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Patent applications and USPTO patent grants for KIRIHARA; Naotoshi.The latest application filed is for "laser processing method".
Patent | Date |
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Laser Processing Method App 20220288719 - KIRIHARA; Naotoshi ;   et al. | 2022-09-15 |
Laser processing apparatus Grant 10,692,740 - Kirihara | 2020-06-23 |
Wafer processing apparatus Grant 10,658,171 - Kirihara | 2020-05-19 |
Laser processing method for wafer Grant 10,573,559 - Kirihara Feb | 2020-02-25 |
Wafer processing apparatus Grant 10,388,508 - Kirihara A | 2019-08-20 |
Wafer Processing Apparatus App 20190252179 - Kirihara; Naotoshi | 2019-08-15 |
Method Of Processing Workpiece With Laser Beam App 20190217419 - KIRIHARA; Naotoshi ;   et al. | 2019-07-18 |
Laser Processing Method For Wafer App 20190164833 - KIRIHARA; Naotoshi | 2019-05-30 |
Method of processing wafer Grant 10,297,710 - Kirihara | 2019-05-21 |
Method Of Processing Wafer App 20180309018 - Kirihara; Naotoshi | 2018-10-25 |
Optical device wafer processing method Grant 10,109,527 - Oba , et al. October 23, 2 | 2018-10-23 |
Laser Processing Apparatus App 20170330774 - Kirihara; Naotoshi | 2017-11-16 |
Wafer Processing Apparatus App 20170323774 - Kirihara; Naotoshi | 2017-11-09 |
Laser beam spot shape detection method Grant 9,789,567 - Asano , et al. October 17, 2 | 2017-10-17 |
Processing method of optical device wafer Grant 9,761,492 - Shotokuji , et al. September 12, 2 | 2017-09-12 |
Processing Method Of Optical Device Wafer App 20170103921 - Shotokuji; Takumi ;   et al. | 2017-04-13 |
Optical Device Wafer Processing Method App 20170098579 - Oba; Ryugo ;   et al. | 2017-04-06 |
Wafer divider and wafer division method Grant 9,472,459 - Kirihara October 18, 2 | 2016-10-18 |
Wafer Divider And Wafer Division Method App 20160247723 - Kirihara; Naotoshi | 2016-08-25 |
Laser Beam Spot Shape Detection Method App 20160045980 - Asano; Kenji ;   et al. | 2016-02-18 |
Optical Device And Manufacturing Method Therefor App 20150214432 - Kirihara; Naotoshi ;   et al. | 2015-07-30 |
Wafer dividing method using laser beam with an annular spot Grant 7,585,751 - Kirihara , et al. September 8, 2 | 2009-09-08 |
Laser ionization mass spectroscope Grant 7,521,671 - Kirihara , et al. April 21, 2 | 2009-04-21 |
Wafer Dividing Method Using Laser Beam With An Annular Spot App 20090017600 - Kirihara; Naotoshi ;   et al. | 2009-01-15 |
Method of Analyzing Dioxins App 20080131973 - Kirihara; Naotoshi ;   et al. | 2008-06-05 |
Laser Ionization Mass Spectroscope App 20070272849 - Kirihara; Naotoshi ;   et al. | 2007-11-29 |
Method of analyzing dioxins App 20070108391 - Shiomitsu; Toru ;   et al. | 2007-05-17 |
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