Kirihara; Hiroshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kirihara; Hiroshi.The latest application filed is for "high-stability dimmer".

Company Profile

2.8.6

Kirihara; Hiroshi - Kagoshima JP
- Kagoshima JP
Kirihara; Hiroshi - Ichihara-shi JP
Kirihara; Hiroshi - Ichihara JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
High-stability dimmer Grant 9,220,144 - Miyahara , et al. December 22, 2	2015-12-22
High-stability Dimmer App 20150156842 - Miyahara; Takakazu ; et al.	2015-06-04
High stability dimmer Grant 8,618,743 - Miyahara , et al. December 31, 2	2013-12-31
High stability dimmer Grant 08618743 -	2013-12-31
High Stability Dimmer App 20130300301 - Miyahara; Takakazu ; et al.	2013-11-14
Punched Adhesive Tape For Semicconductor, Method Of Manufacturing Lead Frame With The Adhesive Tape, Lead Frame With The Adhesive Tape, And Semiconductor Device Comprising The Lead Frame App 20090022893 - Tanabe; Yoshiyuki ; et al.	2009-01-22
Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame Grant 7,449,076 - Tanabe , et al. November 11, 2	2008-11-11
Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame Grant 7,273,654 - Tanabe , et al. September 25, 2	2007-09-25
Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame App 20060027312 - Tanabe; Yoshiyuki ; et al.	2006-02-09
Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film Grant 6,621,170 - Yamamoto , et al. September 16, 2	2003-09-16
Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame Grant 6,523,446 - Tanabe , et al. February 25, 2	2003-02-25
Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame App 20030021990 - Tanabe, Yoshiyuki ; et al.	2003-01-30
Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film App 20010022404 - Yamamoto, Kazunori ; et al.	2001-09-20
Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film Grant 6,265,782 - Yamamoto , et al. July 24, 2	2001-07-24

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