loadpatents
Patent applications and USPTO patent grants for Kita; Yoshihiro.The latest application filed is for "wiring substrate".
Patent | Date |
---|---|
Folded substrate for stacked integrated circuit devices Grant 11,309,224 - Horikawa , et al. April 19, 2 | 2022-04-19 |
Wiring substrate Grant 11,019,722 - Mori , et al. May 25, 2 | 2021-05-25 |
Wiring Substrate App 20190394870 - Mori; Kenichi ;   et al. | 2019-12-26 |
Interconnect substrate Grant 10,510,649 - Kita , et al. Dec | 2019-12-17 |
Interconnect Substrate App 20190371717 - KITA; Yoshihiro ;   et al. | 2019-12-05 |
Semiconductor Device App 20190198411 - HORIKAWA; Yasuyoshi ;   et al. | 2019-06-27 |
Simultaneous multicompound analysis method and simultaneous multicompound analysis program using mass spectrometry Grant 9,989,504 - Nakanishi , et al. June 5, 2 | 2018-06-05 |
Simultaneous Multicompound Analysis Method And Simultaneous Multicompound Analysis Program Using Mass Spectrometry App 20170299557 - NAKANISHI; Tsuyoshi ;   et al. | 2017-10-19 |
Production method of water-absorbent resin Grant 8,513,364 - Sasabe , et al. August 20, 2 | 2013-08-20 |
Separating and holding apparatus App 20080023900 - Sohka; Masanori ;   et al. | 2008-01-31 |
Production method of water-absorbent resin App 20060167198 - Sasabe; Masazumi ;   et al. | 2006-07-27 |
Gas hydrate production device and gas hydrate dehydrating device App 20050107648 - Kimura, Takahiro ;   et al. | 2005-05-19 |
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