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name:-0.0076189041137695
name:-0.0060479640960693
name:-0.0003819465637207
Kitajima; Hiroyasu Patent Filings

Kitajima; Hiroyasu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kitajima; Hiroyasu.The latest application filed is for "semiconductor device and method of manufacturing semiconductor device".

Company Profile
0.6.7
  • Kitajima; Hiroyasu - Ibaraki JP
  • Kitajima; Hiroyasu - Fukui N/A JP
  • Kitajima; Hiroyasu - Kanagawa JP
  • Kitajima; Hiroyasu - Tokyo JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor device and method of manufacturing semiconductor device
Grant 10,032,785 - Kitajima July 24, 2
2018-07-24
Down-proof woven fabric
Grant 9,920,460 - Kitagawa , et al. March 20, 2
2018-03-20
Semiconductor Device And Method Of Manufacturing Semiconductor Device
App 20170062448 - KITAJIMA; Hiroyasu
2017-03-02
Semiconductor device having crack-resisting ring structure and manufacturing method thereof
Grant 9,559,063 - Watanabe , et al. January 31, 2
2017-01-31
Semiconductor Device Having Crack-resisting Ring Structure And Manufacturing Method Thereof
App 20140027928 - WATANABE; Takeshi ;   et al.
2014-01-30
Down-proof Woven Fabric
App 20120183754 - Kitagawa; Tsunemitsu ;   et al.
2012-07-19
Semiconductor Integrated Circuit Device
App 20110079834 - YANAGISAWA; Masayuki ;   et al.
2011-04-07
Semiconductor integrated circuit device and dummy pattern arrangement method
Grant 7,772,070 - Kitajima , et al. August 10, 2
2010-08-10
Semiconductor device and method of manufacturing the same
App 20100032740 - Kitajima; Hiroyasu
2010-02-11
Hemispherical silicon grain capacitor with variable grain size
Grant 7,298,002 - Kitamura , et al. November 20, 2
2007-11-20
Semiconductor integrated circuit device and dummy pattern arrangement method
App 20070221957 - Kitajima; Hiroyasu ;   et al.
2007-09-27
Semiconductor device and method for manufacturing the same
App 20060022251 - Kitamura; Hiroyuki ;   et al.
2006-02-02

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