| Patent | Date |
|---|
Combination-bonded Die Pair Packaging And Associated Systems And Methods
App 20220246569 - Kirby; Kyle K. ; et al. | 2022-08-04 |
Semiconductor Memory Stacks Connected To Processing Units And Associated Systems And Methods
App 20220157728 - Kirby; Kyle K. | 2022-05-19 |
Semiconductor Die Stacks And Associated Systems And Methods
App 20220157783 - Kirby; Kyle K. | 2022-05-19 |
Combination-bonded Die Pair Packaging And Associated Systems And Methods
App 20220102308 - Kirby; Kyle K. ; et al. | 2022-03-31 |
Combination-bonded die pair packaging and associated systems and methods
Grant 11,289,440 - Kirby , et al. March 29, 2 | 2022-03-29 |
Front End Of Line Interconnect Structures And Associated Systems And Methods
App 20220068820 - Kirby; Kyle K. ; et al. | 2022-03-03 |
Front End Of Line Interconnect Structures And Associated Systems And Methods
App 20220068765 - Kirby; Kyle K. ; et al. | 2022-03-03 |
Front End Of Line Interconnect Structures And Associated Systems And Methods
App 20220068819 - Kirby; Kyle K. ; et al. | 2022-03-03 |
Semiconductor die stacks and associated systems and methods
Grant 11,239,207 - Kirby February 1, 2 | 2022-02-01 |
Semiconductor memory stacks connected to processing units and associated systems and methods
Grant 11,239,169 - Kirby February 1, 2 | 2022-02-01 |
Semiconductor Die Stacks And Associated Systems And Methods
App 20220028830 - Kirby; Kyle K. | 2022-01-27 |
Semiconductor Memory Stacks Connected To Processing Units And Associated Systems And Methods
App 20220028789 - Kirby; Kyle K. | 2022-01-27 |
Methods and apparatus for wafer handling and processing
Grant 11,195,740 - Bayless , et al. December 7, 2 | 2021-12-07 |
Microelectronic devices and methods for filling vias in microelectronic devices
Grant 11,177,175 - Hiatt , et al. November 16, 2 | 2021-11-16 |
High Density Pillar Interconnect Conversion With Stack To Substrate Connection
App 20210351163 - Fay; Owen R. ; et al. | 2021-11-11 |
Apparatuses Exhibiting Enhanced Stress Resistance And Planarity, And Related Microelectronic Devices And Memory Devices
App 20210296289 - Kirby; Kyle K. ; et al. | 2021-09-23 |
High density pillar interconnect conversion with stack to substrate connection
Grant 11,088,114 - Fay , et al. August 10, 2 | 2021-08-10 |
Interconnect Structures And Associated Systems And Methods
App 20210242154 - Kirby; Kyle K. | 2021-08-05 |
Multi-height Interconnect Structures And Associated Systems And Methods
App 20210242174 - Kirby; Kyle K. | 2021-08-05 |
High Density Pillar Interconnect Conversion With Stack To Substrate Connection
App 20210225771 - Fay; Owen R. ; et al. | 2021-07-22 |
Apparatuses exhibiting enhanced stress resistance and planarity, and related methods
Grant 11,056,443 - Kirby , et al. July 6, 2 | 2021-07-06 |
3DI Solder Cup
App 20210202411 - Kirby; Kyle K. | 2021-07-01 |
Semiconductor Device Assembly with Pillar Array
App 20210183662 - Fay; Owen R. ; et al. | 2021-06-17 |
Encapsulated solder TSV insertion interconnect
Grant 11,018,056 - Kirby , et al. May 25, 2 | 2021-05-25 |
High Density Pillar Interconnect Conversion With Stack To Substrate Connection
App 20210134759 - Fay; Owen R. ; et al. | 2021-05-06 |
High Density Pillar Interconnect Conversion With Stack To Substrate Connection
App 20210134725 - Fay; Owen R. ; et al. | 2021-05-06 |
Encapsulated Solder Tsv Insertion Interconnect
App 20210134670 - Kirby; Kyle K. ; et al. | 2021-05-06 |
High density pillar interconnect conversion with stack to substrate connection
Grant 10,998,271 - Fay , et al. May 4, 2 | 2021-05-04 |
Microelectronic devices with through-silicon vias and associated methods of manufacturing
Grant 10,978,386 - Kirby , et al. April 13, 2 | 2021-04-13 |
Semiconductor Devices With Back-side Coils For Wireless Signal And Power Coupling
App 20210104451 - Kirby; Kyle K. | 2021-04-08 |
3DI solder cup
Grant 10,964,654 - Kirby March 30, 2 | 2021-03-30 |
Inductors With Through-substrate Via Cores
App 20210082818 - Kirby; Kyle K. | 2021-03-18 |
Semiconductor device assembly with pillar array and test ability
Grant 10,943,794 - Fay , et al. March 9, 2 | 2021-03-09 |
Apparatus Exhibiting Enhanced Stress Resistance And Planarity, And Related Microelectronic Devices, Memory Devices, And Methods
App 20210066207 - Kirby; Kyle K. ; et al. | 2021-03-04 |
Semiconductor With Through-substrate Interconnect
App 20210057264 - Kirby; Kyle K. ; et al. | 2021-02-25 |
Semiconductor devices with back-side coils for wireless signal and power coupling
Grant 10,872,843 - Kirby December 22, 2 | 2020-12-22 |
Methods And Apparatus For Wafer Handling And Processing
App 20200335379 - Bayless; Andrew M. ; et al. | 2020-10-22 |
3D interconnect multi-die inductors with through-substrate via cores
Grant 10,796,989 - Kirby October 6, 2 | 2020-10-06 |
Microelectronic Devices With Through-substrate Interconnects And Associated Methods Of Manufacturing
App 20200312714 - Kirby; Kyle K. ; et al. | 2020-10-01 |
Semiconductor devices with underfill control features, and associated systems and methods
Grant 10,784,224 - Yeruva , et al. Sept | 2020-09-22 |
Vias And Conductive Routing Layers In Semiconductor Substrates
App 20200294854 - Kirby; Kyle K. ; et al. | 2020-09-17 |
Methods for forming interconnect assemblies with probed bond pads
Grant 10,741,460 - Fay , et al. A | 2020-08-11 |
Semiconductor with through-substrate interconnect
Grant 10,734,272 - Kirby , et al. | 2020-08-04 |
Microelectronic devices with through-substrate interconnects and associated methods of manufacturing
Grant 10,685,878 - Kirby , et al. | 2020-06-16 |
Vias and conductive routing layers in semiconductor substrates
Grant 10,600,689 - Kirby , et al. | 2020-03-24 |
3DI Solder Cup
App 20200066664 - Kirby; Kyle K. | 2020-02-27 |
Semiconductor device assembly with pillar array
Grant 10,529,592 - Fay , et al. J | 2020-01-07 |
Semiconductor Devices With Underfill Control Features, And Associated Systems And Methods
App 20190371755 - Yeruva; Suresh ; et al. | 2019-12-05 |
3DI solder cup
Grant 10,483,221 - Kirby Nov | 2019-11-19 |
Semiconductor Device Assembly with Pillar Array
App 20190341270 - Fay; Owen R. ; et al. | 2019-11-07 |
Multi-die inductors with coupled through-substrate via cores
Grant 10,446,486 - Kirby Oc | 2019-10-15 |
Semiconductor devices with underfill control features, and associated systems and methods
Grant 10,424,553 - Yeruva , et al. Sept | 2019-09-24 |
High Density, Tight Array Copper Pillar Interconnect Method and Package
App 20190172725 - Fay; Owen R. ; et al. | 2019-06-06 |
3DI Solder Cup
App 20190131260 - Kirby; Kyle K. | 2019-05-02 |
Methods For Forming Interconnect Assemblies With Probed Bond Pads
App 20190051569 - Fay; Owen R. ; et al. | 2019-02-14 |
3d Interconnect Multi-die Inductors With Through-substrate Via Cores
App 20190027437 - Kirby; Kyle K. | 2019-01-24 |
3D interconnect multi-die inductors with through-substrate via cores
Grant 10,157,830 - Kirby Dec | 2018-12-18 |
Microelectronic Devices And Methods For Filling Vias In Microelectronic Devices
App 20180342477 - Hiatt; William M. ; et al. | 2018-11-29 |
3D interconnect multi-die inductors with through-substrate via cores
Grant 10,134,671 - Kirby November 20, 2 | 2018-11-20 |
Methods for forming interconnect assemblies with probed bond pads
Grant 10,134,647 - Fay , et al. November 20, 2 | 2018-11-20 |
Semiconductor Devices With Through-substrate Coils For Wireless Signal And Power Coupling
App 20180323253 - Kirby; Kyle K. | 2018-11-08 |
3d Interconnect Multi-die Inductors With Through-substrate Via Cores
App 20180323145 - Kirby; Kyle K. | 2018-11-08 |
Multi-die Inductors With Coupled Through-substrate Via Cores
App 20180323146 - Kirby; Kyle K. | 2018-11-08 |
Semiconductor Devices With Back-side Coils For Wireless Signal And Power Coupling
App 20180323133 - Kirby; Kyle K. | 2018-11-08 |
Multi-die Inductors With Coupled Through-substrate Via Cores
App 20180323144 - Kirby; Kyle K. | 2018-11-08 |
Inductors With Through-substrate Via Cores
App 20180323369 - Kirby; Kyle K. | 2018-11-08 |
3d Interconnect Multi-die Inductors With Through-substrate Via Cores
App 20180323147 - Kirby; Kyle K. | 2018-11-08 |
Multi-die inductors with coupled through-substrate via cores
Grant 10,121,739 - Kirby November 6, 2 | 2018-11-06 |
Pass-through interconnect structure for microelectronic dies and associated systems and methods
Grant 10,020,287 - Pratt , et al. July 10, 2 | 2018-07-10 |
Semiconductor With Through-substrate Interconnect
App 20180166317 - Kirby; Kyle K. ; et al. | 2018-06-14 |
Semiconductor devices including back-side integrated circuitry
Grant 9,966,406 - Kirby , et al. May 8, 2 | 2018-05-08 |
Semiconductor Devices With Underfill Control Features, And Associated Systems And Methods
App 20180122762 - Yeruva; Suresh ; et al. | 2018-05-03 |
Semiconductor substrates with unitary vias and via terminals, and associated systems and methods
Grant 9,935,085 - Kirby , et al. April 3, 2 | 2018-04-03 |
Semiconductor with through-substrate interconnect
Grant 9,917,002 - Kirby , et al. March 13, 2 | 2018-03-13 |
Vias And Conductive Routing Layers In Semiconductor Substrates
App 20170372961 - Kirby; Kyle K. ; et al. | 2017-12-28 |
Vias and conductive routing layers in semiconductor substrates
Grant 9,799,562 - Kirby , et al. October 24, 2 | 2017-10-24 |
Microelectronic Devices And Methods For Filling Vias In Microelectronic Devices
App 20170301639 - Hiatt; William M. ; et al. | 2017-10-19 |
Semiconductor With Through-substrate Interconnect
App 20170213760 - Kirby; Kyle K. ; et al. | 2017-07-27 |
Methods For Forming Interconnect Assemblies With Probed Bond Pads
App 20170207139 - Fay; Owen R. ; et al. | 2017-07-20 |
Microelectronic devices and methods for filling vias in microelectronic devices
Grant 9,653,420 - Hiatt , et al. May 16, 2 | 2017-05-16 |
Interconnect assemblies with probed bond pads
Grant 9,646,899 - Fay , et al. May 9, 2 | 2017-05-09 |
Devices, systems and methods for manufacturing through-substrate vias and front-side structures
Grant 9,627,295 - Jindal , et al. April 18, 2 | 2017-04-18 |
Disabling electrical connections using pass-through 3D interconnects and associated systems and methods
Grant 9,607,930 - Janzen , et al. March 28, 2 | 2017-03-28 |
Semiconductor Substrates With Unitary Vias And Via Terminals, And Associated Systems And Methods
App 20170077067 - Kirby; Kyle K. ; et al. | 2017-03-16 |
Semiconductor Devices Including Back-side Integrated Circuitry
App 20170040375 - Kirby; Kyle K. ; et al. | 2017-02-09 |
Semiconductor with through-substrate interconnect
Grant 9,514,975 - Kirby , et al. December 6, 2 | 2016-12-06 |
Semiconductor substrates with unitary vias and via terminals, and associated systems and methods
Grant 9,508,628 - Kirby , et al. November 29, 2 | 2016-11-29 |
Semiconductor devices including back-side integrated circuitry
Grant 9,484,378 - Kirby , et al. November 1, 2 | 2016-11-01 |
Devices, systems, and methods related to forming through-substrate vias with sacrificial plugs
Grant 9,449,906 - Kirby , et al. September 20, 2 | 2016-09-20 |
Disabling Electrical Connections Using Pass-through 3d Interconnects And Associated Systems And Methods
App 20160247747 - Janzen; Jeffery W. ; et al. | 2016-08-25 |
Microelectronic Devices With Through-silicon Vias And Associated Methods Of Manufacturing
App 20160233160 - Kirby; Kyle K. ; et al. | 2016-08-11 |
Devices, Systems And Methods For Manufacturing Through-substrate Vias And Front-side Structures
App 20160190042 - Jindal; Anurag ; et al. | 2016-06-30 |
Disabling electrical connections using pass-through 3D interconnects and associated systems and methods
Grant 9,343,368 - Janzen , et al. May 17, 2 | 2016-05-17 |
Microelectronic devices with through-silicon vias and associated methods of manufacturing
Grant 9,343,362 - Kirby , et al. May 17, 2 | 2016-05-17 |
Devices, systems and methods for manufacturing through-substrate vias and front-side structures
Grant 9,305,865 - Jindal , et al. April 5, 2 | 2016-04-05 |
Pass-through Interconnect Structure For Microelectronic Dies And Associated Systems And Methods
App 20160086926 - Pratt; David S. ; et al. | 2016-03-24 |
Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods
Grant 9,214,391 - Kirby December 15, 2 | 2015-12-15 |
Pass-through 3D interconnect for microelectronic dies and associated systems and methods
Grant 9,209,158 - Pratt , et al. December 8, 2 | 2015-12-08 |
Semiconductor With Through-substrate Interconnect
App 20150303095 - Kirby; Kyle K. ; et al. | 2015-10-22 |
Semiconductor with through-substrate interconnect
Grant 9,099,457 - Kirby , et al. August 4, 2 | 2015-08-04 |
Devices, Systems And Methods For Manufacturing Through-substrate Vias And Front-side Structures
App 20150115445 - Jindal; Anurag ; et al. | 2015-04-30 |
Microelectronic Devices With Through-substrate Interconnects And Associated Methods Of Manufacturing
App 20150093892 - Kirby; Kyle K. ; et al. | 2015-04-02 |
Devices, Systems, And Methods Related To Forming Through-substrate Vias With Sacrificial Plugs
App 20150028476 - Kirby; Kyle K. ; et al. | 2015-01-29 |
Methods of processing semiconductor substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded thereto
Grant 8,929,052 - Ray , et al. January 6, 2 | 2015-01-06 |
Microelectronic devices with through-substrate interconnects and associated methods of manufacturing
Grant 8,907,457 - Kirby , et al. December 9, 2 | 2014-12-09 |
Disabling Electrical Connections Using Pass-through 3d Interconnects And Associated Systems And Methods
App 20140319697 - Janzen; Jeffery W. ; et al. | 2014-10-30 |
Devices, systems, and methods related to forming through-substrate vias with sacrificial plugs
Grant 8,859,425 - Kirby , et al. October 14, 2 | 2014-10-14 |
Microelectronic Devices And Methods For Filling Vias In Microelectronic Devices
App 20140284796 - Hiatt; William M. ; et al. | 2014-09-25 |
Microelectronic Devices With Through-silicon Vias And Associated Methods Of Manufacturing
App 20140287584 - Kirby; Kyle K. ; et al. | 2014-09-25 |
Semiconductor Substrates With Unitary Vias And Via Terminals, And Associated Systems And Methods
App 20140252562 - Kirby; Kyle K. ; et al. | 2014-09-11 |
Method of forming vias in semiconductor substrates and resulting structures
Grant 8,786,097 - Watkins , et al. July 22, 2 | 2014-07-22 |
Semiconductor Devices Including Back-side Integrated Circuitry
App 20140191303 - Kirby; Kyle K. ; et al. | 2014-07-10 |
Disabling electrical connections using pass-through 3D interconnects and associated systems and methods
Grant 8,772,086 - Janzen , et al. July 8, 2 | 2014-07-08 |
Microelectronic devices with through-silicon vias and associated methods of manufacturing
Grant 8,753,981 - Kirby , et al. June 17, 2 | 2014-06-17 |
Microelectronic devices and methods for filing vias in microelectronic devices
Grant 8,748,311 - Hiatt , et al. June 10, 2 | 2014-06-10 |
Packaged microelectronic imagers and methods of packaging microelectronic imagers
Grant 8,703,518 - Kirby , et al. April 22, 2 | 2014-04-22 |
Devices, Systems, And Methods Related To Forming Through-substrate Vias With Sacrificial Plugs
App 20140103520 - Kirby; Kyle K. ; et al. | 2014-04-17 |
Semiconductor device fabrication methods
Grant 8,679,933 - Kirby , et al. March 25, 2 | 2014-03-25 |
Interconnect Assemblies With Probed Bond Pads
App 20140070832 - Fay; Owen R. ; et al. | 2014-03-13 |
Through-wafer interconnects for photoimager and memory wafers
Grant 8,669,179 - Akram , et al. March 11, 2 | 2014-03-11 |
Semiconductor substrates with unitary vias and via terminals, and associated systems and methods
Grant 8,629,057 - Kirby , et al. January 14, 2 | 2014-01-14 |
Through-wafer Interconnects For Photoimager And Memory Wafers
App 20130295766 - Akram; Salman ; et al. | 2013-11-07 |
Methods of Processing Semiconductor Substrates, Electrostatic Carriers for Retaining Substrates for Processing, and Assemblies Comprising Electrostatic Carriers Having Substrates Electrostatically Bonded Thereto
App 20130276985 - Ray; Dewali ; et al. | 2013-10-24 |
Semiconductor substrates comprising through substrate interconnects that are visible on the substrate backside
Grant 8,531,046 - Pratt , et al. September 10, 2 | 2013-09-10 |
Semiconductor With Through-substrate Interconnect
App 20130221446 - Kirby; Kyle K. ; et al. | 2013-08-29 |
Disabling Electrical Connections Using Pass-through 3d Interconnects And Associated Systems And Methods
App 20130214421 - Janzen; Jeffery W. ; et al. | 2013-08-22 |
Through-wafer interconnects for photoimager and memory wafers
Grant 8,502,353 - Akram , et al. August 6, 2 | 2013-08-06 |
Methods of processing semiconductor substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded thereto
Grant 8,503,156 - Ray , et al. August 6, 2 | 2013-08-06 |
Interconnect regions
Grant 8,410,612 - Kirby , et al. April 2, 2 | 2013-04-02 |
Disabling electrical connections using pass-through 3D interconnects and associated systems and methods
Grant 8,404,521 - Janzen , et al. March 26, 2 | 2013-03-26 |
Semiconductor with through-substrate interconnect
Grant 8,404,587 - Kirby , et al. March 26, 2 | 2013-03-26 |
Interconnect Regions
App 20120326283 - Kirby; Kyle K. ; et al. | 2012-12-27 |
Disabling Electrical Connections Using Pass-through 3d Interconnects And Associated Systems And Methods
App 20120309128 - Janzen; Jeffery W. ; et al. | 2012-12-06 |
Methods of forming conductive vias
Grant 8,324,100 - Akram , et al. December 4, 2 | 2012-12-04 |
Microelectronic Devices With Through-silicon Vias And Associated Methods Of Manufacturing
App 20120267786 - Kirby; Kyle K. ; et al. | 2012-10-25 |
Methods for fabricating and filling conductive vias and conductive vias so formed
Grant 8,294,273 - Akram , et al. October 23, 2 | 2012-10-23 |
Interconnect regions
Grant 8,283,785 - Kirby , et al. October 9, 2 | 2012-10-09 |
Disabling electrical connections using pass-through 3D interconnects and associated systems and methods
Grant 8,253,230 - Janzen , et al. August 28, 2 | 2012-08-28 |
Microelectronic Devices And Methods For Filing Vias In Microelectronic Devices
App 20120094482 - Hiatt; William M. ; et al. | 2012-04-19 |
Pass-through 3d Interconnect For Microelectronic Dies And Associated Systems And Methods
App 20120094443 - Pratt; David S. ; et al. | 2012-04-19 |
Interconnect Regions
App 20120068348 - Kirby; Kyle K. ; et al. | 2012-03-22 |
Semiconductor Substrates With Unitary Vias And Via Terminals, And Associated Systems And Methods
App 20120009776 - Kirby; Kyle K. ; et al. | 2012-01-12 |
Packaged Microelectronic Imagers And Methods Of Packaging Microelectronic Imagers
App 20120009717 - Kirby; Kyle K. ; et al. | 2012-01-12 |
Microelectronic devices and methods for filling vias in microelectronic devices
Grant 8,084,866 - Hiatt , et al. December 27, 2 | 2011-12-27 |
Pass-through 3D interconnect for microelectronic dies and associated systems and methods
Grant 8,084,854 - Pratt , et al. December 27, 2 | 2011-12-27 |
Semiconductor Device Fabrication Methods
App 20110287572 - Kirby; Kyle K. ; et al. | 2011-11-24 |
Packaged microelectronic imagers and methods of packaging microelectronic imagers
Grant 8,053,857 - Akram , et al. November 8, 2 | 2011-11-08 |
Methods of Processing Semiconductor Substrates, Electrostatic Carriers for Retaining Substrates for Processing, and Assemblies Comprising Electrostatic Carriers Having Substrates Electrostatically Bonded Thereto
App 20110253042 - Ray; Dewali ; et al. | 2011-10-20 |
Packaged microelectronic imagers and methods of packaging microelectronic imagers
Grant 8,035,179 - Kirby , et al. October 11, 2 | 2011-10-11 |
Semiconductor substrates with unitary vias and via terminals, and associated systems and methods
Grant 8,030,780 - Kirby , et al. October 4, 2 | 2011-10-04 |
Imagers with contact plugs extending through the substrates thereof and imager fabrication methods
Grant 8,017,982 - Kirby , et al. September 13, 2 | 2011-09-13 |
Microelectronic Devices With Through-substrate Interconnects And Associated Methods Of Manufacturing
App 20110193226 - Kirby; Kyle K. ; et al. | 2011-08-11 |
Microelectronic imagers with optical devices having integral reference features and methods for manufacturing such microelectronic imagers
Grant 7,993,944 - Oliver , et al. August 9, 2 | 2011-08-09 |
Methods of processing substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded thereto
Grant 7,989,022 - Ray , et al. August 2, 2 | 2011-08-02 |
Support structure for use in thinning semiconductor substrates and for supporting thinned semiconductor substrates
Grant 7,960,829 - Wood , et al. June 14, 2 | 2011-06-14 |
Methods Of Forming Conductive Vias
App 20110136336 - Akram; Salman ; et al. | 2011-06-09 |
Through-wafer interconnects for photoimager and memory wafers
Grant 7,956,443 - Akram , et al. June 7, 2 | 2011-06-07 |
Methods For Fabricating And Filling Conductive Vias And Conductive Vias So Formed
App 20110095429 - Akram; Salman ; et al. | 2011-04-28 |
Packaged Microelectronic Imagers And Methods Of Packaging Microelectronic Imagers
App 20110089539 - Akram; Salman ; et al. | 2011-04-21 |
Methods for protecting imaging elements of photoimagers during back side processing
Grant 7,919,348 - Akram , et al. April 5, 2 | 2011-04-05 |
Methods for placing substrates in contact with molten solder
Grant 7,918,383 - Kirby , et al. April 5, 2 | 2011-04-05 |
Method Of Forming Vias In Semiconductor Substrates And Resulting Structures
App 20110074043 - Watkins; Charles M. ; et al. | 2011-03-31 |
Microfeature workpieces and methods for forming interconnects in microfeature workpieces
Grant 7,915,736 - Kirby , et al. March 29, 2 | 2011-03-29 |
Vias And Conductive Routing Layers In Semiconductor Substrates
App 20110042821 - Kirby; Kyle K. ; et al. | 2011-02-24 |
Methods for fabricating and filling conductive vias and conductive vias so formed
Grant 7,892,972 - Akram , et al. February 22, 2 | 2011-02-22 |
Packaged microelectronic imagers and methods of packaging microelectronic imagers
Grant 7,858,429 - Akram , et al. December 28, 2 | 2010-12-28 |
Method of forming vias in semiconductor substrates and resulting structures
Grant 7,855,140 - Watkins , et al. December 21, 2 | 2010-12-21 |
Methods for releasably attaching support members to microfeature workpieces and microfeature assemblies formed using such methods
Grant 7,833,601 - Kirby , et al. November 16, 2 | 2010-11-16 |
Microelectronic devices and methods for forming interconnects in microelectronic devices
Grant 7,829,976 - Kirby , et al. November 9, 2 | 2010-11-09 |
Image sensor packages and frame structure thereof
Grant 7,791,184 - Wood , et al. September 7, 2 | 2010-09-07 |
Microelectronics devices, having vias, and packaged microelectronic devices having vias
Grant 7,759,800 - Rigg , et al. July 20, 2 | 2010-07-20 |
Microelectronic workpieces and methods and systems for forming interconnects in microelectronic workpieces
Grant 7,749,899 - Clark , et al. July 6, 2 | 2010-07-06 |
Methods for thinning semiconductor substrates that employ support structures formed on the substrates
Grant 7,713,841 - Wood , et al. May 11, 2 | 2010-05-11 |
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
Grant 7,709,776 - Farnworth , et al. May 4, 2 | 2010-05-04 |
Semiconductor Substrates With Unitary Vias And Via Terminals, And Associated Systems And Methods
App 20100096759 - Kirby; Kyle K. ; et al. | 2010-04-22 |
Semiconductor devices and in-process semiconductor devices having conductor filled vias
Grant 7,701,039 - Kirby , et al. April 20, 2 | 2010-04-20 |
Through-wafer interconnects for photoimager and memory wafers
Grant 7,683,458 - Akram , et al. March 23, 2 | 2010-03-23 |
Compliant spring contact structures
Grant 7,649,145 - Kirby , et al. January 19, 2 | 2010-01-19 |
Vias having varying diameters and fills for use with a semiconductor device and methods of forming semiconductor device structures including same
Grant 7,648,900 - Kirby January 19, 2 | 2010-01-19 |
Frame structure and semiconductor attach process for use therewith for fabrication of image sensor packages and the like, and resulting packages
Grant 7,645,635 - Wood , et al. January 12, 2 | 2010-01-12 |
Methods For Protecting Imaging Elements Of Photoimagers During Back Side Processing, Photoimagers And Systems
App 20090309176 - Akram; Salman ; et al. | 2009-12-17 |
Disabling Electrical Connections Using Pass-through 3d Interconnects And Associated Systems And Methods
App 20090283898 - Janzen; Jeffery W. ; et al. | 2009-11-19 |
Method of forming vias in semiconductor substrates without damaging active regions thereof and resulting structures
Grant 7,598,167 - Watkins , et al. October 6, 2 | 2009-10-06 |
Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods
Grant 7,589,008 - Kirby September 15, 2 | 2009-09-15 |
Packaged Microelectronic Imagers And Methods Of Packaging Microelectronic Imagers
App 20090189238 - Kirby; Kyle K. ; et al. | 2009-07-30 |
Microelectronic Devices And Methods For Forming Interconnects In Microelectronic Devices
App 20090191701 - Kirby; Kyle K. ; et al. | 2009-07-30 |
Pass-through 3d Interconnect For Microelectronic Dies And Associated Systems And Methods
App 20090166846 - Pratt; David S. ; et al. | 2009-07-02 |
Microelectronic Imagers With Optical Devices And Methods Of Manufacturing Such Microelectronic Imagers
App 20090155949 - Farnworth; Warren M. ; et al. | 2009-06-18 |
Semiconductor device assemblies with compliant spring contact structures
Grant 7,547,850 - Kirby , et al. June 16, 2 | 2009-06-16 |
Microelectronic devices and methods for forming interconnects in microelectronic devices
Grant 7,531,453 - Kirby , et al. May 12, 2 | 2009-05-12 |
Semiconductor components and assemblies including vias of varying lateral dimensions
Grant 7,528,491 - Kirby , et al. May 5, 2 | 2009-05-05 |
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
Grant 7,504,615 - Farnworth , et al. March 17, 2 | 2009-03-17 |
Packaged microelectronic imagers and methods of packaging microelectronic imagers
Grant 7,498,647 - Kirby , et al. March 3, 2 | 2009-03-03 |
Semiconductor component having plate, stacked dice and conductive vias
Grant 7,498,675 - Farnworth , et al. March 3, 2 | 2009-03-03 |
Methods of forming conductive vias and methods of forming multichip modules including such conductive vias
Grant 7,495,316 - Kirby , et al. February 24, 2 | 2009-02-24 |
Compliant contact pin assembly and card system
Grant 7,488,899 - Kirby , et al. February 10, 2 | 2009-02-10 |
Methods of Processing Substrates, Electrostatic Carriers for Retaining Substrates for Processing, and Assemblies Comprising Electrostatic Carriers Having Substrates Electrostatically Bonded Thereto
App 20090022901 - Ray; Dewali ; et al. | 2009-01-22 |
Methods For Forming Interconnects In Microelectronic Workpieces And Microelectronic Workpieces Formed Using Such Methods
App 20090008780 - Kirby; Kyle K. | 2009-01-08 |
Microelectronic Imagers With Optical Devices Having Integral Reference Features And Methods For Manufacturing Such Microelectronic Imagers
App 20080318353 - Oliver; Steven D. ; et al. | 2008-12-25 |
Imagers With Contact Plugs Extending Through The Substrates Thereof And Imager Fabrication Methods
App 20080308893 - Kirby; Kyle K. ; et al. | 2008-12-18 |
Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts
Grant 7,459,393 - Farnworth , et al. December 2, 2 | 2008-12-02 |
Wafer Level Lens Arrays For Image Sensor Packages And The Like, Image Sensor Packages, And Related Methods
App 20080290435 - Oliver; Steve ; et al. | 2008-11-27 |
Compliant contact structure
Grant 7,456,639 - Watkins , et al. November 25, 2 | 2008-11-25 |
Microelectronic imaging units and methods of manufacturing microelectronic imaging units at the wafer level
Grant 7,452,743 - Oliver , et al. November 18, 2 | 2008-11-18 |
Test system for semiconductor components having conductive spring contacts
Grant 7,449,910 - Kirby , et al. November 11, 2 | 2008-11-11 |
Microelectronic imagers with optical devices having integral reference features and methods for manufacturing such microelectronic imagers
Grant 7,429,494 - Oliver , et al. September 30, 2 | 2008-09-30 |
Methods for forming interconnects in vias and microelectronic workpieces including such interconnects
Grant 7,425,499 - Oliver , et al. September 16, 2 | 2008-09-16 |
Microelectronic imagers and methods of packaging microelectronic imagers
Grant 7,419,841 - Farnworth , et al. September 2, 2 | 2008-09-02 |
Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices
Grant 7,413,979 - Rigg , et al. August 19, 2 | 2008-08-19 |
Method for fabricating an interconnect for semiconductor components
Grant 7,409,762 - Kirby August 12, 2 | 2008-08-12 |
Methods of fabricating interconnects for semiconductor components
Grant 7,410,898 - Kirby , et al. August 12, 2 | 2008-08-12 |
Semiconductor interconnect having conductive spring contacts
Grant 7,411,304 - Kirby , et al. August 12, 2 | 2008-08-12 |
Compliant contact pin assembly and card system
Grant 7,394,267 - Kirby , et al. July 1, 2 | 2008-07-01 |
Method for fabricating semiconductor components with conductive spring contacts
Grant 7,391,117 - Kirby , et al. June 24, 2 | 2008-06-24 |
Method of forming compliant contact structures
Grant 7,389,581 - Watkins , et al. June 24, 2 | 2008-06-24 |
Microelectronic Devices And Methods For Forming Interconnects In Microelectronic Devices
App 20080138973 - Kirby; Kyle K. ; et al. | 2008-06-12 |
Systems and methods for testing microfeature devices
Grant 7,385,412 - Akram , et al. June 10, 2 | 2008-06-10 |
Methods for forming vias varying lateral dimensions
Grant 7,378,342 - Kirby , et al. May 27, 2 | 2008-05-27 |
Vias Having Varying Diameters And Fills For Use With A Semiconductor Device And Methods Of Forming Semiconductor Device Structures Including Same
App 20080119043 - Kirby; Kyle K. | 2008-05-22 |
Method for creating electrical pathways for semiconductor device structures using laser machining processes
Grant 7,364,985 - Kirby April 29, 2 | 2008-04-29 |
Method of testing using compliant contact structures, contactor cards and test system
Grant 7,363,694 - Watkins , et al. April 29, 2 | 2008-04-29 |
Contact pin assembly and contactor card
Grant 7,358,751 - Kirby , et al. April 15, 2 | 2008-04-15 |
Methods of selectively removing silicon
Grant 7,354,863 - Kirby , et al. April 8, 2 | 2008-04-08 |
Substrate, semiconductor die, multichip module, and system including a via structure comprising a plurality of conductive elements
Grant 7,355,267 - Kirby , et al. April 8, 2 | 2008-04-08 |
Vias having varying diameters and fills for use with a semiconductor device and methods of forming semiconductor device structures including same
Grant 7,348,671 - Kirby March 25, 2 | 2008-03-25 |
Semiconductor wafers including one or more reinforcement structures and methods of forming the same
Grant 7,332,413 - Kirby February 19, 2 | 2008-02-19 |
Microelectronic devices and methods for forming interconnects in microelectronic devices
Grant 7,329,943 - Kirby , et al. February 12, 2 | 2008-02-12 |
Methods Of Forming Conductive Vias And Methods Of Forming Multichip Modules Including Such Conductive Vias
App 20080029851 - Kirby; Kyle K. ; et al. | 2008-02-07 |
Packaged Microelectronic Imagers And Methods Of Packaging Microelectronic Imagers
App 20080020505 - Akram; Salman ; et al. | 2008-01-24 |
Methods For Placing Substrates In Contact With Molten Solder
App 20080011815 - Kirby; Kyle K. ; et al. | 2008-01-17 |
Method for fabricating a semiconductor interconnect having conductive spring contacts
Grant 7,314,821 - Kirby , et al. January 1, 2 | 2008-01-01 |
Microelectronic workpieces and methods and systems for forming interconnects in microelectronic workpieces
App 20070281473 - Clark; Douglas ; et al. | 2007-12-06 |
Microfeature Workpieces And Methods For Forming Interconnects In Microfeature Workpieces
App 20070267754 - Kirby; Kyle K. ; et al. | 2007-11-22 |
Method of making contact pin card system
Grant 7,297,563 - Kirby , et al. November 20, 2 | 2007-11-20 |
Method Of Forming Vias In Semiconductor Substrates And Resulting Structures
App 20070262464 - Watkins; Charles M. ; et al. | 2007-11-15 |
Packaged microelectronic imagers and methods of packaging microelectronic imagers
Grant 7,294,897 - Akram , et al. November 13, 2 | 2007-11-13 |
Compliant contact pin test assembly and methods thereof
Grant 7,288,954 - Kirby , et al. October 30, 2 | 2007-10-30 |
Methods of forming a contact pin assembly
Grant 7,287,326 - Kirby , et al. October 30, 2 | 2007-10-30 |
Methods of manufacture of a via structure comprising a plurality of conductive elements and methods of forming multichip modules including such via structures
Grant 7,282,784 - Kirby , et al. October 16, 2 | 2007-10-16 |
Compliant contact pin assembly, card system and methods thereof
Grant 7,282,932 - Kirby , et al. October 16, 2 | 2007-10-16 |
Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods
Grant 7,271,482 - Kirby September 18, 2 | 2007-09-18 |
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
Grant 7,265,330 - Farnworth , et al. September 4, 2 | 2007-09-04 |
Microfeature workpieces and methods for forming interconnects in microfeature workpieces
Grant 7,262,134 - Kirby , et al. August 28, 2 | 2007-08-28 |
Methods for fabricating and filling conductive vias and conductive vias so formed
App 20070184654 - Akram; Salman ; et al. | 2007-08-09 |
Packaged microelectronic imagers and methods of packaging microelectronic imagers
Grant 7,253,397 - Kirby August 7, 2 | 2007-08-07 |
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
App 20070170350 - Farnworth; Warren M. ; et al. | 2007-07-26 |
Wafer reinforcement structure and methods of fabrication
Grant 7,244,663 - Kirby July 17, 2 | 2007-07-17 |
Methods of fabricating interconnects for semiconductor components
App 20070141835 - Kirby; Kyle K. ; et al. | 2007-06-21 |
Microelectronic devices and methods for forming interconnects in microelectronic devices
Grant 7,232,754 - Kirby , et al. June 19, 2 | 2007-06-19 |
Semiconductor component having plate, stacked dice and conductive vias
App 20070132104 - Farnworth; Warren M. ; et al. | 2007-06-14 |
Semiconductor component having plate and stacked dice
Grant 7,224,051 - Farnworth , et al. May 29, 2 | 2007-05-29 |
Microfeature dies with porous regions, and associated methods and systems
App 20070099397 - Kirby; Kyle K. ; et al. | 2007-05-03 |
Microelectronic imagers and methods of packaging microelectronic imagers
Grant 7,199,439 - Farnworth , et al. April 3, 2 | 2007-04-03 |
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
Grant 7,189,954 - Farnworth , et al. March 13, 2 | 2007-03-13 |
Methods of fabricating interconnects including depositing a first material in the interconnect with a thickness of angstroms and a low temperature for semiconductor components
Grant 7,189,642 - Kirby , et al. March 13, 2 | 2007-03-13 |
Microfeature workpieces and methods for forming interconnects in microfeature workpieces
App 20070045858 - Kirby; Kyle K. ; et al. | 2007-03-01 |
Microelectronic imaging units and methods of manufacturing microelectronic imaging units at the wafer level
App 20070045632 - Oliver; Steven D. ; et al. | 2007-03-01 |
Methods for releasably attaching support members to microfeature workpieces and microfeature assemblies formed using such methods
App 20070036932 - Kirby; Kyle K. ; et al. | 2007-02-15 |
Methods for releasably attaching support members to microfeature workpieces and microfeature assemblies formed using such methods
Grant 7,169,248 - Kirby , et al. January 30, 2 | 2007-01-30 |
Methods For Releasably Attaching Support Members To Microfeature Workpieces And Microfeature Assemblies Formed Using Such Methods
App 20070017630 - Kirby; Kyle K. ; et al. | 2007-01-25 |
Semiconductor components and assemblies including vias of varying lateral dimensions
App 20070001168 - Kirby; Kyle K. ; et al. | 2007-01-04 |
Semiconductor wafers including one or more reinforcement structures and methods of forming the same
App 20070004173 - Kirby; Kyle K. | 2007-01-04 |
Systems and methods for testing microelectronic imagers and microfeature devices
Grant 7,148,715 - Akram , et al. December 12, 2 | 2006-12-12 |
Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts
App 20060270108 - Farnworth; Warren M. ; et al. | 2006-11-30 |
Methods of forming semiconductor devices and electrical interconnect structures in semiconductor devices and intermediate structures formed thereby
App 20060270196 - Kirby; Kyle K. | 2006-11-30 |
Microelectronic imagers and methods of packaging microelectronic imagers
App 20060261340 - Farnworth; Warren M. ; et al. | 2006-11-23 |
Microelectronic devices, methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices
App 20060264041 - Rigg; Sidney B. ; et al. | 2006-11-23 |
Etch solution for selectively removing silicon
App 20060255316 - Kirby; Kyle K. ; et al. | 2006-11-16 |
Systems and methods for testing microelectronic imagers and microfeature devices
App 20060255826 - Akram; Salman ; et al. | 2006-11-16 |
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
App 20060243889 - Farnworth; Warren M. ; et al. | 2006-11-02 |
Fabrication of compliant spring contact structures and use thereof
App 20060242828 - Kirby; Kyle K. ; et al. | 2006-11-02 |
Semiconductor device assemblies with compliant spring contact structures
App 20060243483 - Kirby; Kyle K. ; et al. | 2006-11-02 |
Compliant contact pin test assembly and methods thereof
App 20060244475 - Kirby; Kyle K. ; et al. | 2006-11-02 |
Substrate, semiconductor die, multichip module, and system including a via structure comprising a plurality of conductive elements
Grant 7,129,567 - Kirby , et al. October 31, 2 | 2006-10-31 |
Microelectronic devices, methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices
App 20060216862 - Rigg; Sidney B. ; et al. | 2006-09-28 |
Through-substrate interconnect fabrication methods
Grant 7,109,068 - Akram , et al. September 19, 2 | 2006-09-19 |
Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods
App 20060205211 - Kirby; Kyle K. | 2006-09-14 |
Microelectronic devices and methods for forming interconnects in microelectronic devices
App 20060199363 - Kirby; Kyle K. ; et al. | 2006-09-07 |
Methods of plating via interconnects
Grant 7,101,792 - Kirby , et al. September 5, 2 | 2006-09-05 |
Image sensor packages and frame structure thereof
App 20060192230 - Wood; Alan G. ; et al. | 2006-08-31 |
Method for fabricating an interconnect for semiconductor components
App 20060181295 - Kirby; Kyle K. | 2006-08-17 |
Semiconductor devices and in-process semiconductor devices having conductor filled vias
App 20060180940 - Kirby; Kyle K. ; et al. | 2006-08-17 |
Substrate, semiconductor die, multichip module, and system including a via structure comprising a plurality of conductive elements
App 20060180941 - Kirby; Kyle K. ; et al. | 2006-08-17 |
Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices
Grant 7,091,124 - Rigg , et al. August 15, 2 | 2006-08-15 |
Microelectronic workpieces and methods for forming interconnects in microelectronic workpieces
App 20060177999 - Hembree; David R. ; et al. | 2006-08-10 |
Through-substrate interconnect structures and assemblies
App 20060170110 - Akram; Salman ; et al. | 2006-08-03 |
Vias having varying diameters and fills for use with a semiconductor device and methods of forming semiconductor device structures including same
App 20060166498 - Kirby; Kyle K. | 2006-07-27 |
Semiconductor interconnect having semiconductor spring contacts
Grant 7,078,922 - Kirby July 18, 2 | 2006-07-18 |
Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods
App 20060148250 - Kirby; Kyle K. | 2006-07-06 |
Semiconductor interconnect having dome shaped conductive spring contacts
App 20060145353 - Kirby; Kyle K. ; et al. | 2006-07-06 |
Methods of fabricating interconnects for semiconductor components including a through hole entirely through the component and forming a metal nitride including separate precursor cycles
Grant 7,071,098 - Kirby , et al. July 4, 2 | 2006-07-04 |
Method of testing using compliant contact structures, contactor cards and test system
App 20060137171 - Watkins; Charles M. ; et al. | 2006-06-29 |
Methods of coating and singulating wafers
Grant 7,064,010 - Farnworth , et al. June 20, 2 | 2006-06-20 |
Test system for semiconductor components having conductive spring contacts
App 20060125107 - Kirby; Kyle K. ; et al. | 2006-06-15 |
Compliant contact structure
App 20060125500 - Watkins; Charles M. ; et al. | 2006-06-15 |
Methods of manufacture of a via structure comprising a plurality of conductive elements and methods of forming multichip modules including such via structures
App 20060125109 - Kirby; Kyle K. ; et al. | 2006-06-15 |
Method for fabricating semiconductor components with conductive spring contacts
App 20060125106 - Kirby; Kyle K. ; et al. | 2006-06-15 |
Wafer level methods for fabricating multi-dice chip scale semiconductor components
Grant 7,060,526 - Farnworth , et al. June 13, 2 | 2006-06-13 |
Semiconductor component having plate and stacked dice
App 20060113682 - Farnworth; Warren M. ; et al. | 2006-06-01 |
Interconnect having spring contacts
Grant 7,053,641 - Kirby May 30, 2 | 2006-05-30 |
Semiconductor interconnect having compliant conductive contacts
Grant 7,042,080 - Kirby , et al. May 9, 2 | 2006-05-09 |
Chip-scale packages
App 20060081966 - Farnworth; Warren M. ; et al. | 2006-04-20 |
Compliant contract structures, contactor cards and test system including same
Grant 7,030,632 - Watkins , et al. April 18, 2 | 2006-04-18 |
Wafer reinforcement structure and methods of fabrication
App 20060046438 - Kirby; Kyle K. | 2006-03-02 |
Through-substrate interconnect fabrication methods and resulting structures and assemblies
App 20060046468 - Akram; Salman ; et al. | 2006-03-02 |
Method of forming vias in semiconductor substrates without damaging active regions thereof and resulting structures
App 20060046463 - Watkins; Charles M. ; et al. | 2006-03-02 |
Microfeature dies with porous regions, and associated methods and systems
App 20060043534 - Kirby; Kyle K. ; et al. | 2006-03-02 |
Methods for forming interconnects in vias and microelectronic workpieces including such interconnects
App 20060042952 - Oliver; Steven D. ; et al. | 2006-03-02 |
Microelectronic imagers with optical devices having integral reference features and methods for manufacturing such microelectronic imagers
App 20060043512 - Oliver; Steven D. ; et al. | 2006-03-02 |
Methods and apparatus for placing substrates in contact with molten solder
App 20060043154 - Kirby; Kyle K. ; et al. | 2006-03-02 |
Methods of manufacture of a via structure comprising a plurality of conductive elements, semiconductor die, multichip module, and system including same
App 20060043598 - Kirby; Kyle K. ; et al. | 2006-03-02 |
Methods for forming vias of varying lateral dimensions and semiconductor components and assemblies including same
App 20060046471 - Kirby; Kyle K. ; et al. | 2006-03-02 |
Frame structure and semiconductor attach process for use therewith for fabrication of image sensor packages and the like, and resulting packages
App 20060035415 - Wood; Alan G. ; et al. | 2006-02-16 |
Methods of forming via plugs using an aerosol stream of particles to deposit conductive material
Grant 6,998,345 - Kirby February 14, 2 | 2006-02-14 |
Multi-dice chip scale semiconductor components
Grant 6,998,717 - Farnworth , et al. February 14, 2 | 2006-02-14 |
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
App 20060011809 - Farnworth; Warren M. ; et al. | 2006-01-19 |
Materials for use in programmed material consolidation processes
App 20060008739 - Wood; Alan G. ; et al. | 2006-01-12 |
Methods for optimizing physical characteristics of selectively consolidatable materials
App 20060003255 - Wood; Alan G. ; et al. | 2006-01-05 |
Assemblies including semiconductor substrates of reduced thickness and support structures therefor
App 20060003549 - Wood; Alan G. ; et al. | 2006-01-05 |
Support structure for use in thinning semiconductor substrates and for supporting thinned semiconductor substrates
App 20060001139 - Wood; Alan G. ; et al. | 2006-01-05 |
Test system and test method with interconnect having semiconductor spring contacts
Grant 6,982,565 - Kirby January 3, 2 | 2006-01-03 |
Packaged microelectronic imagers and methods of packaging microelectronic imagers
App 20050285154 - Akram, Salman ; et al. | 2005-12-29 |
Microelectronic devices and methods for forming interconnects in microelectronic devices
App 20050287783 - Kirby, Kyle K. ; et al. | 2005-12-29 |
Compliant spring contacts, methods of making, and utilization as electrical contacts in probe card and flip-chip applications
App 20050279530 - Kirby, Kyle K. ; et al. | 2005-12-22 |
Compliant contact pin assembly and card system
App 20050275084 - Kirby, Kyle K. ; et al. | 2005-12-15 |
Packaged microelectronic imagers and methods of packging microelectronic imagers
App 20050275049 - Kirby, Kyle K. ; et al. | 2005-12-15 |
Microelectronic imagers and methods of packaging microelectronic imagers
App 20050275048 - Farnworth, Warren M. ; et al. | 2005-12-15 |
Compliant contact pin assembly and card system
App 20050275083 - Kirby, Kyle K. ; et al. | 2005-12-15 |
Systems and methods for testing microelectronic imagers and microfeature devices
App 20050270055 - Akram, Salman ; et al. | 2005-12-08 |
Compliant contact pin assembly and card system
App 20050230809 - Kirby, Kyle K. ; et al. | 2005-10-20 |
Compliant contact pin assembly and card system
App 20050230811 - Kirby, Kyle K. ; et al. | 2005-10-20 |
Compliant contact pin assembly and card system
App 20050230810 - Kirby, Kyle K. ; et al. | 2005-10-20 |
Method of making contact pin card system
App 20050233482 - Kirby, Kyle K. ; et al. | 2005-10-20 |
Methods of forming a contact pin assembly
App 20050229393 - Kirby, Kyle K. ; et al. | 2005-10-20 |
Interconnect Having Spring Contacts
App 20050225344 - Kirby, Kyle K. | 2005-10-13 |
Etch solution for selectively removing silicon and methods of selectively removing silicon
App 20050208766 - Kirby, Kyle K. ; et al. | 2005-09-22 |
Compliant contact structures, contactor cards and test system including same, and methods of fabrication and use
App 20050202576 - Watkins, Charles M. ; et al. | 2005-09-15 |
Methods of fabricating interconnects for semiconductor components including plating solder-wetting material and solder filling
Grant 6,943,106 - Kirby , et al. September 13, 2 | 2005-09-13 |
Compliant contact pin assembly, card system and methods thereof
App 20050194180 - Kirby, Kyle K. ; et al. | 2005-09-08 |
Methods of fabricating interconnects for semiconductor components
App 20050186770 - Kirby, Kyle K. ; et al. | 2005-08-25 |
Packaged microelectronic imagers and methods of packaging microelectronic imagers
App 20050184219 - Kirby, Kyle K. | 2005-08-25 |
Methods of fabricating interconnects for semiconductor components
App 20050186777 - Kirby, Kyle K. ; et al. | 2005-08-25 |
Methods Of Fabricating Interconnects For Semiconductor Components
App 20050186790 - Kirby, Kyle K. ; et al. | 2005-08-25 |
Systems and methods of plating via interconnects
App 20050178657 - Kirby, Kyle K. ; et al. | 2005-08-18 |
Probe card for use with microelectronic components, and methods for making same
Grant 6,924,655 - Kirby August 2, 2 | 2005-08-02 |
Method for fabricating a semiconductor interconnect having conductive spring contacts
App 20050146047 - Kirby, Kyle K. ; et al. | 2005-07-07 |
Microelectronic devices and methods for filling vias in microelectronic devices
App 20050127478 - Hiatt, William M. ; et al. | 2005-06-16 |
Semiconductor interconnect having semiconductor spring contacts
App 20050127928 - Kirby, Kyle K. | 2005-06-16 |
Semiconductor interconnect having conductive spring contacts
App 20050116351 - Kirby, Kyle K. ; et al. | 2005-06-02 |
Microelectronic devices, methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices
App 20050104228 - Rigg, Sidney B. ; et al. | 2005-05-19 |
Methods of forming via plugs using an aerosol stream of particles to deposit conductive material
App 20050101129 - Kirby, Kyle K. | 2005-05-12 |
Methods of coating and singulating wafers and chip-scale packages formed therefrom
App 20050082651 - Farnworth, Warren M. ; et al. | 2005-04-21 |
Methods Of Plating Via Interconnects
App 20050077630 - Kirby, Kyle K. ; et al. | 2005-04-14 |
Compliant contact structures, contactor cards and test system including same, and methods of fabrication and use
App 20050077913 - Watkins, Charles M. ; et al. | 2005-04-14 |
Method for creating electrical pathways for semiconductor device structures using laser machining processes
App 20050070092 - Kirby, Kyle K. | 2005-03-31 |
Support structure for thinning semiconductor substrates and thinning methods employing the support structure
App 20050064681 - Wood, Alan G. ; et al. | 2005-03-24 |
Multi-dice chip scale semiconductor components
App 20050046038 - Farnworth, Warren M. ; et al. | 2005-03-03 |
Probe Card For Use With Microelectronic Components,and Methods For Making Same
App 20050046431 - Kirby, Kyle K. | 2005-03-03 |
Methods of forming via plugs using an aerosol stream of particles to deposit conductive materials
Grant 6,855,631 - Kirby February 15, 2 | 2005-02-15 |
Semiconductor interconnect having conductive spring contacts, method of fabrication, and test systems incorporating the interconnect
App 20050012221 - Kirby, Kyle K. ; et al. | 2005-01-20 |
Multi-dice chip scale semiconductor components and wafer level methods of fabrication
Grant 6,841,883 - Farnworth , et al. January 11, 2 | 2005-01-11 |
Methods for forming via plugs
App 20050003658 - Kirby, Kyle K. | 2005-01-06 |
Multi-dice Chip Scale Semiconductor Components And Wafer Level Methods Of Fabrication
App 20040256734 - Farnworth, Warren M. ; et al. | 2004-12-23 |
Triple-attribute method of encoding and decoding magnetic data
Grant 6,819,512 - Kirby November 16, 2 | 2004-11-16 |
Wafer level methods for fabricating multi-dice chip scale semiconductor components
App 20040188819 - Farnworth, Warren M. ; et al. | 2004-09-30 |
Semiconductor interconnect having semiconductor spring contacts, test systems incorporating the interconnect and test methods using the interconnect
App 20040174176 - Kirby, Kyle K. | 2004-09-09 |
Ramp-lock fitting device
Grant 6,641,175 - Kirby November 4, 2 | 2003-11-04 |
Ramp-lock fitting device
Grant 6,422,607 - Kirby July 23, 2 | 2002-07-23 |
Coupling fitting
Grant 6,299,215 - Kirby October 9, 2 | 2001-10-09 |
Ramp-lock lifting device
Grant 6,250,688 - Kirby June 26, 2 | 2001-06-26 |
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