Kitajima; Masakuni
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kitajima; Masakuni.The latest application filed is for "substrate holding apparatus".
- Kitajima; Masakuni - Nagano JP
- Kitajima; Masakuni - Nagano-shi JP
| Patent | Date |
|---|---|
| Substrate holding apparatus Grant 11,056,369 - Kitajima July 6, 2 | 2021-07-06 |
| Substrate Holding Apparatus App 20190295876 - KITAJIMA; Masakuni | 2019-09-26 |
| Substrate having leads Grant 8,735,737 - Ihara , et al. May 27, 2 | 2014-05-27 |
| Heat radiation component and semiconductor package including same Grant 8,674,499 - Murayama , et al. March 18, 2 | 2014-03-18 |
| Lead pin and wiring substrate with lead pin, and method of manufacturing the same Grant 8,314,349 - Kitajima November 20, 2 | 2012-11-20 |
| Heat Radiation Component And Semiconductor Package Including Same App 20110291258 - MURAYAMA; Kei ; et al. | 2011-12-01 |
| Lead Pin And Wiring Substrate With Lead Pin, And Method Of Manufacturing The Same App 20110103029 - KITAJIMA; Masakuni | 2011-05-05 |
| Substrate Having Leads App 20100300742 - Ihara; Yoshihiro ; et al. | 2010-12-02 |
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