Kirchhoff; Markus

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kirchhoff; Markus.The latest application filed is for "method for production of a semiconductor structure".

Company Profile

0.9.11

Kirchhoff; Markus - Ottendorf-Okrilla DE
Kirchhoff; Markus - Wappingers Falls NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Photolithographic patterning process using a carbon hard mask layer of diamond-like hardness produced by a plasma-enhanced deposition process Grant 7,368,390 - Czech , et al. May 6, 2	2008-05-06
Method for production of a semiconductor structure Grant 7,141,507 - Genz , et al. November 28, 2	2006-11-28
Method for fabricating an integrated semiconductor circuit to prevent formation of voids Grant 7,078,313 - Kirchhoff July 18, 2	2006-07-18
Method for production of a semiconductor structure App 20050196952 - Genz, Oliver ; et al.	2005-09-08
Photolithographic method for forming a structure in a semiconductor substrate App 20050148193 - Kirchhoff, Markus ; et al.	2005-07-07
Method for filling depressions in a surface of a semiconductor structure, and a semiconductor structure filled in this way Grant 6,759,323 - Kirchhoff July 6, 2	2004-07-06
Method for forming an insulator having a low dielectric constant on a semiconductor substrate Grant 6,713,364 - Kirchhoff March 30, 2	2004-03-30
Method for filling trenches in integrated semiconductor circuits Grant 6,677,218 - Kirchhoff , et al. January 13, 2	2004-01-13
Method for forming a trench in a semiconductor substrate Grant 6,673,693 - Kirchhoff January 6, 2	2004-01-06
Method of filling substrate depressions with silicon oxide by high-density-plasma vapor phase deposition with participation of H2O2 or H2O as reaction gas App 20030087506 - Kirchhoff, Markus	2003-05-08
Method for fabricating an integrated semiconductor circuit App 20030054630 - Kirchhoff, Markus	2003-03-20
Method for filling trenches in integrated semiconductor circuits App 20030032259 - Kirchhoff, Markus ; et al.	2003-02-13
Semiconductor device structure with hydrogen-rich layer for facilitating passivation of surface states Grant 6,483,172 - Cote , et al. November 19, 2	2002-11-19
Method for fabricating an integrated circuit with a dynamic memory cell configuration (DRAM) with a long retention time App 20020137333 - Kirchhoff, Markus	2002-09-26
Method of filling gaps on a semiconductor wafer App 20020042186 - Kirchhoff, Markus	2002-04-11
Method for forming an insulator having a low dielectric constant on a semiconductor substrate App 20020022339 - Kirchhoff, Markus	2002-02-21
Method for forming a trench in a semiconductor substrate App 20020022338 - Kirchhoff, Markus	2002-02-21
Method for filling depressions in a surface of a semiconductor structure, and a semiconductor structure filled in this way App 20010054749 - Kirchhoff, Markus	2001-12-27
Dielectric filling of electrical wiring planes App 20010004539 - Kirchhoff, Markus ; et al.	2001-06-21
Uniform distribution of reactants in a device layer Grant 5,807,792 - Ilg , et al. September 15, 1	1998-09-15

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