name:-0.015961885452271
name:-0.0072450637817383
name:-0.0037910938262939
KITA; Kenji Patent Filings

KITA; Kenji

Patent Applications and Registrations

Patent applications and USPTO patent grants for KITA; Kenji.The latest application filed is for "device control system and method for controlling device".

Company Profile
3.8.12
  • KITA; Kenji - Osaka-shi Osaka
  • KITA; Kenji - Nisshin-shi JP
  • Kita; Kenji - Kawasaki JP
  • Kita; Kenji - Tokyo JP
  • Kita; Kenji - Nisshin N/A JP
  • Kita; Kenji - Hirakata JP
  • Kita, Kenji - Tokushima City JP
  • Kita; Kenji - Kyoto JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks
Patent Activity
PatentDate
Device Control System And Method For Controlling Device
App 20220245041 - KITA; Kenji
2022-08-04
Device Management System And Device Management Service Providing Method
App 20220178571 - KITAMURA; Takuya ;   et al.
2022-06-09
Farming Support System
App 20200380544 - KITA; Kenji
2020-12-03
Device Control System
App 20200126549 - TEI; Shimei ;   et al.
2020-04-23
Display control method, display control device, and non-transitory computer-readable recording medium storing display control program
Grant 10,573,278 - Mori , et al. Feb
2020-02-25
Display Control Method, Display Control Device, And Non-transitory Computer-readable Recording Medium Storing Display Control Program
App 20180204543 - MORI; Yuka ;   et al.
2018-07-19
Wafer-adhering adhesive tape
Grant 8,722,184 - Morishima , et al. May 13, 2
2014-05-13
Wafer-processing tape and method of producing the same
Grant 8,545,979 - Kita , et al. October 1, 2
2013-10-01
Method of producing a semiconductor device, and wafer-processing tape
Grant 8,043,698 - Morishima , et al. October 25, 2
2011-10-25
Wafer-adhering Adhesive Tape
App 20080299345 - MORISHIMA; Yasumasa ;   et al.
2008-12-04
Method of producing a semiconductor device, and wafer-processing tape
App 20070141330 - Morishima; Yasumasa ;   et al.
2007-06-21
Dicing/die bonding sheet
App 20070026572 - Hatakeyama; Keiichi ;   et al.
2007-02-01
Wafer-processing tape
App 20060204749 - Kita; Kenji ;   et al.
2006-09-14
Wafer-processing tape and method of producing the same
App 20060154066 - Kita; Kenji ;   et al.
2006-07-13
Wafer-adhering adhesive tape
App 20050249909 - Morishima, Yasumasa ;   et al.
2005-11-10
Correction tape holder
Grant D506,508 - Shimizu , et al. June 21, 2
2005-06-21
Method for retrieving data, apparatus for retrieving data, program for retrieving data, and medium readable by machine
App 20050086210 - Kita, Kenji ;   et al.
2005-04-21
Speech processing using an expanded left to right parser
Grant 6,058,365 - Nagai , et al. May 2, 2
2000-05-02

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