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Patent applications and USPTO patent grants for KISHI; Daisuke.The latest application filed is for "electromagnetic wave shielding sheet and printed wiring board".
Patent | Date |
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Electromagnetic Wave Shielding Sheet And Printed Wiring Board App 20200413576 - KISHI; Daisuke ;   et al. | 2020-12-31 |
Electromagnetic wave shielding sheet and printed wiring board Grant 10,820,457 - Kishi , et al. October 27, 2 | 2020-10-27 |
Easily deformable aggregate and method for manufacturing same, thermally conductive resin composition, thermally conductive member and method for manufacturing same, and thermally conductive adhesive sheet Grant 10,370,573 - Sakaguchi , et al. | 2019-08-06 |
Thermosetting Resin Composition, Polyamide, Adhesive Sheet, Cured Product, And Printed-wiring Board App 20170158817 - OGIWARA; Naoto ;   et al. | 2017-06-08 |
Easily Deformable Aggregate And Method For Manufacturing Same, Thermally Conductive Resin Composition, Thermally Conductive Member And Method For Manufacturing Same, And Thermally Conductive Adhesive Sheet App 20150110985 - Sakaguchi; Kaori ;   et al. | 2015-04-23 |
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