Kitae; Takashi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kitae; Takashi.The latest application filed is for "semiconductor device, method for manufacturing the same and image display".

Company Profile

0.46.44

Kitae; Takashi - Osaka N/A JP
Kitae; Takashi - Higashiosaka JP
Kitae, Takashi - Higashiosaka-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electronic component assembly Grant 9,426,899 - Kitae , et al. August 23, 2	2016-08-23
Electrode structure and method for forming bump Grant 8,887,383 - Taniguchi , et al. November 18, 2	2014-11-18
Flip-chip mounting resin composition and bump forming resin composition Grant 8,709,293 - Kitae , et al. April 29, 2	2014-04-29
Method for connecting between substrates, flip-chip mounting structure, and connection structure between substrates Grant 8,501,583 - Kitae , et al. August 6, 2	2013-08-06
Bump forming method using self-assembling resin and a wall surface Grant 8,297,488 - Karashima , et al. October 30, 2	2012-10-30
Semiconductor device having semiconductor elements formed inside a resin film substrate Grant 8,288,778 - Nakatani , et al. October 16, 2	2012-10-16
Flip chip mounting method and bump forming method Grant 8,283,246 - Kitae , et al. October 9, 2	2012-10-09
Transistor having an organic semiconductor with a hollow space Grant 8,193,526 - Nakatani , et al. June 5, 2	2012-06-05
Flip chip connection structure having powder-like conductive substance and method of producing the same Grant 8,097,958 - Sawada , et al. January 17, 2	2012-01-17
Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus Grant 8,071,425 - Nakatani , et al. December 6, 2	2011-12-06
Mounted body and method for manufacturing the same Grant 8,039,307 - Kojima , et al. October 18, 2	2011-10-18
Flip chip mounting process and flip chip assembly Grant 8,012,801 - Karashima , et al. September 6, 2	2011-09-06
Semiconductor Device, Method For Manufacturing The Same And Image Display App 20110204366 - Nakatani; Seiichi ; et al.	2011-08-25
Semiconductor Device, Method For Manufacturing The Same And Image Display App 20110204367 - Nakatani; Seiichi ; et al.	2011-08-25
Flip Chip Mounting Method And Bump Forming Method App 20110201195 - KITAE; Takashi ; et al.	2011-08-18
Flip chip mounting method and bump forming method Grant 7,951,700 - Kitae , et al. May 31, 2	2011-05-31
Electronic component mounting method Grant 7,921,551 - Yamashita , et al. April 12, 2	2011-04-12
Method for mutually connecting substrates, flip chip mounting body, and mutual connection structure between substrates Grant 7,919,357 - Sawada , et al. April 5, 2	2011-04-05
Mounted body and method for manufacturing the same Grant 7,911,064 - Komatsu , et al. March 22, 2	2011-03-22
Bump forming method and bump forming apparatus Grant 7,905,011 - Taniguchi , et al. March 15, 2	2011-03-15
Flip chip mounting method, flip chip mounting apparatus and flip chip mounting body Grant 7,875,496 - Nakatani , et al. January 25, 2	2011-01-25
Flip chip mounting method and method for connecting substrates Grant 7,820,021 - Karashima , et al. October 26, 2	2010-10-26
Process for forming bumps and solder bump Grant 7,799,607 - Karashima , et al. September 21, 2	2010-09-21
Mounted Body And Method For Manufacturing The Same App 20100224986 - Kojima; Toshiyuki ; et al.	2010-09-09
Flip Chip Mounting Body, Flip Chip Mounting Method And Flip Chip Mounting Apparatus App 20100203675 - NAKATANI; Seiichi ; et al.	2010-08-12
Flip chip mounting process and flip chip assembly Grant 7,759,162 - Karashima , et al. July 20, 2	2010-07-20
Flip Chip Mounting Process And Flip Chip Assembly App 20100148376 - Karashima; Seiji ; et al.	2010-06-17
Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus Grant 7,732,920 - Nakatani , et al. June 8, 2	2010-06-08
Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same Grant 7,714,444 - Nakatani , et al. May 11, 2	2010-05-11
Mounted body and method for manufacturing the same Grant 7,713,787 - Kojima , et al. May 11, 2	2010-05-11
Electrode Structure And Method For Forming Bump App 20100044091 - Taniguchi; Yasushi ; et al.	2010-02-25
Electronic Component Assembly, Electric Component With Solder Bump And Process For Producing The Same App 20100011572 - Kitae; Takashi ; et al.	2010-01-21
Method For Connecting Between Substrates, Flip-chip Mounting Structure, And Connection Structure Between Substrates App 20100007033 - KITAE; Takashi ; et al.	2010-01-14
Method For Mutually Connecting Substrates, Flip Chip Mounting Body, And Mutual Connection Structure Between Substrates App 20100001411 - SAWADA; Susumu ; et al.	2010-01-07
Method for forming conductive pattern and wiring board Grant 7,640,659 - Karashima , et al. January 5, 2	2010-01-05
Electronic component transporting method Grant 7,640,654 - Nakatani , et al. January 5, 2	2010-01-05
Flip chip mounting method and bump forming method Grant 7,638,883 - Karashima , et al. December 29, 2	2009-12-29
Method for forming solder bump and method for mounting semiconductor device using a solder powder resin composition Grant 7,611,040 - Kitae , et al. November 3, 2	2009-11-03
Mounted Body And Method For Manufacturing The Same App 20090230546 - Komatsu; Shingo ; et al.	2009-09-17
Bump Forming Method And Bump Forming Apparatus App 20090229120 - Taniguchi; Yasushi ; et al.	2009-09-17
Electronic Component Mounting Method and Electronic Circuit Device App 20090223705 - Yamashita; Yoshihisa ; et al.	2009-09-10
Conductive Resin Composition, Connection Method Between Electrodes Using The Same, And Electric Connection Method Between Electronic Component And Circuit Substrate Using The Same App 20090200522 - NAKATANI; Seiichi ; et al.	2009-08-13
Flip Chip Mounting Method, Flip Chip Mounting Apparatus And Flip Chip Mounting Body App 20090203170 - Nakatani; Seiichi ; et al.	2009-08-13
Method For Forming Conductive Pattern And Wiring Board App 20090133901 - Karashima; Seiji ; et al.	2009-05-28
Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same Grant 7,537,961 - Nakatani , et al. May 26, 2	2009-05-26
Flip chip mounting method and method for connecting substrates App 20090126876 - Karashima; Seiji ; et al.	2009-05-21
Flip chip mounting method and method for connecting substrates Grant 7,531,385 - Karashima , et al. May 12, 2	2009-05-12
Flip chip mounting method and bump forming method Grant 7,531,387 - Karashima , et al. May 12, 2	2009-05-12
Flip Chip Mounting Method And Method For Connecting Substrates App 20090115071 - Karashima; Seiji ; et al.	2009-05-07
Flip Chip Mounting Method And Bump Forming Method App 20090117688 - Karashima; Seiji ; et al.	2009-05-07
Connection Structure And Method Of Producing The Same App 20090102064 - Sawada; Susumu ; et al.	2009-04-23
Flip-chip Mounting Body And Flip-chip Mounting Method App 20090085227 - Shiraishi; Tsukasa ; et al.	2009-04-02
Bump Forming Method And Bump Forming Apparatus App 20090078746 - Karashima; Seiji ; et al.	2009-03-26
Flip Chip Mounting Method And Bump Forming Method App 20090023245 - Kitae; Takashi ; et al.	2009-01-22
Flip Chip Mounting Body, Flip Chip Mounting Method And Flip Chip Mounting Apparatus App 20090008800 - Nakatani; Seiichi ; et al.	2009-01-08
Electronic Component Mounted Body, Electronic Component with Solder Bump, Solder Resin Mixed Material, Electronic Component Mounting Method and Electronic Component Manufacturing Method App 20090008776 - Kitae; Takashi ; et al.	2009-01-08
Flip chip mounting method and bump forming method App 20080284046 - Karashima; Seiji ; et al.	2008-11-20
Mounted Body and Method for Manufacturing the Same App 20080251894 - Kojima; Toshiyuki ; et al.	2008-10-16
Method for Forming Solder Bump and Method for Mounting Semiconductor Device App 20080197173 - Kitae; Takashi ; et al.	2008-08-21
Flip-Chip Mounting Resin Composition and Bump Forming Resin Composition App 20080128664 - Kitae; Takashi ; et al.	2008-06-05
Flip Chip Mounting Process and Flip Chip Assembly App 20080017995 - Karashima; Seiji ; et al.	2008-01-24
Process for Forming Bumps and Solder Bump App 20070257362 - Karashima; Seiji ; et al.	2007-11-08
Conductive Resin Composition, Connection Method Between Electrodes Using The Same, And Electric Connection Method Between Electronic Component And Circuit Substrate Using The Same App 20070216023 - Nakatani; Seiichi ; et al.	2007-09-20
Electronic component transporting method App 20070175024 - Nakatani; Seiichi ; et al.	2007-08-02
Electronic part, and electronic part mounting element and an process for manufacturing such the articles Grant 7,151,306 - Kitae , et al. December 19, 2	2006-12-19
Conductive adhesive, apparatus for mounting electronic component, and method for mounting the same Grant 6,916,433 - Mitani , et al. July 12, 2	2005-07-12
Electronic part, and electronic part mounting element and an process for manufacturing such the articles App 20050098338 - Kitae, Takashi ; et al.	2005-05-12
Electronic part, an electronic part mounting element and a process for manufacturing such the articles Grant 6,853,074 - Kitae , et al. February 8, 2	2005-02-08
Conductive adhesive agent, packaging structure, and method for manufacturing the same structure Grant 6,814,893 - Takezawa , et al. November 9, 2	2004-11-09
Conductive adhesive and connection structure using the same Grant 6,749,774 - Takezawa , et al. June 15, 2	2004-06-15
Electronic component mounted member and repair method thereof Grant 6,675,474 - Mitani , et al. January 13, 2	2004-01-13
Conductive adhesive and packaging structure using the same Grant 6,666,994 - Takezawa , et al. December 23, 2	2003-12-23
Conductive adhesive agent, packaging structure, and method for manufacturing the same structure Grant 6,620,345 - Takezawa , et al. September 16, 2	2003-09-16
Conductive adhesive and connection structure using the same App 20030127632 - Takezawa, Hiroaki ; et al.	2003-07-10
Conductive adhesive and packaging structure using the same App 20030116756 - Takezawa, Hiroaki ; et al.	2003-06-26
Electronic component mounted member and repair method thereof App 20030079896 - Matani, Tsutomu ; et al.	2003-05-01
Conductive adhesive and connection structure using the same Grant 6,521,144 - Takezawa , et al. February 18, 2	2003-02-18
Electronic component mounted member and repair method thereof Grant 6,512,183 - Mitani , et al. January 28, 2	2003-01-28
Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module Grant 6,510,059 - Mitani , et al. January 21, 2	2003-01-21
Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module App 20020185306 - Mitani, Tsutomu ; et al.	2002-12-12
Conductive adhesive, apparatus for mounting electronic component, and method for mounting the same App 20020158232 - Mitani, Tsutomu ; et al.	2002-10-31
Electronic component mounted member and repair method thereof App 20020062988 - Mitani, Tsutomu ; et al.	2002-05-30
Conductive adhesive agent, packaging structrue, and method for manufacturing the same structure App 20020050643 - Takezawa, Hiroaki ; et al.	2002-05-02
Conductive adhesive and packaging structure using the same App 20020043652 - Takezawa, Hiroaki ; et al.	2002-04-18
Conductive adhesive and connection structure using the same App 20010015424 - Takezawa, Hiroaki ; et al.	2001-08-23
Electronic part, an electronic part mounting element and an process for manufacturing such the articles App 20010005053 - Kitae, Takashi ; et al.	2001-06-28

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