Kitajima; Masayuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kitajima; Masayuki.The latest application filed is for "filter and multiplexer".

Company Profile

1.22.44

Kitajima; Masayuki - Tokyo JP
Kitajima; Masayuki - Yokohama JP
Kitajima; Masayuki - Kawasaki N/A JP
KITAJIMA; Masayuki - Kawasaki-shi JP
Kitajima; Masayuki - Yokohama-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Filter and multiplexer Grant 11,012,048 - Numata , et al. May 18, 2	2021-05-18
Power-demand-value calculating system, power-demand-value calculating method, and recording medium recording power-demand-value calculating program Grant 10,989,743 - Kitajima , et al. April 27, 2	2021-04-27
Filter And Multiplexer App 20200244246 - NUMATA; Toshimasa ; et al.	2020-07-30
Power-demand-value Calculating System, Power-demand-value Calculating Method, And Recording Medium Recording Power-demand-value Calculating Program App 20180321288 - Kitajima; Masayuki ; et al.	2018-11-08
Method of mounting semiconductor element, and semiconductor device Grant 9,615,464 - Kubota , et al. April 4, 2	2017-04-04
Ordering Program, Ordering Device, And Ordering Method App 20170032448 - Kitajima; Masayuki ; et al.	2017-02-02
Optical unit in which optical element is mounted on base having optical wave guide and method of manufacturing the same Grant 9,195,003 - Yamakami , et al. November 24, 2	2015-11-24
Method of determining reinforcement position of circuit substrate and substrate assembly Grant 9,053,262 - Kobayashi , et al. June 9, 2	2015-06-09
Method Of Mounting Semiconductor Element, And Semiconductor Device App 20140285989 - KUBOTA; Takashi ; et al.	2014-09-25
Optical Unit And Method Of Manufacturing The Same App 20140086525 - YAMAKAMI; TAKATOYO ; et al.	2014-03-27
Substrate Module, Electronic Apparatus, And Manufacturing Method For Electronic Apparatus App 20140036198 - KITAJIMA; Masayuki	2014-02-06
Board reinforcing structure, board assembly, and electronic device Grant 8,604,347 - Kobayashi , et al. December 10, 2	2013-12-10
Conductive Bonding Material, Method Of Manufacturing The Same, And Method Of Manufacturing Electronic Device App 20130313309 - KITAJIMA; Masayuki ; et al.	2013-11-28
Component Adhesive Bonding Structure And Component Separation Method App 20130233494 - NODA; Yutaka ; et al.	2013-09-12
Conductive Bonding Material, Electronic Component, And Electronic Device App 20130140069 - KITAJIMA; Masayuki ; et al.	2013-06-06
Method Of Determining Reinforcement Position Of Circuit Substrate And Substrate Assembly App 20130128477 - KOBAYASHI; Hiroshi ; et al.	2013-05-23
Electroconductive bonding material, method for bonding conductor, and method for manufacturing semiconductor device Grant 8,418,910 - Yamakami , et al. April 16, 2	2013-04-16
Board Module Manufacturing Method, Board Module, And Board Module Assembly App 20130088839 - YAMAKAMI; Takatoyo ; et al.	2013-04-11
Conductive Bonding Material, Conductor Bonding Method, And Semiconductor Device Production Method App 20130087605 - KUBOTA; Takashi ; et al.	2013-04-11
Circuit board with kneaded conductive paste Grant 8,314,339 - Kitajima , et al. November 20, 2	2012-11-20
Electronic Component, Electronic Equipment, And Soldering Paste App 20120248616 - KITAJIMA; Masayuki ; et al.	2012-10-04
Electroconductive Bonding Material, Method For Bonding Conductor, And Method For Manufacturing Semiconductor Device App 20120211549 - YAMAKAMI; Takatoyo ; et al.	2012-08-23
Display Bonding Device And Method App 20120024475 - KITAJIMA; Masayuki ; et al.	2012-02-02
Mounting Structure, Electronic Component, Circuit Board, Board Assembly, Electronic Device, And Stress Relaxation Member App 20110303450 - OKADA; Toru ; et al.	2011-12-15
Circuit Board, Circuit Board Assembly, And Semiconductor Device App 20110304059 - KOBAYASHI; Hiroshi ; et al.	2011-12-15
Board Reinforcing Structure, Board Assembly, And Electronic Device App 20110303441 - KOBAYASHI; Hiroshi ; et al.	2011-12-15
Packaging Structure, Printed Circuit Board Assembly And Fixing Method App 20110303449 - KOBAYASHI; Hiroshi ; et al.	2011-12-15
Mount Structure, Electronic Apparatus, Stress Relieving Unit, And Method Of Manufacturing Stress Relieving Unit App 20110303443 - KITAJIMA; Masayuki ; et al.	2011-12-15
Method Of Forming Solder Dam App 20110163152 - KITAJIMA; Masayuki ; et al.	2011-07-07
Apparatus For Forming Solder Dam App 20110165338 - KITAJIMA; Masayuki ; et al.	2011-07-07
Apparatus For Forming Solder Dam And Method Of Forming Solder Dam App 20110165319 - KITAJIMA; Masayuki ; et al.	2011-07-07
Surface acoustic wave device and method of fabricating the same Grant 7,911,116 - Aikawa , et al. March 22, 2	2011-03-22
Method of manufacturing an acoustic wave device Grant 7,841,064 - Aikawa , et al. November 30, 2	2010-11-30
Printed Wiring Board App 20100006325 - KITAJIMA; Masayuki ; et al.	2010-01-14
Surface Acoustic Wave Device And Method Of Fabricating The Same App 20090236934 - AIKAWA; Shunichi ; et al.	2009-09-24
Method of making zinc-aluminum alloy connection Grant 7,565,739 - Kitajima , et al. July 28, 2	2009-07-28
Acoustic Wave Device And Method Of Manufacturing The Same App 20090175470 - Aikawa; Shunichi ; et al.	2009-07-09
Circuit board, method of forming wiring pattern, and method of manufacturing circuit board App 20090044972 - Kitajima; Masayuki ; et al.	2009-02-19
Zinc-aluminum solder alloy Grant 7,425,765 - Kitajima , et al. September 16, 2	2008-09-16
Acoustic wave device and method of manufacturing the same App 20080125662 - Aikawa; Shunichi ; et al.	2008-05-29
Electrically conductive paste and method of making the same App 20080102294 - Kitajima; Masayuki ; et al.	2008-05-01
Method of producing a micro-actuator Grant 7,356,894 - Fujii , et al. April 15, 2	2008-04-15
Product including conductor made of zinc or zinc aluminum alloy App 20070170593 - Kitajima; Masayuki ; et al.	2007-07-26
Zinc-aluminum solder alloy App 20060125105 - Kitajima; Masayuki ; et al.	2006-06-15
Micro-actuator and method of producing the same App 20050104477 - Fujii, Masanao ; et al.	2005-05-19
Solder alloy and soldered bond Grant 6,893,512 - Kitajima , et al. May 17, 2	2005-05-17
Method of producing a micro-actuator Grant 6,848,154 - Fujii , et al. February 1, 2	2005-02-01
Semiconductor device with gold bumps, and method and apparatus of producing the same Grant 6,786,385 - Kitajima , et al. September 7, 2	2004-09-07
Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method Grant 6,744,183 - Kitajima , et al. June 1, 2	2004-06-01
Micro-actuator and method of producing the same Grant 6,653,761 - Fujii , et al. November 25, 2	2003-11-25
Micro-actuator and method of producing the same App 20030184191 - Fujii, Masanao ; et al.	2003-10-02
Solder alloy and soldered bond App 20030143104 - Kitajima, Masayuki ; et al.	2003-07-31
Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method App 20030137223 - Kitajima, Masayuki ; et al.	2003-07-24
Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy App 20030095888 - Kitajima, Masayuki ; et al.	2003-05-22
Solder paste and electronic device App 20020102432 - Ochiai, Masayuki ; et al.	2002-08-01
Semiconductor device with gold bumps, and method and apparatus of producing the same App 20020100972 - Kitajima, Masayuki ; et al.	2002-08-01
Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method App 20020074902 - Kitajima, Masayuki ; et al.	2002-06-20
Method of assembling micro-actuator App 20020059717 - Okada, Toru ; et al.	2002-05-23
Micro-actuator and method of producing the same App 20020050767 - Fujii, Masanao ; et al.	2002-05-02
Soldering method and soldered joint App 20020018844 - Kitajima, Masayuki ; et al.	2002-02-14
Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy App 20010001990 - Kitajima, Masayuki ; et al.	2001-05-31
Lead-free solder composition with Bi, In and Sn Grant 6,184,475 - Kitajima , et al. February 6, 2	2001-02-06
Method of forming bumps and template used for forming bumps Grant 6,107,181 - Kitajima , et al. August 22, 2	2000-08-22

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