Kitajima; Hiromichi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kitajima; Hiromichi.The latest application filed is for "radio-frequency module and communication device".
- Kitajima; Hiromichi - Kyoto JP
- Kitajima; Hiromichi - Nagaokakyo JP
- KITAJIMA; Hiromichi - Nagaokakyo-shi JP
- Kitajima; Hiromichi - Takefu JP
- Kitajima, Hiromichi - Takefu-shi JP
| Patent | Date |
|---|---|
| Radio-frequency module and communication apparatus Grant 11,431,361 - Kitajima , et al. August 30, 2 | 2022-08-30 |
| Radio frequency module and communication device Grant 11,424,768 - Kitajima August 23, 2 | 2022-08-23 |
| Filter module and high frequency module Grant 11,362,634 - Murase , et al. June 14, 2 | 2022-06-14 |
| Radio-frequency Module And Communication Device App 20220102296 - KITAJIMA; Hiromichi | 2022-03-31 |
| Radio-frequency Module And Communication Apparatus App 20220052713 - KITAJIMA; Hiromichi ; et al. | 2022-02-17 |
| Radio Frequency Module And Communication Apparatus App 20220021510 - TAHARA; Kenji ; et al. | 2022-01-20 |
| Coupler Module App 20210234247 - TOKUDA; Daisuke ; et al. | 2021-07-29 |
| Radio Frequency Module And Communication Device App 20210203365 - KITAJIMA; Hiromichi | 2021-07-01 |
| Filter Module And High Frequency Module App 20200366263 - MURASE; Hisanori ; et al. | 2020-11-19 |
| Circuit module Grant 10,326,489 - Kitajima | 2019-06-18 |
| High-frequency front end circuit Grant 10,027,353 - Uejima , et al. July 17, 2 | 2018-07-17 |
| Ceramic multilayer wiring substrate and module including the same Grant 10,002,710 - Kitajima June 19, 2 | 2018-06-19 |
| Circuit module Grant 9,961,764 - Kitajima May 1, 2 | 2018-05-01 |
| Radio frequency front-end circuit Grant 9,960,898 - Uejima , et al. May 1, 2 | 2018-05-01 |
| High-frequency module Grant 9,948,269 - Kitajima April 17, 2 | 2018-04-17 |
| Multilayer wiring board Grant 9,844,138 - Kitajima December 12, 2 | 2017-12-12 |
| Composite module Grant 9,686,858 - Kitajima June 20, 2 | 2017-06-20 |
| High-frequency Module App 20170149469 - KITAJIMA; Hiromichi | 2017-05-25 |
| Multilayer wiring substrate and module including same Grant 9,538,644 - Kitajima January 3, 2 | 2017-01-03 |
| High-frequency Front End Circuit App 20160352365 - UEJIMA; Takanori ; et al. | 2016-12-01 |
| Radio Frequency Front-end Circuit App 20160352494 - UEJIMA; Takanori ; et al. | 2016-12-01 |
| High-frequency module Grant 9,461,619 - Nurikabe , et al. October 4, 2 | 2016-10-04 |
| Multilayer wiring board Grant 9,370,092 - Kitajima June 14, 2 | 2016-06-14 |
| High-frequency module Grant 9,319,092 - Kitajima April 19, 2 | 2016-04-19 |
| Multilayer Wiring Board App 20160057862 - KITAJIMA; Hiromichi | 2016-02-25 |
| High frequency module Grant 9,220,164 - Kitajima December 22, 2 | 2015-12-22 |
| Multilayer substrate module Grant 9,119,318 - Kogure , et al. August 25, 2 | 2015-08-25 |
| High frequency module Grant 9,118,298 - Kitajima August 25, 2 | 2015-08-25 |
| High Frequency Module App 20150216033 - KITAJIMA; Hiromichi | 2015-07-30 |
| Multilayer Wiring Board App 20150216034 - KITAJIMA; Hiromichi | 2015-07-30 |
| Composite Module App 20150080050 - KITAJIMA; Hiromichi | 2015-03-19 |
| High Frequency Module App 20150054599 - KITAJIMA; Hiromichi | 2015-02-26 |
| Duplexer and circuit module including the same Grant 8,963,652 - Kitajima February 24, 2 | 2015-02-24 |
| Multilayer Wiring Substrate And Module Including Same App 20140305686 - KITAJIMA; Hiromichi | 2014-10-16 |
| Ceramic Multilayer Wiring Substrate And Module Including The Same App 20140307406 - KITAJIMA; Hiromichi | 2014-10-16 |
| High-frequency module Grant 8,861,498 - Kitajima October 14, 2 | 2014-10-14 |
| High-frequency Module App 20140218127 - NURIKABE; Yuji ; et al. | 2014-08-07 |
| Multilayer Substrate Module App 20140202750 - KOGURE; Takeshi ; et al. | 2014-07-24 |
| Circuit Module App 20140179364 - KITAJIMA; Hiromichi | 2014-06-26 |
| Circuit Module App 20140055965 - KITAJIMA; Hiromichi | 2014-02-27 |
| Duplexer And Circuit Module Including The Same App 20140043112 - KITAJIMA; Hiromichi | 2014-02-13 |
| High-frequency Module App 20130329611 - KITAJIMA; Hiromichi | 2013-12-12 |
| High-frequency Module App 20120087285 - KITAJIMA; Hiromichi | 2012-04-12 |
| Laminated electronic component Grant 7,151,321 - Kitajima , et al. December 19, 2 | 2006-12-19 |
| Laminated electronic component App 20040256714 - Kitajima, Hiromichi ; et al. | 2004-12-23 |
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