Kirikae; Noriyuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kirikae; Noriyuki.The latest application filed is for "film-like adhesive and method for producing semiconductor package using film-like adhesive".

Company Profile

4.14.17

Kirikae; Noriyuki - Tokyo JP
KIRIKAE; Noriyuki - Toyko JP
Kirikae; Noriyuki - Kisarazu N/A JP
Kirikae; Noriyuki - Chiba JP
Kirikae; Noriyuki - Sodegaura JP
Kirikae, Noriyuki - Sodegaura-shi JP
Kirikae; Noriyuki - Chiba-ken JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electrically conductive adhesive film and dicing-die bonding film using the same Grant 11,230,649 - Mihara , et al. January 25, 2	2022-01-25
Electrically conductive adhesive film and dicing-die bonding film using the same Grant 11,193,047 - Mihara , et al. December 7, 2	2021-12-07
Film-like adhesive and method for producing semiconductor package using film-like adhesive Grant 11,139,261 - Morita , et al. October 5, 2	2021-10-05
Electrically conductive adhesive film and dicing-die bonding film using the same Grant 11,136,479 - Mihara , et al. October 5, 2	2021-10-05
Electrically conductive adhesive film and dicing-die bonding film using the same Grant 11,098,226 - Mihara , et al. August 24, 2	2021-08-24
Electrically conductive adhesive film and dicing-die bonding film using the same Grant 11,066,577 - Mihara , et al. July 20, 2	2021-07-20
Electrically conductive composition Grant 10,689,550 - Mihara , et al.	2020-06-23
Conductive adhesive composition Grant 10,563,096 - Aoyama , et al. Feb	2020-02-18
Film-like Adhesive And Method For Producing Semiconductor Package Using Film-like Adhesive App 20190181113 - MORITA; Minoru ; et al.	2019-06-13
Electrically Conductive Adhesive Film And Dicing-die Bonding Film Using The Same App 20190016929 - Mihara; Naoaki ; et al.	2019-01-17
Electrically Conductive Adhesive Film And Dicing-die Bonding Film Using The Same App 20190016928 - Mihara; Naoaki ; et al.	2019-01-17
Electrically Conductive Adhesive Film And Dicing-die Bonding Film Using The Same App 20180346767 - Mihara; Naoaki ; et al.	2018-12-06
Electrically Conductive Adhesive Film And Dicing-die Bonding Film Using The Same App 20180346766 - Mihara; Naoaki ; et al.	2018-12-06
Adhesive film and semiconductor package using adhesive film Grant 10,115,707 - Kirikae , et al. October 30, 2	2018-10-30
Electrically Conductive Adhesive Film And Dicing Die Bonding Film App 20180294242 - MIHARA; Naoaki ; et al.	2018-10-11
Electrically Conductive Adhesive Film And Dicing Die Bonding Film App 20180026003 - MIHARA; Naoaki ; et al.	2018-01-25
Electrically Conductive Composition App 20170369746 - MIHARA; Naoaki ; et al.	2017-12-28
Conductive Adhesive Film App 20170152411 - MIHARA; Naoaki ; et al.	2017-06-01
Conductive Adhesive Composition App 20170152410 - AOYAMA; Masami ; et al.	2017-06-01
Adhesive Film And Semiconductor Package Using Adhesive Film App 20170152408 - KIRIKAE; Noriyuki ; et al.	2017-06-01
Maleimide Film App 20170152418 - AOYAMA; Masami ; et al.	2017-06-01
Adhesive Film App 20170152405 - AOYAMA; Masami ; et al.	2017-06-01
Highly heat conductive polyimide film, highly heat conductive metal-clad laminate, and method for producing the same Grant 9,101,062 - Aoyagi , et al. August 4, 2	2015-08-04
Highly Heat Conductive Polyimide Film, Highly Heat Conductive Metal-clad Laminate, And Method For Producing The Same App 20110165410 - Aoyagi; Eijiro ; et al.	2011-07-07
Semiconductor package production method and semiconductor package Grant 6,969,919 - Yajima , et al. November 29, 2	2005-11-29
Semiconductor package production method and semiconductor package App 20050003577 - Yajima, Kiyoshi ; et al.	2005-01-06
Semiconductor package with a thermoset bond Grant 6,774,496 - Yajima , et al. August 10, 2	2004-08-10
Method of forming a semiconductor package Grant 6,716,674 - Yajima , et al. April 6, 2	2004-04-06
Semiconductor package production method and semiconductor package App 20030153121 - Yajima, Kiyoshi ; et al.	2003-08-14
Semiconductor package production method and semiconductor package App 20030049883 - Yajima, Kiyoshi ; et al.	2003-03-13

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.