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name:-0.014672040939331
name:-0.0086309909820557
name:-0.0020971298217773
Kishino; Koji Patent Filings

Kishino; Koji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kishino; Koji.The latest application filed is for "resin composition, prepreg, method for manufacturing prepreg, laminate, and printed wiring board".

Company Profile
1.11.14
  • Kishino; Koji - Mie JP
  • KISHINO; Koji - Fukushima JP
  • Kishino, Koji - Tokyo JP
  • Kishino; Koji - Hiroshima JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method for manufacturing multilayer printed wiring board
Grant 11,452,216 - Matsumura , et al. September 20, 2
2022-09-20
Resin Composition, Prepreg, Method For Manufacturing Prepreg, Laminate, And Printed Wiring Board
App 20220259378 - SASAKI; Dai ;   et al.
2022-08-18
Method For Manufacturing Multilayer Printed Wiring Board
App 20210161020 - MATSUMURA; Kazuki ;   et al.
2021-05-27
Resin Composition, Prepreg, Metal-clad Laminate, Printed Wiring Board, And Method For Fabricating The Metal-clad Laminate
App 20200157300 - ISHIKAWA; Yohsuke ;   et al.
2020-05-21
Thermosetting Resin Composition, Metal-clad Laminated Plate, Insulating Sheet, Printed Wiring Board, Method Of Manufacturing Pri
App 20190181081 - TAMIYA; Hiroki ;   et al.
2019-06-13
Metal-clad laminate and printed wiring board
Grant 10,009,997 - Inoue , et al. June 26, 2
2018-06-26
Metal-clad laminate and printed wiring board
Grant 9,795,030 - Inoue , et al. October 17, 2
2017-10-17
Metal-clad Laminate And Printed Wiring Board
App 20170196082 - INOUE; Hiroharu ;   et al.
2017-07-06
Metal-clad laminate and printed wiring board
Grant 9,661,749 - Inoue , et al. May 23, 2
2017-05-23
Prepreg, metal-clad laminate, and printed wiring board
Grant 9,578,734 - Inoue , et al. February 21, 2
2017-02-21
Metal-clad laminate and printed wiring board
Grant 9,516,746 - Kishino , et al. December 6, 2
2016-12-06
Metal-clad laminate and printed wiring board
Grant 9,480,148 - Inoue , et al. October 25, 2
2016-10-25
Thermosetting Resin Composition, Metal-clad Laminated Plate, Insulating Sheet, Printed Wiring Board, Method Of Manufacturing Printed Wiring Board, And Package Substrate
App 20160293538 - TAMIYA; HIROKI ;   et al.
2016-10-06
Prepreg, metal-clad laminate, and printed wiring board
Grant 9,102,850 - Inoue , et al. August 11, 2
2015-08-11
Prepreg, Metal-clad Laminate, And Printed Wiring Board
App 20150075852 - Inoue; Hiroharu ;   et al.
2015-03-19
Metal-plated Laminated Board, And Printed Wiring Board
App 20140374142 - Inoue; Hiroharu ;   et al.
2014-12-25
Prepreg, Metal-clad Laminate, And Printed Wiring Board
App 20140367150 - Inoue; Hiroharu ;   et al.
2014-12-18
Metal-clad Laminate And Printed Wiring Board
App 20140311781 - Kishino; Koji ;   et al.
2014-10-23
Metal-clad Laminate And Printed Wiring Board
App 20140116764 - Inoue; Hiroharu ;   et al.
2014-05-01
Metal-clad Laminate And Printed Wiring Board
App 20130319735 - Inoue; Hiroharu ;   et al.
2013-12-05
Method and system for e-transaction
App 20020029169 - Oki, Katsuhiko ;   et al.
2002-03-07
Glass construction for an automobile
Grant 4,927,207 - Kishino May 22, 1
1990-05-22

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