,874,513 - Yamagata , et al. April 5, 2	2005-04-05
Substrate processing apparatus equipping with high-pressure processing unit Grant 6,841,031 - Iwata , et al. January 11, 2	2005-01-11
High pressure processing apparatus and high pressure processing method Grant 6,823,880 - Sakashita , et al. November 30, 2	2004-11-30
High pressure processing apparatus and method App 20040231698 - Mizobata, Ikuo ; et al.	2004-11-25
High pressure processing apparatus and high pressure processing method App 20040194842 - Sakashita, Yoshihiko ; et al.	2004-10-07
Method and system for processing substrate Grant 6,703,316 - Inoue , et al. March 9, 2	2004-03-09
High-pressure drying apparatus, high-pressure drying method and substrate processing apparatus Grant 6,691,430 - Saito , et al. February 17, 2	2004-02-17
High-pressure drying apparatus, high-pressure drying method and substrate processing apparatus App 20030177659 - Saito, Kimitsugu ; et al.	2003-09-25
Substrate processing apparatus equipping with high-pressure processing unit App 20030019578 - Iwata, Tomomi ; et al.	2003-01-30
High pressure processing apparatus and high pressure processing method App 20020179114 - Sakashita, Yoshihiko ; et al.	2002-12-05
High pressure processing apparatus and method App 20020170577 - Mizobata, Ikuo ; et al.	2002-11-21
Method and system for processing substrate App 20020160625 - Inoue, Yoichi ; et al.	2002-10-31
High-pressure processing apparatus App 20020148492 - Yamagata, Masahiro ; et al.	2002-10-17
Apparatus for processing a substrate providing an efficient arrangement and atmospheric isolation of chemical treatment section Grant 6,099,643 - Ohtani , et al. August 8, 2	2000-08-08
Substrate processing apparatus Grant 5,963,753 - Ohtani , et al. October 5, 1	1999-10-05
Method of and apparatus for inspecting the minimum annular width of a land on a printed circuit board Grant 5,408,538 - Kitakado , et al. April 18, 1	1995-04-18
Method of and apparatus for obtaining binary image Grant 5,315,409 - Matsumura , et al. May 24, 1	1994-05-24
Method of and apparatus for inspecting conductive pattern on printed board Grant 5,144,681 - Kitakado , et al. September 1, 1	1992-09-01
Method of and apparatus for inspecting conductive pattern on printed board Grant 5,027,417 - Kitakado , et al. June 25, 1	1991-06-25
Method of and apparatus for detecting pattern defects Grant 4,803,734 - Onishi , et al. February 7, 1	1989-02-07
Pattern masking method and an apparatus therefor Grant 4,797,939 - Hoki , et al. January 10, 1	1989-01-10

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