KIRITANI; Mika

Patent Applications and Registrations

Patent applications and USPTO patent grants for KIRITANI; Mika.The latest application filed is for "semiconductor device and method for manufacturing the same".

Company Profile

0.8.11

KIRITANI; Mika - Kawasaki Kanagawa JP
KIRITANI; Mika - Kawasaki-shi JP
Kiritani; Mika - Kawasaki JP
Kiritani, Mika - Kanagawa JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Device And Method For Manufacturing The Same App 20160276312 - SHIMIZU; Shinya ; et al.	2016-09-22
Semiconductor Device Manufacturing Method And Semiconductor Device App 20120235282 - TOMONO; Akira ; et al.	2012-09-20
Stack MCP and manufacturing method thereof Grant 7,833,836 - Takyu , et al. November 16, 2	2010-11-16
Semiconductor device package having a semiconductor element with a roughened surface Grant 7,608,911 - Imoto , et al. October 27, 2	2009-10-27
Stack Mcp And Manufacturing Method Thereof App 20090111218 - TAKYU; Shinya ; et al.	2009-04-30
Stack MCP and manufacturing method thereof Grant 7,482,695 - Takyu , et al. January 27, 2	2009-01-27
Semiconductor device and method of manufacturing the same App 20080265443 - Imoto; Takashi ; et al.	2008-10-30
Method of fabricating a semiconductor device package having a semiconductor element with a roughened surface Grant 7,405,159 - Imoto , et al. July 29, 2	2008-07-29
Stack MCP and manufacturing method thereof App 20070262445 - Takyu; Shinya ; et al.	2007-11-15
Stack MCP Grant 7,285,864 - Takyu , et al. October 23, 2	2007-10-23
Semiconductor device and method of manufacturing the same App 20070196956 - Imoto; Takashi ; et al.	2007-08-23
Semiconductor device package having a semiconductor element with resin Grant 7,202,563 - Imoto , et al. April 10, 2	2007-04-10
Semiconductor device and method of manufacturing the same App 20050212145 - Imoto, Takashi ; et al.	2005-09-29
Stack MCP and manufacturing method thereof App 20050179127 - Takyu, Shinya ; et al.	2005-08-18
Manufacturing method of semiconductor device App 20050026326 - Kiritani, Mika ; et al.	2005-02-03
Semiconductor resin molding method Grant 6,787,093 - Kiritani September 7, 2	2004-09-07
Semiconductor device manufacturing method for reinforcing chip by use of seal member at pickup time Grant 6,777,313 - Takyu , et al. August 17, 2	2004-08-17
Semiconductor device manufacturing method for reinforcing chip by use of seal member at pickup time App 20030017663 - Takyu, Shinya ; et al.	2003-01-23
Semiconductor resin mold and semiconductor resin molding method using the mold App 20020020940 - Kiritani, Mika	2002-02-21

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