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Kitaichi; Tetsuya Patent Filings

Kitaichi; Tetsuya

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kitaichi; Tetsuya.The latest application filed is for "resin sealed module".

Company Profile
0.1.1
  • Kitaichi; Tetsuya - Kyoto JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Resin sealed module
Grant 9,583,409 - Yokoyama , et al. February 28, 2
2017-02-28
Resin Sealed Module
App 20130300002 - Yokoyama; Yasuo ;   et al.
2013-11-14

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