Kiritani; Hideki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kiritani; Hideki.The latest application filed is for "agglomerated boron nitride particles, composition containing said particles, and three-dimensional integrated circuit having layer comprising said composition".

Company Profile

1.5.5

Kiritani; Hideki - Chiyoda-ku JP
Kiritani; Hideki - Kitakyushu JP
KIRITANI; Hideki - Kitakyushu-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Agglomerated boron nitride particles, composition containing said particles, and three- dimensional integrated circuit having layer comprising said composition Grant 10,400,151 - Yamazaki , et al. Sep	2019-09-03
Composition for interlayer filler of layered semiconductor device, layered semiconductor device, and process for producing layered semiconductor device Grant 10,125,289 - Sugiyama , et al. November 13, 2	2018-11-13
Three-dimensional integrated circuit laminate, and interlayer filler for three-dimensional integrated circuit laminate Grant 9,847,298 - Kawase , et al. December 19, 2	2017-12-19
Agglomerated Boron Nitride Particles, Composition Containing Said Particles, And Three-dimensional Integrated Circuit Having Layer Comprising Said Composition App 20170335160 - YAMAZAKI; Masanori ; et al.	2017-11-23
Agglomerated boron nitride particles, composition containing said particles, and three-dimensional integrated circuit having layer comprising said composition Grant 9,822,294 - Yamazaki , et al. November 21, 2	2017-11-21
Three-dimensional Integrated Circuit Laminate, And Interlayer Filler For Three-dimensional Integrated Circuit Laminate App 20170033050 - KAWASE; Yasuhiro ; et al.	2017-02-02
Three-dimensional integrated circuit laminate, and interlayer filler for three-dimensional integrated circuit laminate Grant 9,508,648 - Kawase , et al. November 29, 2	2016-11-29
Composition For Interlayer Filler Of Layered Semiconductor Device, Layered Semiconductor Device, And Process For Producing Layered Semiconductor Device App 20160009947 - SUGIYAMA; Masaya ; et al.	2016-01-14
Agglomerated Boron Nitride Particles, Composition Containing Said Particles, And Three-dimensional Integrated Circuit Having Layer Comprising Said Composition App 20140349105 - YAMAZAKI; Masanori ; et al.	2014-11-27
Three-dimensional Integrated Circuit Laminate, And Interlayer Filler For Three-dimensional Integrated Circuit Laminate App 20140027885 - KAWASE; Yasuhiro ; et al.	2014-01-30

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