Kitagawa; Yoshito

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kitagawa; Yoshito.The latest application filed is for "ceramic slurry composition and process for producing stacked ceramic component".

Company Profile

0.6.6

Kitagawa; Yoshito - Wesel DE
Kitagawa; Yoshito - Nara N/A JP
Kitagawa; Yoshito - Osaka JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Ceramic Slurry Composition And Process For Producing Stacked Ceramic Component App 20210380491 - Okkel; Andreas ; et al.	2021-12-09
Prepreg, laminate, metal foil-clad laminate, circuit board and LED module Grant 9,730,320 - Matsuda , et al. August 8, 2	2017-08-08
Printed wiring board, build-up multi-layer board, and production method therefor Grant 8,866,022 - Kitagawa , et al. October 21, 2	2014-10-21
Wiring Board And Light Emitting Device Using Same, And Manufacturing Method For Both App 20140225152 - ASAHI; Toshiyuki ; et al.	2014-08-14
Prepreg, laminate, metal clad laminate, circuit board, and circuit board for LED mounting Grant 8,603,624 - Matsuda , et al. December 10, 2	2013-12-10
Prepreg, Laminate, Metal Foil-clad Laminate, Circuit Board And Led Module App 20130215628 - Matsuda; Takashi ; et al.	2013-08-22
Prepreg, Laminate, Metal-foil-clad Laminate, Circuit Board, And Circuit Board For Led Mounting App 20120228010 - Matsuda; Takashi ; et al.	2012-09-13
Printed Wiring Board, Build-up Multi-layer Board, And Production Method Therefor App 20120152599 - Kitagawa; Yoshito ; et al.	2012-06-21

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