Kiso; Masayuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kiso; Masayuki.The latest application filed is for "method for reproducing plating solution".

Company Profile

5.9.11

Kiso; Masayuki - Osaka JP
Kiso; Masayuki - Hirakata JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Surface treatment device comprising a paddle for stirring a surface treatment solution, paddle for stirring a surface treatment solution and method thereof Grant 11,173,513 - Okuda , et al. November 16, 2	2021-11-16
Method For Reproducing Plating Solution App 20210172084 - HASHIMOTO; Daisuke ; et al.	2021-06-10
Surface Treatment Device, Surface Treatment Method And Paddle App 20210102295 - Okuda; Tomoji ; et al.	2021-04-08
Electrolytic Sn Or Sn Alloy Plating Solution And Method For Producing Sn Or Sn Alloy Plated Article App 20200208285 - Enomoto; Masato ; et al.	2020-07-02
Electrolytic Tin Alloy Plating Solution App 20200123673 - HASHIMOTO; Daisuke ; et al.	2020-04-23
Electrolytic Tin Plating Solution App 20200095698 - HASHIMOTO; Daisuke ; et al.	2020-03-26
Surface Treatment Device, Surface Treatment Method And Paddle App 20190309435 - Okuda; Tomoji ; et al.	2019-10-10
Electroless nickel plating bath and method for electroless nickel plating Grant 8,292,993 - Inagawa , et al. October 23, 2	2012-10-23
Electroless gold plating method and electronic parts Grant 8,124,174 - Kurosaka , et al. February 28, 2	2012-02-28
Electroless gold plating bath, electroless gold plating method and electronic parts Grant 7,988,773 - Kiso , et al. August 2, 2	2011-08-02
Electroless gold plating bath, electroless gold plating method and electronic parts Grant 7,985,285 - Kiso , et al. July 26, 2	2011-07-26
Electroless Nickel Plating Bath And Method For Electroless Nickel Plating App 20100136244 - Inagawa; Hiromu ; et al.	2010-06-03
Electroless Gold Plating Method And Electronic Parts App 20080277140 - KUROSAKA; Seigo ; et al.	2008-11-13
Method For Forming A Displacement Tin Alloy Plated Film, Displacement Tin Alloy Plating Bath And Method For Maintaining A Plating Performance App 20080173550 - KISO; Masayuki ; et al.	2008-07-24
Electroless gold plating bath, electroless gold plating method and electronic parts App 20080138507 - Kiso; Masayuki ; et al.	2008-06-12
Electroless gold plating bath, electroless gold plating method and electronic parts App 20080138506 - Kiso; Masayuki ; et al.	2008-06-12
Electroless nickel plating solution and method Grant 5,910,340 - Uchida , et al. June 8, 1	1999-06-08
Analysis of tin, lead or tin-lead alloy plating solution Grant 5,294,554 - Uchida , et al. March 15, 1	1994-03-15
Bath and method for the electroless plating of tin and tin-lead alloy Grant 5,266,103 - Uchida , et al. November 30, 1	1993-11-30
Process for electroless plating tin, lead or tin-lead alloy Grant 5,248,527 - Uchida , et al. September 28, 1	1993-09-28

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