| Patent | Date |
|---|
Resin Composition, Prepreg, Resin-equipped Film, Resin-equipped Metal Foil, Metal-cladded Layered Sheet, And Wiring Board
App 20220289969 - KODA; Masashi ; et al. | 2022-09-15 |
Resin Composition, Prepreg, Resin-equipped Film, Resin-equipped Metal Foil, Metal-cladded Layered Sheet, And Wiring Board
App 20220275122 - KODA; Masashi ; et al. | 2022-09-01 |
Prepreg, metal-clad laminate, and wiring board
Grant 11,401,393 - Kitai , et al. August 2, 2 | 2022-08-02 |
Copper-clad Laminated Plate, Resin-clad Copper Foil, And Circuit Substrate Using Said Plate And Foil
App 20220220272 - KITAI; Yuki ; et al. | 2022-07-14 |
Metal-clad laminate, printed wiring board and metal foil with resin
Grant 11,351,755 - Kitai , et al. June 7, 2 | 2022-06-07 |
Prepreg, Metal-clad Laminate, And Wiring Board
App 20220159830 - HOSHINO; Yasunori ; et al. | 2022-05-19 |
Copper-clad Laminate Plate, Resin-attached Copper Foil, And Circuit Board Using Same
App 20220106426 - KITAI; Yuki ; et al. | 2022-04-07 |
Surface-treated Copper Foil, And Copper-clad Laminate Plate, Resin-attached Copper Foil And Circuit Board Each Using Same
App 20220087032 - KITAI; Yuki ; et al. | 2022-03-17 |
Metal-clad laminate and metal foil with resin
Grant 11,254,100 - Kitai , et al. February 22, 2 | 2022-02-22 |
Resin composition, prepreg, resin-added film, resin-added metal foil, metal-clad layered plate, and wiring plate
Grant 11,242,425 - Sato , et al. February 8, 2 | 2022-02-08 |
Resin Composition, Prepreg, Film With Resin, Metal Foil With Resin, Metal-clad Laminate, And Wiring Board
App 20210269595 - SATO; Mikio ; et al. | 2021-09-02 |
Resin Composition, Prepreg, Resin-added Film, Resin-added Metal Foil, Metal-clad Layered Plate, And Wiring Plate
App 20210246251 - SATO; Mikio ; et al. | 2021-08-12 |
Metal-clad laminate, method for producing same, metal foil with resin, and printed wiring board
Grant 10,897,818 - Kitai , et al. January 19, 2 | 2021-01-19 |
Polyphenylene ether resin composition, prepreg, metal-clad laminate and printed wiring board
Grant 10,870,721 - Kitai , et al. December 22, 2 | 2020-12-22 |
Metal-clad laminate, metal member with resin, and wiring board
Grant 10,820,413 - Inoue , et al. October 27, 2 | 2020-10-27 |
Prepreg, Metal-clad Laminate, And Wiring Board
App 20200270411 - KITAI; Yuki ; et al. | 2020-08-27 |
Prepreg, Metal-clad Laminate, And Wiring Board
App 20200247972 - Kind Code | 2020-08-06 |
Prepreg, And Metal-clad Laminated Board And Wiring Substrate Obtained Using Same
App 20200223998 - HOSHINO; Yasunori ; et al. | 2020-07-16 |
Polyphenylene ether resin composition, prepreg, metal-clad laminate and printed wiring board
Grant 10,590,223 - Kitai , et al. | 2020-03-17 |
Polyphenylene Ether Resin Composition, Prepreg, Metal-clad Laminate And Printed Wiring Board
App 20190300639 - KITAI; Yuki ; et al. | 2019-10-03 |
Metal-clad Laminate, Printed Wiring Board And Metal Foil With Resin
App 20190217576 - KITAI; YUKI ; et al. | 2019-07-18 |
Modified polyphenylene ether, method for preparing same, polyphenylene ether resin composition, resin varnish, prepreg, metal-clad laminate and printed circuit board
Grant 10,240,015 - Kitai , et al. | 2019-03-26 |
Metal-clad Laminate, Metal Member With Resin, And Wiring Board
App 20190014661 - INOUE; YUKI ; et al. | 2019-01-10 |
Metal-clad Laminate And Metal Foil With Resin
App 20180297329 - Kitai; Yuki ; et al. | 2018-10-18 |
Method of curing thermosetting resin composition, thermosetting resin composition, and PREPREG, metal-clad laminate, resin sheet, printed-wiring board, and sealing material in which thermosetting resin composition is used
Grant 10,047,213 - Fujiwara , et al. August 14, 2 | 2018-08-14 |
Thermosetting resin composition, prepreg, metal clad laminate plate, and printed wiring board
Grant 9,708,468 - Kitai , et al. July 18, 2 | 2017-07-18 |
Method Of Curing Thermosetting Resin Composition, Thermosetting Resin Composition, And Prepreg, Metal-clad Laminate, Resin Sheet, Printed-wiring Board, And Sealing Material In Which Thermosetting Resin Composition Is Used
App 20170190875 - FUJIWARA; Hiroaki ; et al. | 2017-07-06 |
Metal-clad Laminate, Method For Producing Same, Metal Foil With Resin, And Printed Wiring Board
App 20170164469 - KITAI; YUKI ; et al. | 2017-06-08 |
Method of curing thermosetting resin composition, thermosetting resin composition, and prepreg, metal-clad laminate, resin sheet, printed-wiring board, and sealing material in which thermosetting resin composition is used
Grant 9,637,598 - Fujiwara , et al. May 2, 2 | 2017-05-02 |
Resin composition, resin varnish, prepreg, metal-clad laminate and printed wiring board
Grant 9,567,481 - Saito , et al. February 14, 2 | 2017-02-14 |
Thermosetting Resin Composition, And Resin Varnish, Metal Foil With Resin, Resin Film, Metal-clad Laminate, And Printed Wiring Board Using The Same
App 20170029619 - LIN; LIN ; et al. | 2017-02-02 |
Resin composition, resin varnish, prepreg, metal-clad laminate, and printed wiring board
Grant 9,528,026 - Sagara , et al. December 27, 2 | 2016-12-27 |
Polyphenylene Ether Resin Composition, Prepreg, Metal-clad Laminate And Printed Wiring Board
App 20160145370 - KITAI; Yuki ; et al. | 2016-05-26 |
Thermosetting Resin Composition, Prepreg, Metal Clad Laminate Plate, And Printed Wiring Board
App 20160060429 - KITAI; YUKI ; et al. | 2016-03-03 |
Method Of Curing Thermosetting Resin Composition, Thermosetting Resin Composition, And Prepreg, Metal-clad Laminate, Resin Sheet, Printed-wiring Board, And Sealing Material In Which Thermosetting Resin Composition Is Used
App 20150376338 - FUJIWARA; Hiroaki ; et al. | 2015-12-31 |
Resin Composition, Resin Varnish, Prepreg, Metal-clad Laminate And Printed Wiring Board
App 20150376444 - SAITO; Hirosuke ; et al. | 2015-12-31 |
Epoxy Resin Composition, Prepreg Using The Epoxy Resin Composition, Metal-clad Laminate, And Printed Wiring Board
App 20150359093 - FUJIWARA; Hiroaki ; et al. | 2015-12-10 |
Modified Polyphenylene Ether, Method For Preparing Same, Polyphenylene Ether Resin Composition, Resin Varnish, Prepreg, Metal-clad Laminate And Printed Circuit Board
App 20150218326 - Kitai; Yuki ; et al. | 2015-08-06 |
Resin Composition, Resin Varnish, Prepreg, Metal-clad Laminate, And Printed Wiring Board
App 20140182903 - Sagara; Takashi ; et al. | 2014-07-03 |
Prepreg, printed wiring board, multilayer circuit board, and process for manufacturing printed wiring board
Grant 8,409,704 - Fukuhara , et al. April 2, 2 | 2013-04-02 |
Epoxy Resin Composition, Prepreg Using The Epoxy Resin Composition, Metal-clad Laminate, And Printed Wiring Board
App 20100218982 - Fujiwara; Hiroaki ; et al. | 2010-09-02 |
Prepreg, Printed Wiring Board, Multilayer Circuit Board, And Process For Manufacturing Printed Wiring Board
App 20100044087 - Fukuhara; Yasuo ; et al. | 2010-02-25 |
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